Abstract: In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 ?s and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.

Abstract: In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to 200 ?s and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape. The laser beam operates at a frequency of more than 67 Hz, and the spot of the laser beam is sequentially moved to different drilling positions for each pulse. After all of many drilling positions in the range of a scan vision are irradiated with the laser beam pulse by pulse, or after the elapse of a time of 15 ms or more from irradiation of the first drilling position, the laser spot is returned to the first drilling position. The spot is sequentially moved once again, and the movement is repeated several times.

Abstract: In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 &mgr;s and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.

Abstract: In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 &mgr;s and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.

Abstract: In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 &mgr;s and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.

Abstract: A laser machining apparatus according to the present invention describes characteristics of a laser oscillator with a function including laser power, pulse frequency and duty ratio, computes a command for a power supply unit in a feed forward control section according to a command based on the function and on the power, duty ratio and frequency, computes a command for a power supply unit in the feedback control section from a power command value and a power measurement value from the power sensor, and inputs these command to the power supply unit. Also the laser machining apparatus detects changes in characteristics in the laser oscillator and corrects the function for characteristics of the laser oscillator.

Abstract: A laser beam machining apparatus including an image-transfer optical system having a mask inserted in an optical path between a laser oscillator and a workpiece, and a lens for reducing and forming an image of the mask on a processing surface; a focusing optical system; a drive unit for selecting one of the image-transfer optical system and the focusing optical system; and a numerical controller for controlling the image-transfer optical system, the focusing optical system, and the drive unit, wherein one of the image-transfer optical system and the focusing optical system is selected in correspondence with the diameter and depth of a hole to be processed.

Abstract: A laser machining apparatus according to the present invention describes characteristics of a laser oscillator with a function including laser power, pulse frequency and duty ratio, computes a command for a power supply unit in a feed forward control section according to a command based on the function and on the power, duty ratio and frequency, computes a command for a power supply unit in the feedback control section from a power command value and a power measurement value from the power sensor, and inputs these command to the power supply unit. Also the laser machining apparatus detects changes in characteristics in the laser oscillator and corrects the function for characteristics of the laser oscillator.

Abstract: A laser oscillator is connected to a power supply device for supplying excitation power to the laser oscillator and a detector is connected to detect the intensity of a laser beam output by the laser oscillator. An apparatus is provided for measuring the resistance value of the detector. A control circuit is operative to provide constant laser power control in response to the detector output under normal conditions but when the output signal of the measuring apparatus indicates a failure, the constant laser output control is changed to the constant power control. The apparatus prevents a constant laser output control from being disabled and workpieces from being defective if the output detector property of a laser changes abruptly.

Abstract: A laser oscillator is connected to a power supply device for supplying excitation power to the laser oscillator and a detector is connected to detect the intensity of a laser beam output by the laser oscillator. An apparatus is provided for measuring the resistance value of the detector. A control circuit is operative to provide constant laser power control in response to the detector output under normal conditions but when the output signal of the measuring apparatus indicates a failure, the constant laser output control is changed to the constant power control. The apparatus prevents a constant laser output control from being disabled and workpieces from being defective if the output detector property of a laser changes abruptly.

Abstract: An apparatus for and a method of controlling a laser oscillator for use as a laser source in a machining operation or the like is disclosed. In particular, the present invention compensates for a deviation of an actual input/output characteristic of a laser oscillator from a normal (expected) input/output characteristic due to, for example, aging and the like. The present invention approximates the actual input/output characteristic and stores the characteristic as a pattern in a storage device. In response to a detection of the actual laser output and an external intensity command signal, the present invention refers to the input/output characteristic pattern thus approximated and generates an input intensity command signal for controlling the laser oscillator to accurately produce the desired laser beam intensity irrespective of the deviation between the actual input/output characteristic and the normal characteristic.