Abstract: The heat-dissipating composition according to the present invention comprises a polymer matrix and diamond particles. The present invention provides the heat-dissipating composition compatibly satisfying both electric insulativity and heat dissipativity.

Abstract: The terahertz-wave connector includes: a 2D-PC slab; lattice points periodically arranged in the 2D-PC slab, the lattice points for diffracting the THz waves in PBG frequencies of photonic band structure of the 2D-PC slab in order to prohibit existence in a plane of the 2D-PC slab; a 2D-PC waveguide disposed in the 2D-PC slab and formed with a line defect of the lattice points; and an adiabatic mode converter disposed at the edge face of the 2D-PC slab to which the 2D-PC waveguide extended, the 2D-PC waveguide extended to the adiabatic mode converter. There is provided also the THz-wave IC to which such a terahertz-wave connector is applied.

Abstract: The terahertz-wave connector includes: a 2D-PC slab; lattice points periodically arranged in the 2D-PC slab, the lattice points for diffracting the THz waves in PBG frequencies of photonic band structure of the 2D-PC slab in order to prohibit existence in a plane of the 2D-PC slab; a 2D-PC waveguide disposed in the 2D-PC slab and formed with a line defect of the lattice points; and an adiabatic mode converter disposed at the edge face of the 2D-PC slab to which the 2D-PC waveguide extended, the 2D-PC waveguide extended to the adiabatic mode converter. There is provided also the THz-wave IC to which such a terahertz-wave connector is applied.

Abstract: A thermally conductive adhesive composition contains a polymerizable (meth)acrylic compound (A) comprising at least one of a (meth)acrylic monomer and a (meth)acrylic oligomer, an organic peroxide (B), a thermally conductive filler (C) and a vanadium compound (D). The volume ratio ? of the polymerizable (meth)acrylic compound (A) to the thermally conductive filler (C) determined by the following formula (1) is 0.40 to 0.65. 40 to 100% by mass of the thermally conductive filler (C) is subjected to hydrophobic surface treatment.

Abstract: A mold product comprising liquid crystal composition for conducting heat. The liquid crystal composition contains liquid crystal polymer having an orientation degree ? obtained by equation 1 below: Orientation degree ?=(180???)/180 equation 1 In equation 1, ?? is a half width in the intensity distribution obtained by fixing peak scattering angle in X-ray diffraction measurement and by varying the azimuth angle from 0 to 360 degrees, and orientation degree ? is in a range between 0.5 and 1.0.

Abstract: A thermal conductive grease used for diffusion of heat generated in electronic appliances is provided. The thermal conductive grease comprises: (A) a base oil having a viscosity of 112 to 770 mm2 at 40° C. and comprising a copolymer of an unsaturated dicarboxylic acid dibutyl ester and an ?-olefin; and (B) a thermal conductive filler filled in the base oil. The thermal conductive grease does not include conventionally used silicone oil so that insulating substances will not be formed in the thermal conductive grease.

Abstract: A thermoplastic polymer composite formed article or a thermoplastic polymer composite formed article formed from a thermoplastic polymer or a thermoplastic polymer and a fiber, wherein the fiber is arranged along a first plane and the molecular chains of the thermoplastic polymer or thermoplastic polymer is oriented in the direction intersecting with the first plane, and the molecular chains of the thermoplastic polymer or thermoplastic polymer has a degree (a) of orientation in a range of 0.5 or more and less than 1.0, and wherein the thermal expansion coefficients of said formed article in the direction along the first plane and in the direction intersecting with the first plane are both 5×10?6 to 50×10?6 (/K), and the difference between the thermal expansion coefficient in the direction along the first plane and the thermal expansion coefficient in the direction intersecting with the first plane is 30×10?6 (/K) or less.

Abstract: A thermally conductive polymer molded article formed by molding a thermally conductive composition which comprises a liquid crystalline polymer and thermally conductive filler having magnetic anisotropy, wherein the liquid crystalline polymer and the thermally conductive filler are oriented in a predetermined direction by a magnetic field. The thermally conductive composition contains 100 parts by weight of the liquid crystalline polymer and 5 to 800 parts by weight of the thermally conductive filler having magnetic anisotropy. The thermally conductive filler has a thermal conductivity in at least one direction higher than the thermal conductivity of the liquid crystalline polymer.

Abstract: A thermal conductive polymer molded article is formed by molding a thermotropic liquid crystalline composition comprised mainly of a thermotropic liquid crystalline polymer, wherein the thermal conductive polymer molded article is formed by applying a magnetic field or an electric field to the thermotropic liquid crystalline composition melted by heating so that the thermal conductive polymer molded article has a first thermal conductivity (?1) higher than a second thermal conductivity (?2) of a molded article formed by molding the thermotropic liquid crystalline polymer without the application of the field. The thermal conductive polymer molded article preferably has a first thermal conductivity (?1) of between 0.7 and 20 W/(m·K). Preferably, the thermotropic liquid crystalline polymer comprises at least one polymer selected from (A) a wholly aromatic polyester and (B) a wholly aromatic polyester amide.

Abstract: A thermally-conductive epoxy resin molded article comprises an epoxy resin having molecular chains that contain an azomethine group (—CH═N—). The molded article has a thermal conductivity in a range of 0.5 to 30 W/(m·K). It is preferred that the molecular chains of the epoxy resin are oriented in a specific direction, and in that direction, the molded article has a thermal conductivity in a range of 0.5 to 30 W/(m·K). The thermally-conductive epoxy resin molded article is produced by applying a magnetic field to the epoxy resin composition to orient the molecular chains of the epoxy resin in a specific direction and then curing the epoxy resin composition.

Abstract: A thermally conductive polymer molded article formed by molding a thermally conductive composition which comprises a liquid crystalline polymer and thermally conductive filler having magnetic anisotropy, wherein the liquid crystalline polymer and the thermally conductive filler are oriented in a predetermined direction by a magnetic field. The thermally conductive composition contains 100 parts by weight of the liquid crystalline polymer and 5 to 800 parts by weight of the thermally conductive filler having magnetic anisotropy. The thermally conductive filler has a thermal conductivity in at least one direction higher than the thermal conductivity of the liquid crystalline polymer.

Abstract: A thermally-conductive epoxy resin molded article conducting heat generated from electronic components and the like, and a method of manufacturing the same are disclosed. The thermally-conductive epoxy resin molded article according to the present invention is obtained by curing an epoxy resin composition containing an epoxy resin. The epoxy resin contained in the thermally-conductive epoxy resin molded article has the degree of orientation &agr; equal to or larger than 0.5 and smaller than 1.0.

Abstract: A mold product comprising liquid crystal composition for conducting heat.

Abstract: A thermal conductive polymer molded article is formed by molding a thermotropic liquid crystalline composition comprised mainly of a thermotropic liquid crystalline polymer, wherein the thermal conductive polymer molded article is formed by applying a magnetic field or an electric field to the thermotropic liquid crystalline composition melted by heating so that the thermal conductive polymer molded article has a first thermal conductivity (&lgr;1) higher than a second thermal conductivity (&lgr;2) of a molded article formed by molding the thermotropic liquid crystalline polymer without the application of the field. The thermal conductive polymer molded article preferably has a first thermal conductivity (&lgr;1) of between 0.7 and 20 W/(m·K). Preferably, the thermotropic liquid crystalline polymer comprises at least one polymer selected from (A) a wholly aromatic polyester and (B) a wholly aromatic polyester amide.