Patents by Inventor Tsukasa ISHIMORI

Tsukasa ISHIMORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure detector and method of assembling the same
    Patent number: 9950576
    Abstract: A pressure detector includes: a case provided with a hole portion; support pillar members standing on the bottom surface of the case and each including a tapered portion at an end of each of the support pillar members; a circuit board including a sensor having a detection aperture, and mounting holes into which the respective tapered portions are insertable; and a packing provided with a through hole. The case and the circuit board are fixed by a cured resin while the hole portion is connected to the detection aperture via the through hole by inserting the tapered portion of each of the support pillar members into the mounting hole of the circuit board and by sandwiching the packing between the bottom surface of the case and the sensor.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: April 24, 2018
    Assignees: FUJI ELECTRIC CO., LTD., THE YOKOHAMA RUBBER CO., LTD.
    Inventors: Souichi Arai, Tsukasa Ishimori, Daisuke Kanenari, Yasuhiko Araki
  • PRESSURE DETECTOR AND METHOD OF ASSEMBLING THE SAME
    Publication number: 20160001615
    Abstract: A pressure detector includes: a case provided with a hole portion; support pillar members standing on the bottom surface of the case and each including a tapered portion at an end of each of the support pillar members; a circuit board including a sensor having a detection aperture, and mounting holes into which the respective tapered portions are insertable; and a packing provided with a through hole. The case and the circuit board are fixed by a cured resin while the hole portion is connected to the detection aperture via the through hole by inserting the tapered portion of each of the support pillar members into the mounting hole of the circuit board and by sandwiching the packing between the bottom surface of the case and the sensor.
    Type: Application
    Filed: March 27, 2014
    Publication date: January 7, 2016
    Inventors: Souichi ARAI, Tsukasa ISHIMORI, Daisuke KANENARI, Yasuhiko ARAKI