Patents by Inventor Tsukasa Izumi

Tsukasa Izumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Water-dispersible resin composition for use in boring hole in printed wiring board, sheet comprising the composition, and method for boring hole in printed wiring board using the sheet
    Patent number: 7012117
    Abstract: The present invention provides a water-dispersant resin composition for perforating a printed wiring board excellent in preciseness of the processing position and plating throwing power when perforating, a sheet for perforating using the composition, a process for perforating a printed wiring board using the sheet. More specifically, the present invention provides a water-dispersant resin composition for perforating a printed wiring board comprising a water-soluble polymer (A) and a polymer compound (B) containing the compound represented by the following formula (1) as a copolymer component, a sheet for perforating using the composition, and a process for perforating a printed wiring board using the sheet. (wherein, R represents hydrogen or a methyl group, and n represents an integer of 10 to 22).
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: March 14, 2006
    Assignee: The Nippon Synthetic Chemical Industry Co., Ltd.
    Inventors: Tsukasa Izumi, Hiroaki Satoh
  • Water-dispersible resin composition for use in boring hole in printed wiring board, sheet comprising the composition, and method for boring hole in printed wiring board using the sheet
    Publication number: 20040209091
    Abstract: The present invention provides a water-dispersant resin composition for perforating a printed wiring board excellent in preciseness of the processing position and plating throwing power when perforating, a sheet for perforating using the composition, a process for perforating a printed wiring board using the sheet. More specifically, the present invention provides a water-dispersant resin composition for perforating a printed wiring board comprising a water-soluble polymer (A) and a polymer compound (B) containing the compound represented by the following formula (1) as a copolymer component, a sheet for perforating using the composition, and a process for perforating a printed wiring board using the sheet.
    Type: Application
    Filed: January 16, 2004
    Publication date: October 21, 2004
    Inventors: Tsukasa Izumi, Hiroaki Satoh