Patents by Inventor Tsukasa KATSUYAMA

Tsukasa KATSUYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control device
    Patent number: 11724341
    Abstract: A lead-free solder alloy includes 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and 2.1% by mass or less of In, 3.0% by mass or more and 4.0% by mass or less of Sb, 0.001% by mass or more and 0.05% by mass or less of Ni, 0.001% by mass or more and 0.01% by mass or less of Co, and the balance being Sn.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: August 15, 2023
    Assignee: TAMURA CORPORATION
    Inventors: Yurika Munekawa, Takeshi Nakano, Masaya Arai, Takanori Shimazaki, Tsukasa Katsuyama
  • Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control device
    Patent number: 11691226
    Abstract: A lead-free solder alloy includes 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and 2.1% by mass or less of In, 3.0% by mass or more and 4.0% by mass or less of Sb, 0.001% by mass or more and 0.05% by mass or less of Ni, 0.001% by mass or more and 0.01% by mass or less of Co, and the balance being Sn.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: July 4, 2023
    Assignee: TAMURA CORPORATION
    Inventors: Yurika Munekawa, Takeshi Nakano, Masaya Arai, Takanori Shimazaki, Tsukasa Katsuyama
  • Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device
    Patent number: 10926360
    Abstract: According to one aspect of the present invention, a lead-free solder alloy includes 2% by mass or more and 3.1% by mass or less of Ag, more than 0% by mass and 1% by mass or less of Cu, 1% by mass or more and 5% by mass or less of Sb, 3.1% by mass or more and 4.5% by mass or less of Bi, 0.01% by mass or more and 0.25% by mass or less of Ni, and Sn.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: February 23, 2021
    Assignee: TAMURA CORPORATION
    Inventors: Masaya Arai, Takeshi Nakano, Atsushi Hori, Tsukasa Katsuyama, Yurika Munekawa, Daisuke Maruyama
  • LEAD-FREE SOLDER ALLOY, SOLDER JOINING MATERIAL, ELECTRONIC CIRCUIT MOUNTING SUBSTRATE, AND ELECTRONIC CONTROL DEVICE
    Publication number: 20210001433
    Abstract: A lead-free solder alloy includes 2.0% by mass or more and 4.0% by mass or less of Ag, 0.3% by mass or more and 0.7% by mass or less of Cu, 1.2% by mass or more and 2.0% by mass or less of Bi, 0.5% by mass or more and 2.1% by mass or less of In, 3.0% by mass or more and 4.0% by mass or less of Sb, 0.001% by mass or more and 0.05% by mass or less of Ni, 0.001% by mass or more and 0.01% by mass or less of Co, and the balance being Sn.
    Type: Application
    Filed: September 16, 2020
    Publication date: January 7, 2021
    Applicant: TAMURA CORPORATION
    Inventors: Yurika MUNEKAWA, Takeshi NAKANO, Masaya ARAI, Takanori SHIMAZAKI, Tsukasa KATSUYAMA
  • Lead-free solder alloy, electronic circuit substrate, and electronic device
    Patent number: 10456872
    Abstract: A lead-free solder alloy includes 1% by weight or more and 4% by weight or less of Ag, 1% by weight or less of Cu, 3% by weight or more and 5% by weight or less of Sb, 0.01% by weight or more and 0.25% by weight or less of Ni, and Sn.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: October 29, 2019
    Assignee: TAMURA CORPORATION
    Inventors: Masaya Arai, Takeshi Nakano, Atsushi Hori, Tsukasa Katsuyama, Yurika Munekawa
  • LEAD-FREE SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD
    Publication number: 20190210161
    Abstract: A lead-free solder alloy includes 1 mass % or more and 4 mass % or less of Ag, 0.1 mass % or more and 1 mass % or less of Cu, 1.5 mass % or more and 5 mass % or less of Sb, 1 mass % or more and 6 mass % or less of In, and Sn.
    Type: Application
    Filed: March 18, 2019
    Publication date: July 11, 2019
    Applicant: TAMURA CORPORATION
    Inventors: Masaya ARAI, Tsukasa KATSUYAMA, Yurika MUNEKAWA, Takanori SHIMAZAKI
  • LEAD-FREE SOLDER ALLOY, ELECTRONIC CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE
    Publication number: 20190076965
    Abstract: A lead-free solder alloy includes 1% by weight or more and 4% by weight or less of Ag, 1% by weight or less of Cu, 3% by weight or more and 5% by weight or less of Sb, 0.01% by weight or more and 0.25% by weight or less of Ni, and Sn.
    Type: Application
    Filed: September 8, 2017
    Publication date: March 14, 2019
    Applicant: TAMURA CORPORATION
    Inventors: Masaya ARAI, Takeshi NAKANO, Atsushi HORI, Tsukasa KATSUYAMA, Yurika MUNEKAWA
  • LEAD-FREE SOLDER ALLOY, SOLDER JOINT, SOLDER PASTE COMPOSITION, ELECTRONIC CIRCUIT BOARD, AND ELECTRONIC DEVICE
    Publication number: 20180029169
    Abstract: According to one aspect of the present invention, a lead-free solder alloy includes 2% by mass or more and 3.1% by mass or less of Ag, more than 0% by mass and 1% by mass or less of Cu, 1% by mass or more and 5% by mass or less of Sb, 3.1% by mass or more and 4.5% by mass or less of Bi, 0.01% by mass or more and 0.25% by mass or less of Ni, and Sn.
    Type: Application
    Filed: September 19, 2017
    Publication date: February 1, 2018
    Applicant: TAMURA CORPORATION
    Inventors: Masaya ARAI, Takeshi NAKANO, Atsushi HORI, Tsukasa KATSUYAMA, Yurika MUNEKAWA, Daisuke MARUYAMA
  • LEAD-FREE SOLDER ALLOY, ELECTRONIC CIRCUIT BOARD, AND ELECTRONIC CONTROL DEVICE
    Publication number: 20160279741
    Abstract: A lead-free solder alloy includes: 1 wt % to 4 wt % of Ag; 0.5 wt % to 1 wt % of Cu; 1 wt % to 5 wt % of Sb; 0.05 wt % to 0.25 wt % of at least one of Ni and Co; and Sn.
    Type: Application
    Filed: March 17, 2016
    Publication date: September 29, 2016
    Applicant: TAMURA Corporation
    Inventors: Tsuyoshi UKYO, Tatsuya KIYOTA, Masaya ARAI, Naoko MATSUO, Tsukasa KATSUYAMA, Kota HATTORI