Abstract: A beam confinement subsystem for an optical scanning system of a laser beam machine having a laser beam transfer path includes an expandable light path sealing and protecting member surrounding a portion of the laser beam transfer path, and a pressure adjusting buffer directly coupled to the expandable light path sealing and protecting member. Preferably, the pressure adjusting buffer including an expandable, airtight thin-film material. Additionally, the beam confinement can include a pressurized purge gas supply tank directly connected to the expandable light path sealing and protecting member to thereby provide greater protection from contamination to the laser beam transfer path.

Abstract: In a laser machining apparatus and method according to the present invention, a chip conveyor provided under the machining head parallel to the moving direction of the machining head recovers chips dropping near a movable area of a machining head, the chip tray provided in a section where the chip conveyor does not exit, receives chips dropping in a movable area of the machining table where the chip conveyor does not exist, and brushes provided under the machining table move along with the machining table to clean off chips stored in the chip trays and drop the chips onto the chip conveyor.

Abstract: A laser beam machining apparatus, in which the focal position of the laser beam is changed, for instance, from the upper surface of a workpiece to the lower surface during laser beam machining, the optical axis of the laser beam passed through the optical system is not affected, and the gap between the nozzle and the workpiece is maintained optimum at all times. The laser beam machining apparatus comprises an optical system for concentrating a laser beam, a holder for holding the optical system, first drive means for moving the holder along the optical axis of the laser beam, a nozzle slidably engaged with the holder, jetting a machining gas or the like, and second drive means for moving the nozzle.