Patents by Inventor Tsukasa Murota

Tsukasa Murota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND DEVICE FOR THERMOCOMPRESSION BONDING
    Publication number: 20140216659
    Abstract: There are provided a method and device for thermocompression bonding of possibly preventing any warping of a resin member to be caused by thermocompression bonding, and of possibly reducing the time to be taken for processing. The method for thermocompression bonding, includes: preheating a resin member using an infrared radiation section; and subjecting the resin member to thermocompression bonding using a heating section and a pressurization section.
    Type: Application
    Filed: April 4, 2014
    Publication date: August 7, 2014
    Applicants: Sony DADC Corporation, Sony Corporation
    Inventor: Tsukasa Murota
  • Method and device for thermocompression bonding
    Patent number: 8691039
    Abstract: There are provided a method and device for thermocompression bonding of possibly preventing any warping of a resin member to be caused by thermocompression bonding, and of possibly reducing the time to be taken for processing. The method for thermocompression bonding, includes: preheating a resin member using an infrared radiation section; and subjecting the resin member to thermocompression bonding using a heating section and a pressurization section.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: April 8, 2014
    Assignees: Sony Corporation, Sony DADC Corporation
    Inventor: Tsukasa Murota
  • METHOD AND DEVICE FOR THERMOCOMPRESSION BONDING
    Publication number: 20120205040
    Abstract: There are provided a method and device for thermocompression bonding of possibly preventing any warping of a resin member to be caused by thermocompression bonding, and of possibly reducing the time to be taken for processing. The method for thermocompression bonding, includes: preheating a resin member using an infrared radiation section; and subjecting the resin member to thermocompression bonding using a heating section and a pressurization section.
    Type: Application
    Filed: October 11, 2011
    Publication date: August 16, 2012
    Applicants: Sony DADC Corporation, Sony Corporation
    Inventor: Tsukasa Murota
  • Vacuum transfer apparatus and method
    Patent number: 8029706
    Abstract: A vacuum transfer apparatus including an auxiliary vacuum chamber and a main vacuum chamber is used for transferring an uneven pattern to a disk substrate with a stamper. The auxiliary vacuum chamber is vacuumized or opened to air because the disk substrate is conveyed to and from the vacuum transfer apparatus through the auxiliary vacuum chamber. The disk substrate conveyed to the auxiliary vacuum chamber and then to the main vacuum chamber after the auxiliary vacuum chamber is vacuumized. In the main vacuum chamber, transferring of the uneven pattern with the stamper, curing of UV-curable resin, and removal of the stamper are performed to provide a disk substrate with the uneven pattern. Then, the disk substrate is conveyed from the vacuum transfer apparatus through the auxiliary vacuum chamber. An operation at the auxiliary-vacuum-chamber side and an operation at the main-vacuum-chamber side are performed in parallel.
    Type: Grant
    Filed: June 6, 2008
    Date of Patent: October 4, 2011
    Assignee: Sony Disc & Digital Solutions, Inc.
    Inventor: Tsukasa Murota
  • VACUUM TRANSFER APPARATUS AND METHOD
    Publication number: 20090025630
    Abstract: A vacuum transfer apparatus including an auxiliary vacuum chamber and a main vacuum chamber is used for transferring an uneven pattern to a disk substrate with a stamper. The auxiliary vacuum chamber is vacuumized or opened to air because the disk substrate is conveyed to and from the vacuum transfer apparatus through the auxiliary vacuum chamber. The disk substrate conveyed to the auxiliary vacuum chamber and then to the main vacuum chamber after the auxiliary vacuum chamber is vacuumized. In the main vacuum chamber, transferring of the uneven pattern with the stamper, curing of UV-curable resin, and removal of the stamper are performed to provide a disk substrate with the uneven pattern. Then, the disk substrate is conveyed from the vacuum transfer apparatus through the auxiliary vacuum chamber. An operation at the auxiliary-vacuum-chamber side and an operation at the main-vacuum-chamber side are performed in parallel.
    Type: Application
    Filed: June 6, 2008
    Publication date: January 29, 2009
    Applicant: SONY DISC & DIGITAL SOLUTIONS INC.
    Inventor: Tsukasa Murota