Patents by Inventor Tsukasa Sakaguchi

Tsukasa Sakaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11874300
    Abstract: A contact probe includes: a first contact member; a second contact member; and a spring member. The first contact member includes: a first tip part configured to contact a first contact target; and a boss part configured to couple with the spring member by fitting into the spring member, and the second contact member includes: a second tip part configured to contact a second contact target; and a cylindrical part extending from the second tip part and having a cylindrical shape with an inner circumference having a uniform diameter, the cylindrical part being engaged with at least a portion of the spring member, the portion of the spring member that is engaged with the cylindrical part having a diameter larger than the other portion of the spring member, the entire spring member being configured to be housed in the cylindrical part when the spring member is contracted.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: January 16, 2024
    Assignee: NHK SPRING CO., LTD.
    Inventors: Kazuya Souma, Tsukasa Sakaguchi
  • Publication number: 20220252640
    Abstract: A contact probe includes: a first contact member; a second contact member; and a spring member. The first contact member includes: a first tip part configured to contact a first contact target; and a boss part configured to couple with the spring member by fitting into the spring member, and the second contact member includes: a second tip part configured to contact a second contact target; and a cylindrical part extending from the second tip part and having a cylindrical shape with an inner circumference having a uniform diameter, the cylindrical part being engaged with at least a portion of the spring member, the portion of the spring member that is engaged with the cylindrical part having a diameter larger than the other portion of the spring member, the entire spring member being configured to be housed in the cylindrical part when the spring member is contracted.
    Type: Application
    Filed: April 26, 2022
    Publication date: August 11, 2022
    Applicant: NHK Spring Co., Ltd.
    Inventors: Kazuya Souma, Tsukasa Sakaguchi
  • Patent number: 11346859
    Abstract: A contact probe is conductive and capable of expanding/contracting along an axial line direction. The contact probe includes: a first contact member configured to contact one contact target; a second contact member configured to contact another contact target, and to house at least a portion of the first contact member; and a spring member configured to couple the first contact member and the second contact member in a manner capable of expansion/contraction with both end parts of the spring member. The spring member is wound in a helical shape, and at least a diameter of an outer circumference in one of the end parts held by the second contact member is larger than diameters of other portions. A diameter of an inner circumference of an end part of the second contact member on a side housing the first contact member is equal to or larger than a maximum diameter of the first contact member.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: May 31, 2022
    Assignee: NHK Spring Co., Ltd.
    Inventors: Kazuya Souma, Tsukasa Sakaguchi
  • Patent number: 11131691
    Abstract: A probe holder holds contact probes each of which comes in contact with one electrode of a contact target on one end portion side in a longitudinal direction. The probe holder includes a plate in which holder holes configured to hold the respective contact probes are formed and penetrate the probe holder. Each of the holder holes includes a first hole portion disposed on one end of a penetrating direction and extending in the penetrating direction, a large diameter portion connected to the first hole portion and extending in the penetrating direction, the large diameter portion being larger than a diameter of the first hole portion, and a second hole portion disposed on another end of the penetrating direction, connected to the large diameter portion, and extending in the penetrating direction, the second hole portion being smaller than a diameter of the large diameter portion.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: September 28, 2021
    Assignee: NHK Spring Co., Ltd.
    Inventors: Tsukasa Sakaguchi, Kazuya Souma
  • Publication number: 20210223287
    Abstract: A contact probe is conductive and capable of expanding/contracting along an axial line direction. The contact probe includes: a first contact member configured to contact one contact target; a second contact member configured to contact another contact target, and to house at least a portion of the first contact member; and a spring member configured to couple the first contact member and the second contact member in a manner capable of expansion/contraction with both end parts of the spring member. The spring member is wound in a helical shape, and at least a diameter of an outer circumference in one of the end parts held by the second contact member is larger than diameters of other portions. A diameter of an inner circumference of an end part of the second contact member on a side housing the first contact member is equal to or larger than a maximum diameter of the first contact member.
    Type: Application
    Filed: March 29, 2018
    Publication date: July 22, 2021
    Inventors: Kazuya Souma, Tsukasa Sakaguchi
  • Publication number: 20200033380
    Abstract: A probe holder holds contact probes each of which comes in contact with one electrode of a contact target on one end portion side in a longitudinal direction. The probe holder includes a plate in which holder holes configured to hold the respective contact probes are formed and penetrate the probe holder. Each of the holder holes includes a first hole portion disposed on one end of a penetrating direction and extending in the penetrating direction, a large diameter portion connected to the first hole portion and extending in the penetrating direction, the large diameter portion being larger than a diameter of the first hole portion, and a second hole portion disposed on another end of the penetrating direction, connected to the large diameter portion, and extending in the penetrating direction, the second hole portion being smaller than a diameter of the large diameter portion.
    Type: Application
    Filed: March 26, 2018
    Publication date: January 30, 2020
    Applicant: NHK Spring Co., Ltd.
    Inventors: Tsukasa Sakaguchi, Kazuya Souma
  • Patent number: 8394731
    Abstract: Disclosed is a printed wiring board which attains aims of printed wiring boards required for realizing high-speed, high-frequency semiconductor devices, namely a printed wiring board having low dielectric constant, low dielectric loss tangent and low linear expansion coefficient. Also disclosed is a composite woven fabric suitably used as a base material for such a printed wiring board. Specifically disclosed is a composite woven fabric containing quartz glass fibers and polyolefin fibers, in which the ratio of the quartz glass fibers to the composite woven fabric is set at 10 vol % or more and 90 vol % or less. It is preferred that the quartz glass fibers each have a filament diameter of 3 ?m or more and 16 ?m or less, and the composite woven fabric has a thickness of 200 ?m or less.
    Type: Grant
    Filed: November 7, 2007
    Date of Patent: March 12, 2013
    Assignee: Shin-Etsu Quartz Products Co., Ltd.
    Inventors: Akira Sato, Akira Fujinoki, Hiroyuki Nishimura, Tsukasa Sakaguchi
  • Publication number: 20100065316
    Abstract: Disclosed is a printed wiring board which attains aims of printed wiring boards required for realizing high-speed, high-frequency semiconductor devices, namely a printed wiring board having low dielectric constant, low dielectric loss tangent and low linear expansion coefficient. Also disclosed is a composite woven fabric suitably used as a base material for such a printed wiring board. Specifically disclosed is a composite woven fabric containing quartz glass fibers and polyolefin fibers, in which the ratio of the quartz glass fibers to the composite woven fabric is set at 10 vol % or more and 90 vol % or less. It is preferred that the quartz glass fibers each have a filament diameter of 3 ?m or more and 16 ?m or less, and the composite woven fabric has a thickness of 200 ?m or less.
    Type: Application
    Filed: November 7, 2007
    Publication date: March 18, 2010
    Applicant: SHIN-ETSU QUARTZ PRODUCTS, LTD.
    Inventors: Akira Sato, Akira Fujinoki, Hiroyuku Nishimura, Tsukasa Sakaguchi
  • Patent number: 6849242
    Abstract: The granule consists of individual granules approximately spherical in shape, having a pore volume of 0.5 cm3, a mean diameter of pores of 50 nm or less, a specific surface area of 100 m2/g or less, and a bulk density of 0.7 g/cm3 or higher. It is produced by dispersing a fumed silica obtained by hydrolysis of a silicon compound into pure water to obtain a slurry, and drying the slurry. The granule is used for producing high purity synthetic quartz glass powder. The method further comprises: a first heat treatment under an oxygen-containing atmosphere, a second heat treatment in a temperature range of from 600 to 1100° C., and a third heat treatment in a temperature range of from 1100 to 1300° C. under an atmosphere containing hydrogen chloride; and a step of densification comprising calcining the product at a temperature not higher than 1500° C. under vacuum or in an atmosphere of gaseous hydrogen or gaseous helium.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: February 1, 2005
    Assignees: Heraeus Quarzglas GmbH & Co. KG, Shin-Etsu Quartz Products Co., Ltd.
    Inventors: Rainer Koeppler, Fritz-Ulrich Kreis, Klaus Arnold, Hiroshi Matsui, Kasumi Hoshikawa, Tsukasa Sakaguchi