Patents by Inventor Tsukasa Tokida

Tsukasa Tokida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7394108
    Abstract: A light-emitting device in which a light-emitting element, such as an LED, and an electrostatic protection element for protecting the light-emitting element from electrostatic breakdown are connected in parallel. The light-emitting device is configured such that a connection wire member of the light-emitting element and a connection wire member of the electrostatic protection element are formed of the same material; and the connection wire member of the electrostatic protection element is smaller in diameter than the connection wire member of the light-emitting element. When the light-emitting element lapses into an open-circuit state, whereby an electric current which is originally intended to flow through the element unintentionally flows through the electrostatic protection element, the connection wire member is fused by an overcurrent. Consequently, occurrence of a failure of the electrostatic protection element in a short-circuit mode can be prevented.
    Type: Grant
    Filed: November 23, 2005
    Date of Patent: July 1, 2008
    Assignee: Koito Manufacturing Co., Ltd.
    Inventors: Hitoshi Takeda, Tsukasa Tokida
  • Publication number: 20080111143
    Abstract: A light-emitting module includes a semiconductor light-emitting element with a generally oblong shape, and a planar electrode formed on a surface of the semiconductor light-emitting element. The planar electrode has a generally right triangular electrode portion that is defined by an oblique cut-off line on any one of four corners of the semiconductor light-emitting element. The planar electrode is formed with a wire bonding portion that establishes a current-carrying connection with the generally right triangular electrode portion.
    Type: Application
    Filed: November 8, 2007
    Publication date: May 15, 2008
    Applicant: KOITO MANUFACTURING CO., LTD.
    Inventors: Hiroyuki Ishida, Tsukasa Tokida
  • Publication number: 20080013329
    Abstract: A lamp module is constructed of a light source part made of a semiconductor light emitting element, and an optical member for distributing light emitted from the light source part. The light source part includes a surface-emitting laser element in which plural light emission parts are parallel arranged on a surface, a mask which is disposed on a surface of the surface-emitting laser element and includes plural mask openings for exposing the light emission parts, and fluorescent substances with which the mask openings are filled. By forming the light source part in a monolithic configuration, an array pitch of the plural light emission parts can be decreased, a light source can be miniaturized and also a lamp can be further miniaturized.
    Type: Application
    Filed: June 27, 2007
    Publication date: January 17, 2008
    Applicant: KOITO MANUFACTURING CO., LTD.
    Inventors: Hitoshi TAKEDA, Tsukasa TOKIDA
  • Publication number: 20080008427
    Abstract: A ceramic board is formed in an almost rectangular shape and has one side surface of an outer peripheral surface formed as an abutting surface, which is caused to abut on positioning surfaces of a radiating member, and one surface in a vertical direction formed as a device disposing surface on which a semiconductor light emitting device is to be disposed. Predetermined conductive patterns are formed on the ceramic board. A light emitting portion has a semiconductor light emitting device. A pair of positive and negative planar electrode portions are formed on the ceramic board and connected to the semiconductor light emitting device through the conductive patterns. At least a part of the pair of planar electrode portions are set to be exposure regions exposed to the device disposing surface of the ceramic board and the exposure regions are positioned in portions other than a portion linked to the abutting surface in an outer peripheral portion of the device disposing surface.
    Type: Application
    Filed: July 6, 2007
    Publication date: January 10, 2008
    Applicants: KOITO MANUFACTURING CO., LTD., NICHIA CORPORATION
    Inventors: Hitoshi Takeda, Tsukasa Tokida, Kazunori Watanabe, Masato Ono
  • Publication number: 20070274086
    Abstract: A light emitting module includes a semiconductor light emitting element disposed on a rectangular board, and a pair of plane-shaped electrode portions formed on the board and coupled to the semiconductor light emitting element The pair of plane-shaped electrode portions is separated in first opposite directions, and a center of the semiconductor light emitting element is shifted from a center of the board in one of second opposite directions. End faces of the pair of plane-shaped electrode portions do not protrude in the one of the second opposite directions from an end face of the semiconductor light emitting element on a side facing toward the one of the second opposite directions. The first opposite directions are directions along which one pair of opposite sides of the board extend, and the second opposite directions are directions along which the other pair of opposite sides of the board extend.
    Type: Application
    Filed: May 22, 2007
    Publication date: November 29, 2007
    Applicant: KOITO MANUFACTURING CO., LTD.
    Inventors: Hitoshi Takeda, Tsukasa Tokida, Hiroyuki Ishida
  • Patent number: 7282748
    Abstract: A light-emitting module having a light-emitting efficiency. The light-emitting module that emits light includes a semiconductor light-emitting element that emits light; and a light transmission member that is provided to cover the semiconductor light-emitting element with materials for transmitting the light emitted from the semiconductor light-emitting element and forms a sub-wavelength grating for reducing reflection of the light on its outgoing face for sending the light incident from an interface facing said semiconductor light-emitting element to its outside in grid periods shorter than a wavelength of the light transmitted by the light transmission member.
    Type: Grant
    Filed: January 13, 2005
    Date of Patent: October 16, 2007
    Assignee: Koito Manufacturing Co., Ltd.
    Inventors: Hitoshi Takeda, Hisayoshi Daichou, Tsukasa Tokida, Hiroyuki Ishida
  • Patent number: 7282747
    Abstract: A light-emitting module having a light-emitting efficiency. The light-emitting module that emits light includes a semiconductor light-emitting element operable to emit light, and a sealing member operable to seal the semiconductor light-emitting element with materials that transmit the light emitted from the light-emitting module, in which the semiconductor light-emitting element includes a sapphire substrate that transmits light toward the sealing member to send the transmitted light from a facing face facing the sealing member and forms a sub-wavelength grating for reducing reflection of light on the facing face in grid periods shorter than a wavelength of the light transmitted through the sapphire substrate, and a semiconductor layer that is formed on a rear face of the facing face in the sapphire substrate by crystal growth and emits light toward the sapphire substrate.
    Type: Grant
    Filed: January 13, 2005
    Date of Patent: October 16, 2007
    Assignee: Koito Manufacturing Co., Ltd.
    Inventors: Hitoshi Takeda, Hisayoshi Daichou, Tsukasa Tokida, Hiroyuki Ishida
  • Publication number: 20070206369
    Abstract: A light source module includes a ceramic circuit board having a predetermined conductive pattern, a semiconductor light emitting element arranged on said ceramic circuit board and connected to the conductive pattern, and an attachment for power feeding bonded to the ceramic circuit board. The attachment for power feeding is provided with a power feeding part connected to an external power source, a plate-shaped part adjacent to a position opposed to an outer circumferential surface of the ceramic circuit board, and a power feeding terminal formed in plate shape and protruded from the plate-shaped part to a side of the ceramic circuit board. The top of the power feeding terminal is connected to a part of the conductive pattern with the top overlapped from a thickness direction. The power feeding terminal of the attachment for power feeding is fixed and connected to the conductive pattern of the ceramic circuit board.
    Type: Application
    Filed: March 1, 2007
    Publication date: September 6, 2007
    Applicant: KOITO MANUFACTURING CO., LTD.
    Inventors: Hitoshi Takeda, Tsukasa Tokida
  • Publication number: 20070171662
    Abstract: A light source module includes a circuit board on which a predetermined conductive pattern is formed, a semiconductor light emitting element mounted on the circuit board, and a plurality of power supplying terminals to which power cords for supplying electric power to the semiconductor light emitting element are connected. An entire lower face of the circuit board is electrically insulated, and the plurality of power supplying terminals is fixed onto the conductive pattern on the circuit board. The plurality of power supplying terminals protrudes from the circuit board.
    Type: Application
    Filed: January 23, 2007
    Publication date: July 26, 2007
    Applicant: KOITO MANUFACTURING CO., LTD.
    Inventor: Tsukasa Tokida
  • Publication number: 20070109806
    Abstract: A vehicular lamp 10 including an LED module 60 that is a light source and a power supply socket 70 for connecting the LED module to a power supply. The LED module is made of an LED substrate 61, an LED 62 mounted on the LED substrate, a pair of positive and negative current-conducting parts 63 connected to the LED and formed on both sides of the LED. The power supply socket includes a base body 71 made from an insulating material and a pair of positive and negative terminals 72 held in a pair of holding portions 73 of the base body. When the LED module is set in the power supply socket, the holding portions of power supply socket hold the side edge portions of the LED module, and the pair of positive and negative terminals come into contact with the current-conducting parts of the LED module.
    Type: Application
    Filed: October 30, 2006
    Publication date: May 17, 2007
    Inventors: Hironori Tsukamoto, Tsukasa Tokida
  • Patent number: 7168834
    Abstract: A vehicular lamp that irradiates amber light includes: a light emitting diode operable to emit blue light; a long-wavelength phosphor operable to emit light of which a peak wavelength is substantially equal to or longer than a wavelength of the umber light based on the blue light emitting from the light emitting diode; and an optical filter operable to block the bulk of light emitting from the light emitting diode and also to transmit the bulk of light, which has a wavelength similar to the peak wavelength, among light emitting from the long-wavelength phosphor to generate the amber light depending to light emitting from the light emitting diode and the long-wavelength phosphor.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: January 30, 2007
    Assignees: Koito Manufacturing Co., Ltd., Nichia Corporation
    Inventors: Hitoshi Takeda, Tsukasa Tokida, Takumi Inoue
  • Patent number: 7165871
    Abstract: The lamp for generating light, comprises a semiconductor light emitting element for emitting light, a fluorescent material, provided away from the semiconductor light emitting element, a first optical member operable to focus the light generated by the semiconductor light emitting element on the fluorescent material; and a second optical member having an optical center at a position where the fluorescent material is provided, operable to emit light from the fluorescent material based on the light focused by the first optical member to an outside of the lamp. The lamp is used as a headlamp in a vehicle, and the second optical member emits the light from the fluorescent material to the outside of the lamp, so that the second optical member form sat least one of a part of a cut line that defines a boundary between a bright region and a dark region of the headlamp.
    Type: Grant
    Filed: November 10, 2004
    Date of Patent: January 23, 2007
    Assignee: Koito Manufacturing Co., Ltd.
    Inventors: Hitoshi Takeda, Tsukasa Tokida
  • Publication number: 20060284161
    Abstract: A light source module is provided with a semiconductor light emitting element disposed in a hollow airtight region within a cover fixed to a circuit board, and electrodes which are disposed outside of the airtight region and supplies a current to the semiconductor light emitting element. The circuit board is provided with a non-conductive layer serving as a base member and having non-conductivity and also provided with conductive patterns for coupling the semiconductor light emitting element to the electrodes. Then, the cover is fixed on the non-conductive layer.
    Type: Application
    Filed: June 13, 2006
    Publication date: December 21, 2006
    Inventor: Tsukasa Tokida
  • Publication number: 20060284303
    Abstract: In a light-emitting device, a mount member mounting a semiconductor light-emitting element is mounted on a circuit board. A multilayer board is used for the mount member. A first conductive pattern formed on the surface layer of the multilayer board and a semiconductor light-emitting element are electrically connected. On the multilayer board, a second conductive pattern formed on an intermediate layer positioned closer to the circuit board than the first conductive pattern is electrically connected to the conductor part of the circuit board with a conductive wire such as a gold wire. Power is fed from the conductor part to the semiconductor light-emitting element via the conductive wire and the conductive patterns.
    Type: Application
    Filed: June 7, 2006
    Publication date: December 21, 2006
    Applicant: KOITO MANUFACTURING CO., LTD.
    Inventor: Tsukasa Tokida
  • Patent number: 7128453
    Abstract: A vehicular headlamp for emitting light toward a predetermined emitting direction, includes: a plurality of semiconductor light emitting devices approximately aligned; and an optical component, having its optical center on one of the semiconductor light emitting devices, for irradiating light emitted by the semiconductor light emitting devices toward the emitting direction.
    Type: Grant
    Filed: February 11, 2004
    Date of Patent: October 31, 2006
    Assignee: Koito Manufacturing Co., Ltd.
    Inventors: Masashi Tatsukawa, Hiroyuki Ishida, Kiyoshi Sazuka, Tsukasa Tokida
  • Publication number: 20060197444
    Abstract: A light emitting apparatus includes a semiconductor light emitting element mounted on a circuit board; a lighting circuit part mounted on the circuit board; and a cover which covers the semiconductor light emitting element and the lighting circuit part. The lighting circuit part converts a voltage inputted from a power source into electromagnetic energy and propagates the converted electromagnetic energy to the semiconductor light emitting element as light emitting energy, and the cover transmits light from the semiconductor light emitting element.
    Type: Application
    Filed: February 27, 2006
    Publication date: September 7, 2006
    Applicant: KOITO MANUFACTURING CO., LTD.
    Inventors: Hitoshi Takeda, Masayasu Ito, Tsukasa Tokida
  • Publication number: 20060108597
    Abstract: A light-emitting device in which a light-emitting element, such as an LED, and an electrostatic protection element for protecting the light-emitting element from electrostatic breakdown are connected in parallel. The light-emitting device is configured such that a connection wire member of the light-emitting element and a connection wire member of the electrostatic protection element are formed of the same material; and the connection wire member of the electrostatic protection element is smaller in diameter than the connection wire member of the light-emitting element. When the light-emitting element lapses into an open-circuit state, whereby an electric current which is originally intended to flow through the element unintentionally flows through the electrostatic protection element, the connection wire member is fused by an overcurrent. Consequently, occurrence of a failure of the electrostatic protection element in a short-circuit mode can be prevented.
    Type: Application
    Filed: November 23, 2005
    Publication date: May 25, 2006
    Applicant: KOITO MANUFACTURING CO., LTD.
    Inventors: Hitoshi Takeda, Tsukasa Tokida
  • Publication number: 20060055309
    Abstract: A light emitting device including a light source and a light transforming 101 member containing a fluorescent substance for absorbing at least a part of a light emitted from the light source and for emitting a light having a different wavelength. The light source includes a plurality of semiconductor light emitting units 104, at least a part of which are covered with the light transforming member 101. A shielding member 102 between a first semiconductor light emitting unit 104a covered with the light transforming member 101 and a second semiconductor light emitting unit 104b which is adjacent to the semiconductor light emitting unit 104a.
    Type: Application
    Filed: September 8, 2005
    Publication date: March 16, 2006
    Inventors: Masato Ono, Shinya Sonobe, Hiroyuki Ishida, Tsukasa Tokida
  • Publication number: 20050156178
    Abstract: A light-emitting module having a light-emitting efficiency. The light-emitting module that emits light includes a semiconductor light-emitting element that emits light; and a light transmission member that is provided to cover the semiconductor light-emitting element with materials for transmitting the light emitted from the semiconductor light-emitting element and forms a sub-wavelength grating for reducing reflection of the light on its outgoing face for sending the light incident from an interface facing said semiconductor light-emitting element to its outside in grid periods shorter than a wavelength of the light transmitted by the light transmission member.
    Type: Application
    Filed: January 13, 2005
    Publication date: July 21, 2005
    Inventors: Hitoshi Takeda, Hisayoshi Daichou, Tsukasa Tokida, Hiroyuki Ishida
  • Publication number: 20050157508
    Abstract: A light-emitting module having a light-emitting efficiency. The light-emitting module that emits light includes a semiconductor light-emitting element operable to emit light, and a sealing member operable to seal the semiconductor light-emitting element with materials that transmit the light emitted from the light-emitting module, in which the semiconductor light-emitting element includes a sapphire substrate that transmits light toward the sealing member to send the transmitted light from a facing face facing the sealing member and forms a sub-wavelength grating for reducing reflection of light on the facing face in grid periods shorter than a wavelength of the light transmitted through the sapphire substrate, and a semiconductor layer that is formed on a rear face of the facing face in the sapphire substrate by crystal growth and emits light toward the sapphire substrate.
    Type: Application
    Filed: January 13, 2005
    Publication date: July 21, 2005
    Inventors: Hitoshi Takeda, Hisayoshi Daichou, Tsukasa Tokida, Hiroyuki Ishida