Patents by Inventor Tsukomu Ogawa

Tsukomu Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBFRAME FOR VEHICLE
    Publication number: 20160152272
    Abstract: To realize weight saving of a vehicle subframe, while ensuring required strength and stiffness thereof with a simple configuration, there are provided a first hole portion in at least one of an upper member and a lower member in a first region, and a second hole portion in at least one of the upper member and the lower member in a second region.
    Type: Application
    Filed: June 10, 2014
    Publication date: June 2, 2016
    Applicants: F-TECH INC., HONDA MOTOR CO., LTD.
    Inventors: Norio Tomikuda, Yusuke Arai, Tsukomu Ogawa, Taiyo Gon, Koji Tagome