Abstract: The present invention provides a method for manufacturing a substrate equipped with a wiring electrode which has a fine pattern and is excellent in conductivity and in which an opaque wiring electrode is hardly visible. Disclosed is a method for manufacturing a substrate equipped with a wiring electrode including the steps of forming an opaque wiring electrode on at least one side of a transparent substrate, applying a positive photosensitive composition on one side of the transparent substrate, and exposing and developing the positive photosensitive composition using the opaque wiring electrode as a mask to form a functional layer at a portion corresponding to the opaque wiring electrode.

Abstract: A photosensitive conductive paste includes a quaternary ammonium salt compound (A), a carboxyl group-containing resin (B), a photopolymerization initiator (C), a reactive monomer having an unsaturated double bond (D) and conductive particles (E). The photosensitive conductive paste exhibits conductivity at low temperature within a short time and is capable of forming fine wiring with excellent adhesion to ITO and bending resistance after being exposed to high-temperature and high-humidity environments by a photolithography method; and a film forms a conductive pattern.

Abstract: The present invention provides a method for manufacturing a substrate equipped with a wiring electrode which has a fine pattern and is excellent in conductivity and in which an opaque wiring electrode is hardly visible. Disclosed is a method for manufacturing a substrate equipped with a wiring electrode including the steps of forming an opaque wiring electrode on at least one side of a transparent substrate, applying a positive photosensitive composition on one side of the transparent substrate, and exposing and developing the positive photosensitive composition using the opaque wiring electrode as a mask to form a functional layer at a portion corresponding to the opaque wiring electrode.

Abstract: A laminate member is provided which has excellent ion migration resistance between a light-sensitive resin layer and a conductive layer formed on a substrate. This laminate member is provided with a resin layer A formed on the substrate, a transparent electrode layer B formed on the resin layer A, and a conductive layer C formed on the resin layer A and the transparent electrode layer B, wherein the resin layer A contains a resin (a) containing a carboxyl group, the conductive layer C contains a resin (c) having conductive particles and a carboxylic group, the conductive layer C contacts the resin layer A and the transparent electrode layer B, and, defining SA as the acid value of an organic component contained by the resin layer A and SC the acid value of an organic component contained by the resin layer C, the value of SA?SC is 20-150 mg KOH/g.

Abstract: Provided is a method for manufacturing a conductive pattern forming member that is formed on a substrate and that has excellent resistance to ion migration between a conductive pattern and a photosensitive resin layer, while suppressing generation of residues in the dissolution and removal of unexposed portions.

Abstract: A laminate member is provided which has excellent ion migration resistance between a light-sensitive resin layer and a conductive layer formed on a substrate. This laminate member is provided with a resin layer A formed on the substrate, a transparent electrode layer B formed on the resin layer A, and a conductive layer C formed on the resin layer A and the transparent electrode layer B, wherein the resin layer A contains a resin (a) containing a carboxyl group, the conductive layer C contains a resin (c) having conductive particles and a carboxylic group, the conductive layer C contacts the resin layer A and the transparent electrode layer B, and, defining SA as the acid value of an organic component contained by the resin layer A and SC the acid value of an organic component contained by the resin layer C, the value of SA?SC is 20-150 mg KOH/g.

Abstract: Provided is a method for manufacturing a conductive pattern forming member that is formed on a substrate and that has excellent resistance to ion migration between a conductive pattern and a photosensitive resin layer, while suppressing generation of residues in the dissolution and removal of unexposed portions.

Abstract: A conductive paste can form a minute conductive pattern having markedly high adhesion and exhibiting conductivity at relatively low temperatures. The conductive paste contains: a compound (A) having a primary amino group, a secondary amino group, and a tertiary amino group; a compound (B) having a carboxyl group; and a conductive filler (C).

Abstract: A photosensitive conductive paste provides a coating film having good storage stability, is capable of maintaining high adhesion under relatively low temperature curing conditions, and is also capable of exhibiting high conductivity. The photosensitive conductive paste contains (A) conductive particles, (B) a photosensitie component, (C) a photopolymerization initiator and (D) an epoxy resin, wherein the epoxy resin (D) has an epoxy equivalent weight of 200-500 g/equivalent.

Abstract: A conductive paste can form a minute conductive pattern having markedly high adhesion and exhibiting conductivity at relatively low temperatures. The conductive paste contains: a compound (A) having a primary amino group, a secondary amino group, and a tertiary amino group; a compound (B) having a carboxyl group; and a conductive filler (C).

Abstract: A photosensitive conductive paste includes an epoxy acrylate (A) including a urethane bond, a photopolymerization initiator (B), and a conductive filler (C), wherein an added amount of the conductive filler (C) is 70 to 95% by weight with respect to the total solids in the photosensitive conductive paste.

Abstract: A photosensitive conductive paste includes a dicarboxylic acid or an acid anhydride thereof (A); a compound (B) having an acid value of 40 to 200 mg KOH/g; an alicyclic compound (C); a photopolymerization initiator (D); and a conductive filler (E).

Abstract: A photosensitive conductive paste includes an epoxy acrylate (A) including a urethane bond, a photopolymerization initiator (B), and a conductive filler (C), wherein an added amount of the conductive filler (C) is 70 to 95% by weight with respect to the total solids in the photosensitive conductive paste.

Abstract: A photosensitive conductive paste includes a dicarboxylic acid or an acid anhydride thereof (A); a compound (B) having an acid value of 40 to 200 mg KOH/g; an alicyclic compound (C); a photopolymerization initiator (D); and a conductive filler (E).

Abstract: A photosensitive conductive paste provides a coating film having good storage stability, is capable of maintaining high adhesion under relatively low temperature curing conditions, and is also capable of exhibiting high conductivity. The photosensitive conductive paste contains (A) conductive particles, (B) a photosensitive component, (C) a photopolymerization initiator and (D) an epoxy resin, wherein the epoxy resin (D) has an epoxy equivalent weight of 200-500 g/equivalent.

Abstract: A conductive paste includes: composite particles (A) formed by coating a surface of a core material composed of an inorganic material with an antimony-containing compound; a compound (B) having an acid value of 30 to 250 mg KOH/g; and a conductive filler (C).

Abstract: The present invention relates to a high dielectric constant paste composition comprising (A) inorganic particles having a perovskite crystal structure or a complex perovskite crystal structure, (B) a compound represented by any one of the general formulas (1) to (4) shown below, and (C) an organic solvent. The present invention provides a high dielectric constant paste composition for producing a high dielectric constant dielectric composition which has high insulation reliability and exhibits satisfactory resistance in a high-temperature high-humidity bias test.

Abstract: The present invention relates to a high dielectric constant paste composition comprising (A) inorganic particles having a perovskite crystal structure or a complex perovskite crystal structure, (B) a compound represented by any one of the general formulas (1) to (4) shown below, and (C) an organic solvent. The present invention provides a high dielectric constant paste composition for producing a high dielectric constant dielectric composition which has high insulation reliability and exhibits satisfactory resistance in a high-temperature high-humidity bias test.