Patents by Inventor Tsukuru Obata

Tsukuru Obata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer processing apparatus
    Patent number: 9679789
    Abstract: A wafer in which a modified layer is internally formed along planned dividing lines is placed on a placement table and a water tank allows the wafer placed on the placement table to be submerged in cleaning water. An ultrasonic supply unit supplies ultrasonic waves to the wafer submerged in the cleaning water. By the ultrasonic waves supplied by the ultrasonic supply unit, the wafer is divided along the planned dividing lines and is turned into small pieces to generate plural chips and the generated chips are cleaned.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: June 13, 2017
    Assignee: Disco Corporation
    Inventor: Tsukuru Obata
  • WAFER PROCESSING APPARATUS
    Publication number: 20150162222
    Abstract: A wafer in which a modified layer is internally formed along planned dividing lines is placed on a placement table and a water tank allows the wafer placed on the placement table to be submerged in cleaning water. An ultrasonic supply unit supplies ultrasonic waves to the wafer submerged in the cleaning water. By the ultrasonic waves supplied by the ultrasonic supply unit, the wafer is divided along the planned dividing lines and is turned into small pieces to generate plural chips and the generated chips are cleaned.
    Type: Application
    Filed: December 1, 2014
    Publication date: June 11, 2015
    Inventor: Tsukuru Obata