Patents by Inventor Tsun-En KUO

Tsun-En KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DEVICE AND METHOD FOR PRESSURE FORCE INSPECTION
    Publication number: 20220082461
    Abstract: A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. Pressure forces applied by the cone against the wafer are detected by pressure sensors. The pressure forces include a maximum pressure and a minimum pressure. Clamping the wafer is stopped when a difference between the maximum pressure and the minimum pressure is higher than a predetermined value.
    Type: Application
    Filed: November 29, 2021
    Publication date: March 17, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yung Chang HUANG, Tsun-En KUO
  • Device and method for pressure force inspection
    Patent number: 11187602
    Abstract: A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. A pressure force applied by the cone against the wafer is detected. Stopping clamping the wafer when the pressure force is higher than a predetermined value.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: November 30, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yung-Chang Huang, Tsun-En Kuo
  • Device and method for contact state inspection
    Patent number: 10692754
    Abstract: A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. First pressure forces of contacts of the cup applied by the wafer is detected. The first pressure forces are respective compared with corresponding predetermined pressure ranges.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: June 23, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yung-Chang Huang, Tsun-En Kuo
  • DEVICE AND METHOD FOR CONTACT STATE INSPECTION
    Publication number: 20200020574
    Abstract: A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. First pressure forces of contacts of the cup applied by the wafer is detected. The first pressure forces are respective compared with corresponding predetermined pressure ranges.
    Type: Application
    Filed: October 3, 2018
    Publication date: January 16, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yung-Chang HUANG, Tsun-En KUO
  • DEVICE AND METHOD FOR PRESSURE FORCE INSPECTION
    Publication number: 20200018659
    Abstract: A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. A pressure force applied by the cone against the wafer is detected. Stopping clamping the wafer when the pressure force is higher than a predetermined value.
    Type: Application
    Filed: April 30, 2019
    Publication date: January 16, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yung-Chang HUANG, Tsun-En KUO