Patents by Inventor Tsun-Hu Chiu

Tsun-Hu Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mechanical transmission system for automatically breaking off in response to earthquake and method thereof
    Patent number: 6670889
    Abstract: A mechanical transmission system for transmitting a wafer to a semiconductor manufacturing machine and being able to break off automatically in response to an earthquake via receiving a control signal generated by an earthquake detecting device is provided. The system includes a mechanical transmission device for transmitting the wafer to the semiconductor manufacturing machine, a warning device for generating a warning signal in response to the control signal, and a control circuit electrically coupling to the mechanical transmission device and breaking off in response to the control signal for avoiding the damage of the mechanical transmission device or the semiconductor-manufacturing machine caused by the earthquake.
    Type: Grant
    Filed: June 4, 2002
    Date of Patent: December 30, 2003
    Assignee: Winbond Electronics Corp.
    Inventors: Yi-Chang Luan, Tsun-Hu Chiu, Chu-Long Hsueh
  • Mechanical transmission system for automatically breaking off in response to earthquake and method thereof
    Publication number: 20030122681
    Abstract: A mechanical transmission system for transmitting a wafer to a semiconductor manufacturing machine and being able to break off automatically in response to an earthquake via receiving a control signal generated by an earthquake detecting device is provided. The system includes a mechanical transmission device for transmitting-the wafer to the semiconductor manufacturing machine, a warning device for generating a warning signal in response to the control signal, and a control circuit electrically coupling to the mechanical transmission device and breaking off in response to the control signal for avoiding the damage of the mechanical transmission device or the semiconductor-manufacturing machine caused by the earthquake.
    Type: Application
    Filed: June 4, 2002
    Publication date: July 3, 2003
    Applicant: Winbond Electronics Corp.
    Inventors: Yi-Chang Luan, Tsun-Hu Chiu, Chu-Long Hsueh