Patents by Inventor Tsun-Jung Huang

Tsun-Jung Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shoe outsole manufacturing methods
    Publication number: 20070079527
    Abstract: A shoe having a fabric outsole and method for manufacturing are disclosed. In described embodiments, a shoe outsole with a bottom surface wherein an adhesive is applied to at least a portion of the bottom surface of the shoe outsole and a plurality of fibers are embedded within the adhesive. In the described method embodiment, once the adhesive is applied to the outsole, fibers are sifted down through an electrostatic field onto the adhesive. Once sufficient fibers have been embedded, the adhesive is cured and then cooled.
    Type: Application
    Filed: May 1, 2006
    Publication date: April 12, 2007
    Applicant: The Topline Corporation
    Inventors: Paul Daniels, Tsun-Jung Huang
  • Fabric shoe outsole manufacturing methods by electrostatic flocking
    Patent number: 7056558
    Abstract: A shoe having a fabric outsole and method for manufacturing are disclosed. In described embodiments, a shoe outsole with a bottom surface wherein an adhesive is applied to at least a portion of the bottom surface of the shoe outsole and a plurality of fibers are embedded within the adhesive. In the described method embodiment, once the adhesive is applied to the outsole, fibers are sifted down through an electrostatic field onto the adhesive. Once sufficient fibers have been embedded, the adhesive is cured and then cooled.
    Type: Grant
    Filed: September 10, 2003
    Date of Patent: June 6, 2006
    Assignee: The Topline Corporation
    Inventors: Paul W. Daniels, Tsun-Jung Huang
  • Shoe outsole and methods for manufacturing same
    Publication number: 20040163284
    Abstract: A shoe having a fabric outsole and method for manufacturing are disclosed. In described embodiments, a shoe outsole with a bottom surface wherein an adhesive is applied to at least a portion of the bottom surface of the shoe outsole and a plurality of fibers are embedded within the adhesive. In the described method embodiment, once the adhesive is applied to the outsole, fibers are sifted down through an electrostatic field onto the adhesive. Once sufficient fibers have been embedded, the adhesive is cured and then cooled.
    Type: Application
    Filed: February 24, 2003
    Publication date: August 26, 2004
    Inventors: Paul W. Daniels, Tsun-Jung Huang
  • Shoe outsole manufacturing methods
    Publication number: 20040163283
    Abstract: A shoe having a fabric outsole and method for manufacturing are disclosed. In described embodiments, a shoe outsole with a bottom surface wherein an adhesive is applied to at least a portion of the bottom surface of the shoe outsole and a plurality of fibers are embedded within the adhesive. In the described method embodiment, once the adhesive is applied to the outsole, fibers are sifted down through an electrostatic field onto the adhesive. Once sufficient fibers have been embedded, the adhesive is cured and then cooled.
    Type: Application
    Filed: September 10, 2003
    Publication date: August 26, 2004
    Inventors: Paul W. Daniels, Tsun-Jung Huang