Patents by Inventor Tsunamasa Shioya

Tsunamasa Shioya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10987724
    Abstract: A sand mold shaping material contains an aggregate comprising inorganic particles, and microcapsules enclosing a binder which causes the aggregate to bind. The binder is a liquid binder that is in a liquid phase at room temperature, and is enclosed in an outer shell comprising a resin that forms the microcapsule. The sand mold shaping material is in a dry state when used to fill a molding die for shaping.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: April 27, 2021
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Nobuki Matsuo, Munemasa Taketani, Koji Shinya, Kojiro Akao, Tsunamasa Shioya
  • Publication number: 20200101523
    Abstract: A sand mold shaping material contains an aggregate comprising inorganic particles, and microcapsules enclosing a binder which causes the aggregate to bind. The binder is a liquid binder that is in a liquid phase at room temperature, and is enclosed in an outer shell comprising a resin that forms the microcapsule. The sand mold shaping material is in a dry state when used to fill a molding die for shaping.
    Type: Application
    Filed: March 30, 2018
    Publication date: April 2, 2020
    Inventors: Nobuki Matsuo, Munemasa Taketani, Koji Shinya, Kojiro Akao, Tsunamasa Shioya
  • Publication number: 20090202775
    Abstract: A skinned, resin-molded article includes a base material having a recessed part, a skin material having an insertion portion inserted along a sidewall of the base material, and a foam material filled in the recessed part. The insertion portion has a planar part held in contact with the sidewall, and a groove disposed toward a distal end thereof. The sidewall has a projection lockingly tightly engaged in the groove, thereby positioning the skin material in place.
    Type: Application
    Filed: February 6, 2009
    Publication date: August 13, 2009
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Satoru Iriyama, Hideaki Yu, Tsunamasa Shioya