Patents by Inventor Tsuneaki Mikawa

Tsuneaki Mikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Age-hardening type special Cu alloy
    Patent number: 5215711
    Abstract: An age-hardening type special Cu alloy prepared by compounding 0.1 to 5% by weight of Ni, 0.01 to 7% by weight of Si, 0.01 to 10% by weight of Fe, 0.01 to 7% by weight of Ti and 0.001 to 1% by weight of B in Cu as the main component.This alloy is improved in the electrical conductivity, heat-conductivity and mechanical properties such as, in particular, the hardness and resiliency compared to the hitherto known alloys, and is useful for electronic parts.
    Type: Grant
    Filed: April 6, 1992
    Date of Patent: June 1, 1993
    Inventor: Tsuneaki Mikawa
  • Particle dispersion-strengthened copper alloy
    Patent number: 5041176
    Abstract: A particle dispersion-strengthened copper alloy consisting essentially of copper as the main component, 0.1-10% by weight of nickel, 0.1-10% by weight of tin, 0.05-5% by weight of silicon, 0.01-5% by weight of iron, and 0.0001-1% by weight of boron. The alloy is suitable for use in electronic parts due to its good electrical conductivity, heat conductivity, strength, hardness, plating ability, soldering ability, elasticity, and excellent corrosion resistance including resistance to acids.
    Type: Grant
    Filed: September 28, 1990
    Date of Patent: August 20, 1991
    Assignee: Japan Mikaloy Co., Ltd.
    Inventor: Tsuneaki Mikawa