Patents by Inventor Tsuneari Fukada

Tsuneari Fukada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Alignment method, exposure apparatus and device fabrication method
    Patent number: 7187429
    Abstract: An alignment mark selection method includes steps of determining whether an alignment mark provided in a shot area on a substrate is selectable with respect to each alignment mark, and selecting alignment marks from alignment marks determined to be selectable in the determining step.
    Type: Grant
    Filed: May 20, 2005
    Date of Patent: March 6, 2007
    Assignee: Canon Kabushiki Kaisha
    Inventor: Tsuneari Fukada
  • Alignment method, exposure apparatus and device fabrication method
    Patent number: 6963389
    Abstract: An alignment mark selection method includes steps of determining whether an alignment mark provided in a shot area on a substrate is selectable with respect to each alignment mark, and selecting alignment marks from alignment marks determined to be selectable in the determining step.
    Type: Grant
    Filed: June 21, 2002
    Date of Patent: November 8, 2005
    Assignee: Canon Kabushiki Kaisha
    Inventor: Tsuneari Fukada
  • Alignment method, exposure apparatus and device fabrication method
    Publication number: 20050219492
    Abstract: An alignment mark selection method includes steps of determining whether an alignment mark provided in a shot area on a substrate is selectable with respect to each alignment mark, and selecting alignment marks from alignment marks determined to be selectable in the determining step.
    Type: Application
    Filed: May 20, 2005
    Publication date: October 6, 2005
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Tsuneari Fukada
  • Alignment method, exposure apparatus and device fabrication method
    Publication number: 20030003677
    Abstract: Among alignment marks accompanying respective shots, alignment marks are selected based on a shot layout, a wafer outer shape and a predetermined logic, in alignment mark units. Then, the position of selected alignment mark is measured, and alignment is performed based on the result of measurement, for overlay exposure for the respective shots formed on a substrate. The selection of alignment mark is made in consideration of a distance from an edge of the substrate and a distance from a border between a shot area and a non-shot area regarding each alignment mark.
    Type: Application
    Filed: June 21, 2002
    Publication date: January 2, 2003
    Applicant: Canon Kabushiki Kaisha
    Inventor: Tsuneari Fukada