Abstract: The present invention has an object to obtain a small-size, high-temperature and high-pressure treatment device adapted to treat semiconductor wafers. The high-temperature and high-pressure device of the invention is intended to treat semiconductor wafers in an atmosphere of high-temperature and high-pressure gas, and comprises a pressure vessel having at a lower portion thereof an opening for putting the semiconductor wafers in and out, a lower lid disposed so as to be vertically movable for opening and closing the lower opening, wafer transfer means for stacking and unstacking the semiconductor wafers onto and from the lower lid, and a heater attached to the lower lid for heating the semiconductor wafers.

Abstract: The present invention has an object to obtain a small-size, high-temperature and high-pressure treatment device adapted to treat semiconductor wafers. The high-temperature and high-pressure device of the invention is intended to treat semiconductor wafers in an atmosphere of high-temperature and high-pressure gas, and comprises a pressure vessel having at a lower portion thereof an opening for putting the semiconductor wafers in and out, a lower lid disposed so as to be vertically movable for opening and closing the lower opening, wafer transfer means for stacking and unstacking the semiconductor wafers onto and from the lower lid, and a heater attached to the lower lid for heating the semiconductor wafers.

Abstract: To provide a high-temperature and high-pressure treatment device in which articles to be treated such as wafers of LSI semiconductors can be transported in a stable attitude, and the entire apparatus is made compact.

Abstract: An inner vessel 16 capable of hermetically surrounding a portion for disposing works W is disposed to the inside of a pressure vessel 4, the inner vessel 16 is provided with a gas introducing portion 18 at a lower position thereof free from the effect a high temperature atmosphere formed by heaters 11 and 12, a filter 20 is disposed to the gas introducing portion 18 and a check valve 19 is disposed to the inner vessel 16 for allowing a gas to flow unidirectionally from the inside to the outside thereof.

Abstract: In a high-temperature, high-pressure treatment method for semiconductor wafer for charging a wafer-like semiconductor material in a pressure vessel, forcing and pressurizing an inert gas such as argon thereto, and raising the temperature by heating by use of an electric resistance type heater, wafers are vertically stacked in the treatment chamber, and the heater is arranged within the treatment chamber to perform the treatment while supplying a heating power by DC to the heater, whereby generation of particles from the heater is suppressed.

Abstract: Method and apparatus for removing a jammed billet from a container on a metal extrusion press in which a billet in a container is extruded through a die at the fore end of a die stem by relative movement of the die stem admitted into the container while the billet and container are held stationary relative to each other. Should the billet in the container jam, pressure is applied on the rear end face of the billet in the axial pressing direction thereby extruding the billet in the counter-pressing axial direction.

Abstract: A hot isostatic press apparatus wherein a material to be processed such as preliminarily shaped metal powder is charged into a high pressure vessel provided with a heater and the material to be processed is pressed by superhigh pressure of fluid or gas sealed into the vessel and heating by a heater. The apparatus includes a main station including a high pressure vessel, a movable cover, a member for moving the material to be processed; one or more auxiliary stations including an inserting station, a preheating station, a removing station, etc.; a sealed tank; and transfer mechanisms for the material to be processed. The apparatus also includes a seal leakage detector.

Abstract: An indirect extrusion press including a die assembly having a loose die detachably mounted on a die stem and axially movable relative to a billet container for extruding a billet through a die hole, and a die handling mechanism for transferring the die assembly between the press center and a position outside the press machine, the indirect extrusion press including a reduced diameter portion provided in the rear end portion of the die stem and defining a stepped wall portion; a loose die detachably mounted on the end face of the reduced diameter portion; and a detachable cleaning ring loosely fitted on the reduced diameter portion of the die stem in abutting engagement with the stepped wall portion and in axially spaced relation with the loose die, the cleaning ring being in sliding engagement with the inner periphery of the billet container in the extruding phase of the press operation to remove container shells.

Abstract: A billet scalper including a die assembly with a scalping die, a pressing mechanism with a stem member in axial alignment with the scalping die for pressing a billet thereinto, and a chip ejector located around the circumference of the scalping die and movable axially back and forth beyond a free end face of the scalping die to remove chips therefrom. The die assembly including the scalping die is movable between a position at the center of the scalper and an outer receded position to permit easy maintenance and service of the die assembly including replacements and cleaning of scalping dies. In a preferred form, the scalper is constructed integrally with an extrusion press to perform the billet scalping operation in timed relation with the extruding operation to shorten the time of press cycle.

Abstract: A mandrel cleaning device capable of automatically performing cleaning operation in an extrusion press of the type which has a pressurizing stem for pressing a billet in a container toward a die and a mandrel axially slidable in and relative to the pressurizing stem for determining the internal shape of a hollow extruding material, the mandrel cleaning device having a rotary mechanism for rotating the mandrel about its axis, a grinder mechanism adapted to grind a tip portion at the fore end of the mandrel, and a transfer mechanism for moving the grinder mechanism toward and away from the mandrel.