Abstract: The object of the present invention is to provide an assembly, wafer holding assembly and attaching structure thereof, wherein sufficient air-tightness is assured during prolonged cycles of temperature rises and uninstallations and replacements of the assemblies are possible. The joined assembly, according to the present invention, comprises a plate-shaped ceramic body; a ring-shaped member; and a hollow metal cylinder with one end thereof joined to the bottom surface of the plate-shaped ceramic body via a metal joint and the other end thereof joined to the ring-shaped member; wherein, the hollow metal cylinder having a shape to relax the stress caused by the differential thermal expansion between the plate-shaped ceramic body and the ring-shaped member.

Abstract: A wafer heating apparatus which is capable of quickly cooling by improving the cooling rate of the heater section is provided. The wafer heating apparatus comprises a plate-shaped member having two opposing principal surfaces with one of the principal surfaces serving as a mounting surface to mount a wafer thereon and the other principal surface having a band-shaped resistive heating member formed thereon, power feeder terminals connected to the resistive heating member for supplying electric power to the resistive heating member, a casing provided to cover the power feeder terminals on the other surface of the plate-shaped member and a nozzle of which tip faces the other surface of the plate-shaped member for cooling the plate-shaped member, wherein the position of the tip of the nozzle as projected onto the other surface of the plate-shaped member is located between the bands of the resistive heating member.

Abstract: A wafer heating apparatus which is capable of quickly cooling by improving the cooling rate of the heater section is provided. The wafer heating apparatus comprises a plate-shaped member having two opposing principal surfaces with one of the principal surfaces serving as a mounting surface to mount a wafer thereon and the other principal surface having a band-shaped resistive heating member formed thereon, power feeder terminals connected to the resistive heating member for supplying electric power to the resistive heating member, a casing provided to cover the power feeder terminals on the other surface of the plate-shaped member and a nozzle of which tip faces the other surface of the plate-shaped member for cooling the plate-shaped member, wherein the position of the tip of the nozzle as projected onto the other surface of the plate-shaped member is located between the bands of the resistive heating member.

Abstract: A wafer heating apparatus which is capable of quickly cooling by improving the cooling rate of the heater section is provided. The wafer heating apparatus comprises a plate-shaped member having two opposing principal surfaces with one of the principal surfaces serving as a mounting surface to mount a wafer thereon and the other principal surface having a band-shaped resistive heating member formed thereon, power feeder terminals connected to the resistive heating member for supplying electric power to the resistive heating member, a casing provided to cover the power feeder terminals on the other surface of the plate-shaped member and a nozzle of which tip faces the other surface of the plate-shaped member for cooling the plate-shaped member, wherein the position of the tip of the nozzle as projected onto the other surface of the plate-shaped member is located between the bands of the resistive heating member.

Abstract: It is an object of the present invention to provide an electrostatic chuck which has a good separation response and scarcely causes gas leakage while keeping the uniformly heating property and high attracting capability for a substrate and a treatment apparatus using the chuck.

Abstract: The object of the present invention is to provide an assembly, wafer holding assembly and attaching structure thereof, wherein sufficient air-tightness is assured during prolonged cycles of temperature rises and uninstallations and replacements of the assemblies are possible. The joined assembly, according to the present invention, comprises a plate-shaped ceramic body; a ring-shaped member; and a hollow metal cylinder with one end thereof joined to the bottom surface of the plate-shaped ceramic body via a metal joint and the other end thereof joined to the ring-shaped member; wherein, the hollow metal cylinder having a shape to relax the stress caused by the differential thermal expansion between the plate-shaped ceramic body and the ring-shaped member.

Abstract: An electrostatic chuck is provided which includes a circular ceramic plate having an electrostatic attractive electrode, a mounting surface for supporting a waferhich which is formed on one of the main surfaces of the circular ceramic plate, an annular gas groove formed on the periphery of the mounting surface in the form of concentric circles with a gas inlet communicating with the annular gas groove, and a circular gas recess formed inside the ceramic plate and surrounded by the annular gas groove with a gas inlet communicating with the circular gas recess, wherein the annular gas groove and the circular gas recess are independently separated from each other by an annular rib protrusion, with a plurality of dotted protrusions being formed within both the annular gas groove and the circular gas recess.

Abstract: A heater that is capable of heating an object to a desired temperature in a short period while minimizing the temperature difference the surface of the object is provided. The heater comprising a plate having a first surface and a second surface, the first surface being a mount surface whereon an object is placed and having a resistive heating member; wherein the resistive heating member is formed in a continuous band having arc bands located on one of two concentric circles of different radii, at least one arc band located on the other circle, and linkage arc band that connects the arc band located on the one circle and the arc band located on the other circle; while the distance between the adjacent linkage arc bands is smaller than the distance between the arc band located on the one circle and the arc band located on the other circle.

Abstract: Provided is a heater capable of having a high uniform heating characteristic and substantially equally heating a wafer etc. mounted thereon, and a wafer heating device using the same, as well as a method thereof. The heater comprises a plate shaped body, a belt-like resistance heating element formed on the plate shaped body and having a channel for adjusting the resistance value, and a positioning mark formed on the plate shaped body, which serves as a reference for positioning the channel.

Abstract: A wafer heating apparatus which is capable of quickly cooling by improving the cooling rate of the heater section is provided. The wafer heating apparatus comprises a plate-shaped member having two opposing principal surfaces with one of the principal surfaces serving as a mounting surface to mount a wafer thereon and the other principal surface having a band-shaped resistive heating member formed thereon, power feeder terminals connected to the resistive heating member for supplying electric power to the resistive heating member, a casing provided to cover the power feeder terminals on the other surface of the plate-shaped member and a nozzle of which tip faces the other surface of the plate-shaped member for cooling the plate-shaped member, wherein the position of the tip of the nozzle as projected onto the other surface of the plate-shaped member is located between the bands of the resistive heating member.

Abstract: The invention is to provide a heater capable of having a high uniform heating characteristic and substantially equally heating a wafer etc. mounted thereon, and a wafer heating device using the same, as well as a method thereof. In order to solve the above object, the invention provides a heater which comprises a plate shaped body, a belt-like resistance heating element formed on the plate shaped body and having a channel for adjusting the resistance value, and a positioning mark formed on the plate shaped body, which serves as a reference for positioning the channel.

Abstract: An electrostatic chuck is provided which includes a circular ceramic plate having an electrostatic attractive electrode, a mounting surface for supporting a wafer which is formed on one of the main surfaces of the circular ceramic plate, an annular gas groove formed on the periphery of the mounting surface in the form of concentric circles with a gas inlet communicating with the annular gas groove, and a circular gas recess formed inside the ceramic plate and surrounded by the annular gas groove with a gas inlet communicating with the circular gas recess, wherein the annular gas groove and the circular gas recess are independently separated from each other by an annular rib protrusion, with a plurality of dotted protrusions being formed within both the annular gas groove and the circular gas recess.

Abstract: An electrostatic chuck is provided which includes a circular ceramic plate having an electrostatic attractive electrode, a mounting surface for supporting a waferhich is formed on one of the main surfaces of the circular ceramic plate, an annular gas groove formed on the periphery of the mounting surface in the form of concentric circles with a gas inlet communicating with the annular gas groove, and a circular gas recess formed inside the ceramic plate and surrounded by the annular gas groove with a gas inlet communicating with the circular gas recess, wherein the annular gas groove and the circular gas recess are independently separated from each other by an annular rib protrusion, with a plurality of dotted protrusions being formed within both the annular gas groove and the circular gas recess.

Abstract: It is an object of the present invention to provide an electrostatic chuck which has a good separation response and scarcely causes gas leakage while keeping the uniformly heating property and high attracting capability for a substrate and a treatment apparatus using the chuck.

Abstract: A heater that is capable of heating a object to a desired temperature in a short period while minimizing the temperature difference the surface of the object is provided. The heater comprising a plate having a first surface and a second surface, the first surface being a mount surface whereon an object is placed and having a resistive heating member; wherein the resistive heating member is formed in a continuous band having arc bands located on one of two concentric circles of different radii, at least one arc band located on the other circle, and linkage arc band that connects the arc band located on the one circle and the arc band located on the other circle; while the distance between the adjacent linkage arc bands is smaller than the distance between the arc band located on the one circle and the arc band located on the other circle.

Abstract: [Problems]In a ceramic heater comprising a heating face at one main side of a plate-shaped ceramic body and arc-shaped resistance exothermic body at another main side of it, there has been problems that when the rapid raising and lowering of temperature are repeated, cracks are generated between the plate-shaped ceramic body and the resistance exothermic body, thus a wafer cannot be uniformly heated, and the resistance exothermic body snaps not to heat the ceramic heater. And there has been problems that a difference of temperature in the wafer W can't be minimized because a space is formed between each of resistance exothermic bodies in each zone provided in a ceramic heater.

Abstract: The invention is to provide a heater capable of having a high uniform heating characteristic and substantially equally heating a wafer etc. mounted thereon, and a wafer heating device using the same, as well as a method thereof. In order to solve the above object, the invention provides a heater which comprises a plate shaped body, a belt-like resistance heating element formed on the plate shaped body and having a channel for adjusting the resistance value, and a positioning mark formed on the plate shaped body, which serves as a reference for positioning the channel.

Abstract: The present wafer supporting member includes a supporting part composed of a planar insulating sheet having a pair of main surfaces, one serving as a mounting surface for mounting a wafer and the other having an adsorption electrode; a resin layer part provided below the adsorption part and a conductive base part provided below the resin layer part wherein the adsorption part has a thickness in a range of 0.02 to 10.5 mm, preferably 0.02 to 2.0 mm. The wafer supporting member further comprises a heater part provided with an insulating resin layer having heaters embedded therein between the resin layer part and the conductive base part. On a surface of the insulating resin layer concave portions are formed and filled with a resin having a composition different from that of the insulating resin layer in order to embed the concave portions.

Abstract: To provide a wafer heating apparatus that can measure a surface temperature of a wafer accurately and responsively. A front surface of a ceramic plate 2 serves as a mounting surface on which a wafer is placed, and a rear surface or an inner portion of the ceramic plate 2 is formed with a resistance heating element 5. A recess 9 is formed in the rear surface of the ceramic plate 2. A temperature measuring member formed of a temperature sensor 8a and leads 8 is inserted in the recess 9 so as to be held by filling 17. In the wafer heating apparatus, a length along the leads from the front of the protective tube to a point where the leads are exposed from the filling is set to 5 to 30 times an outer diameter of the protective tube.

Abstract: An electrostatic chuck is provided which includes a circular ceramic plate having an electrostatic attractive electrode, a mounting surface for supporting a waferhich is formed on one of the main surfaces of the circular ceramic plate, an annular gas groove formed on the periphery of the mounting surface in the form of concentric circles with a gas inlet communicating with the annular gas groove, and a circular gas recess formed inside the ceramic plate and surrounded by the annular gas groove with a gas inlet communicating with the circular gas recess, wherein the annular gas groove and the circular gas recess are independently separated from each other by an annular rib protrusion, with a plurality of dotted protrusions being formed within both the annular gas groove and the circular gas recess.