Abstract: Provided is an electromagnetic wave shielding film capable of reducing a space formed between the electromagnetic wave shielding film and an electronic component on a wiring substrate and to increase an electromagnetic wave shielding effect. An electromagnetic wave shielding film 1 includes a conductive layer 3 having stretchability and a property of hardly returning to an original state thereof when once stretched, and an adhesion layer 4 formed on one surface of the conductive layer 3 and having insulating properties. The conductive layer 3 is made of a conductive composition, including a resin having stretchability and a property of hardly returning to an original state thereof when once stretched and a conductive filler filled with the resin. The resin has a tensile permanent set of 2.5% or more and 90% or less.

Abstract: A bioelectrode (1) includes: a main electrode film (3); a nonpolarizable electrode film (4) disposed on one surface of the main electrode film (3); and a conductive gel film (5) disposed on the opposite surface of the nonpolarizable electrode film (4) from the main electrode film. The nonpolarizable electrode film (4) is constituted by an electrode film that contains supported silver chloride, the supported silver chloride including (i) a support and (ii) silver chloride supported on the support.

Abstract: A stretchable conductive film for textiles 1 includes a stretchable conductive layer 3, and a hot-melt adhesive agent layer 4 formed on one surface of the stretchable conductive layer 3. The stretchable conductive film for textiles 1 may also include a first peel film 2 formed on a surface of the stretchable conductive layer 3 on the opposite side from the hot-melt adhesive agent layer 4 side, and a second peel film 5 formed on a surface of the hot-melt adhesive agent layer 4 on the opposite side from the stretchable conductive layer 3 side.

Abstract: A silver chloride paste contains: a binder resin; and supported silver chloride that includes (i) a support and (ii) silver chloride supported on the support. The binder resin is, for example, a polyester resin. The support is, for example, silica.

Abstract: A stretchable conductive film for textiles 1 includes a stretchable conductive layer 3, and a hot-melt adhesive agent layer 4 formed on one surface of the stretchable conductive layer 3. The stretchable conductive film for textiles 1 may also include a first peel film 2 formed on a surface of the stretchable conductive layer 3 on the opposite side from the hot-melt adhesive agent layer 4 side, and a second peel film 5 formed on a surface of the hot-melt adhesive agent layer 4 on the opposite side from the stretchable conductive layer 3 side.

Abstract: A bioelectrode (1) includes: a main electrode film (3); a nonpolarizable electrode film (4) disposed on one surface of the main electrode film (3); and a conductive gel film (5) disposed on the opposite surface of the nonpolarizable electrode film (4) from the main electrode film. The nonpolarizable electrode film (4) is constituted by an electrode film that contains supported silver chloride, the supported silver chloride including (i) a support and (ii) silver chloride supported on the support.

Abstract: A silver chloride paste contains: a binder resin; and supported silver chloride that includes (i) a support and (ii) silver chloride supported on the support. The binder resin is, for example, a polyester resin. The support is, for example, silica.

Abstract: Provided is an electromagnetic wave shielding film capable of reducing a space formed between the electromagnetic wave shielding film and an electronic component on a wiring substrate and to increase an electromagnetic wave shielding effect. An electromagnetic wave shielding film 1 includes a conductive layer 3 having stretchability and a property of hardly returning to an original state thereof when once stretched, and an adhesion layer 4 formed on one surface of the conductive layer 3 and having insulating properties. The conductive layer 3 is made of a conductive composition, including a resin having stretchability and a property of hardly returning to an original state thereof when once stretched and a conductive filler filled with the resin. The resin has a tensile permanent set of 2.5% or more and 90% or less.

Abstract: A stretchable cable 1 includes a sheet-shaped stretchable base material 2 exhibiting elasticity and elongated in one direction, and a stretchable wiring 3 formed on one surface of the stretchable substrate 2 and exhibiting elasticity. The stretchable base material 2 is made of a material exhibiting elasticity. The stretchable wiring 3 is made of a conductive composition including elastomer and a conductive filler filling the elastomer.

Abstract: A stretchable cable 1 includes a sheet-shaped stretchable base material 2 exhibiting elasticity and elongated in one direction, and a stretchable wiring 3 formed on one surface of the stretchable substrate 2 and exhibiting elasticity. The stretchable base material 2 is made of a material exhibiting elasticity. The stretchable wiring 3 is made of a conductive composition including elastomer and a conductive filler filling the elastomer.

Abstract: A conductive sheet 10 includes a peeling film 11 and a conductive film 12. The conductive film 12 is formed on one surface of the peeling film 11. The conductive film 12 is made of conductive composition. The conductive composition contains an elastomer and a dendrite-shaped conductive filler filled in the elastomer.

Abstract: The invention provides a conductive, flexure-resistant electromagnetic-shielded flexible printed circuit assembly obtainable by forming a copper foil circuit on a heat-resistant plastic film, disposing successively thereon an undercoat layer, a metal-powder-containing electromagnetic paste shield layer and an overcoat layer, with the ground pattern of the copper foil circuit being electrically connected to the above shield layer through the undercoat layer at appropriate intervals.

Abstract: Novel compounds, 1,2-N-acyl-N-methylene-ethylenediamines of formula (I) are useful as dispersants, rust inhibitors, curing promoters for epoxy resins, electroconductivity-imparting agents, mold lubricants, etc. ##STR1## where R is a hydrogen atom or a hydrocarbon group. An electroconductive paste with excellent electroconductivity and much improved long-term stability is obtained by mixing 100 parts by weight of a thermosetting resin with from 250 to 900 parts by weight of a metal filler and from 1 to 50 parts by weight of the 1,2-N-acyl-N-methylene-ethylenediamine; or by adding from 250 to 900 parts by weight of a metal filler coated with the 1,2-N-acyl-N-methylene-ethylenediamine to 100 parts by weight of a thermosetting resin.

Abstract: The invention relates to an electroconductive coating composition with excellent conductivity, adhesion to copper foil and solder dip resistance which is suitable for the formation of a jumper circuit and an electromagnetic shield layer, a printed circuit board fabricated with the above composition, and a durable electromagnetic-shielded flexible printed circuit assembly, wherein said coating composition comprises, by weight, 100 parts of copper metal powder coated with 0.05-0.2 parts of titanate or/and zirconate, 5-30 parts of resole phenolic resin, 0.5-4 parts of a chelating agent, 0.1-5 parts of an adhesion improving agent and 0.5-7 parts of a conductivity improving agent. This composition is less expensive than the silver paste, superior to the latter in the conductivity and adhesion to copper foil of the coating film and in solder dip resistance, thus being suited for the construction of a jumper circuit and an electromagnetic shield layer. It lends itself well to the mounting of IC, MSI, LSI, etc.

Abstract: The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.

Abstract: The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.

Abstract: The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.

Abstract: A printed circuit board capable of preventing electromagnetic interference comprises a base plate composed of an insulating material. On the main surface of the base plate, a first electric conductive layer is formed by etching copper foil, which includes a signal electrode portion and a ground electrode portion. On the first electric conductive layer, an insulating layer such as a solder resist film is formed except for a part of the ground electrode portion, and on this layer, a second electric conductive layer is formed by screen-printing a copper ink so as to cover almost all of the first electric conductive layer. A part of the second electric conductive layer is connected to the ground electrode portion of the first electric conductive layer so that the second electric conductive layer acts as an electromagnetic shield. The copper ink is a mixture of copper powder, binder and other materials. A solder layer may be formed on the second electric conductive layer composed of the copper ink.

Abstract: A conductive copper paste composition is adapted to yield a highly conductive film receptive to solders without pretreatment. This conductive paste comprises a copper metal powder, a resin component including a thermosetting resin, and an assortment of additives. In use, the paste is applied to an insulation substrate to a predetermined circuit pattern and cured in situ. Soldering can then be performed directly on the cured circuit. This contributes not only to the conductivity of the circuit but dispenses with the activation treatment and electroless plating or electroplating that have heretofore been essential prior to soldering. The invention, therefore, results in a substantial curtailment of production process and a proportional economic advantage. In addition, this conductive paste can be used in such applications as electrode and through-hole connections, formation of electromagnetic and electrostatic shield layers, and so on in the manufacture and assembly of electronic components and circuits.