Abstract: A sample observation device of the invention includes: a charged particle optical column for irradiating a sample with charged particle beams at a first acceleration voltage, the sample having a target part to be observed which is a concave part; an image acquisition part for acquiring an image including the target part to be observed on the basis of signals obtained by irradiation with the charged particle beams; a memory part for memorizing in advance, at each of a plurality of acceleration voltages, information indicating a relationship between a brightness ratio of a concave part to a periphery part of the concave part in a standard sample and a value indicating a structure of the concave part in the standard sample; and an operation part for obtaining a brightness ratio of the concave part to a periphery part of the concave part in the image.

Abstract: A sample observation device of the invention includes: a charged particle optical column for irradiating a sample with charged particle beams at a first acceleration voltage, the sample having a target part to be observed which is a concave part; an image acquisition part for acquiring an image including the target part to be observed on the basis of signals obtained by irradiation with the charged particle beams; a memory part for memorizing in advance, at each of a plurality of acceleration voltages, information indicating a relationship between a brightness ratio of a concave part to a periphery part of the concave part in a standard sample and a value indicating a structure of the concave part in the standard sample; and an operation part for obtaining a brightness ratio of the concave part to a periphery part of the concave part in the image.

Abstract: A defect image processing apparatus uses a normalized cross correlation to image-match a layout image (52) acquired from a design data with an image acquired by removing, from a defect image (53), the defect area portions thereof, and displays, as a result of that matching, a layout image and defect image (54) on the display device. In the displayed layout image & defect image (54), not only the layout image, the layer of which is the same as that of the defect image (53), but also a layout image of another layer is displayed superimposed on the defect image (53). This makes it easier to analyze the factor of a systematic defect having occurred due to a positional relationship with another layer.

Abstract: A desired area is extracted by directly analyzing information recorded in a design layout, an inspection recipe is generated by using this extraction method, and an efficient inspection is realized. The invention makes it easy to extract an area of a desired circuit module such as a memory mat by analyzing hierarchy information of design layout data, calculating reference frequency of each one cell in the design layout data that is its internal data, sorting the cells in order of increasing reference frequency, searching the object, and tracing its upper cell.

Abstract: The objective is to improve a classification standard. Classification standard data, in which is registered image data information that is the standard when image data is classified, and classification data, in which is registered image data information that is the result when newly input image data is classified using the classification standard data, are stored in a storage unit. An image classification device is characterized in that when any image data information of the image data that is registered in the classification data is selected by means of an input unit, and an instruction to additionally register the selected image data information in the classification standard data is input by means of the input unit, the selected image data information is additionally registered in the classification standard data.

Abstract: A defect is efficiently and effectively classified by accurately determining the state of overlap between a design layout pattern and the defect. This leads to simple identification of a systematic defect. A defective image obtained through defect inspection or review of a semiconductor device is automatically pattern-matched with design layout data. A defect is superimposed on a design layout pattern for at least one layer of a target layer, a layer immediately above the target layer, and a layer immediately below the target layer. The state of overlap of the defect is determined as within the pattern, over the pattern, or outside the pattern, and the defect is automatically classified.

Abstract: A recipe necessary for a review tool or the like to image an image is efficiently made in order to identify a cause of a failed position on the basis of a result of a failure analysis system. A pattern review tool or a recipe making tool connected to the pattern review tool includes a recipe making unit which sets imaging conditions of an image so that the image is imaged along wiring including a failed position on the basis of wiring information including the failed position input from a failure analysis system connected to the pattern review tool through a network.

Abstract: Provided is an observation condition determination support device which can improve the defect classification accuracy.

Abstract: A defect image processing apparatus uses a normalized cross correlation to image-match a layout image (52) acquired from a design data with an image acquired by removing, from a defect image (53), the defect area portions thereof, and displays, as a result of that matching, a layout image and defect image (54) on the display device. In the displayed layout image & defect image (54), not only the layout image, the layer of which is the same as that of the defect image (53), but also a layout image of another layer is displayed superimposed on the defect image (53). This makes it easier to analyze the factor of a systematic defect having occurred due to a positional relationship with another layer.

Abstract: A defect is efficiently and effectively classified by accurately determining the state of overlap between a design layout pattern and the defect. This leads to simple identification of a systematic defect. A defective image obtained through defect inspection or review of a semiconductor device is automatically pattern-matched with design layout data. A defect is superimposed on a design layout pattern for at least one layer of a target layer, a layer immediately above the target layer, and a layer immediately below the target layer. The state of overlap of the defect is determined as within the pattern, over the pattern, or outside the pattern, and the defect is automatically classified.

Abstract: Provided is an observation condition determination support device which can improve the defect classification accuracy.

Abstract: The objective is to improve a classification standard. Classification standard data, in which is registered image data information that is the standard when image data is classified, and classification data, in which is registered image data information that is the result when newly input image data is classified using the classification standard data, are stored in a storage unit. An image classification device is characterized in that when any image data information of the image data that is registered in the classification data is selected by means of an input unit, and an instruction to additionally register the selected image data information in the classification standard data is input by means of the input unit, the selected image data information is additionally registered in the classification standard data.