Patents by Inventor Tsunemoto OGATA

Tsunemoto OGATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935736
    Abstract: A substrate processing method for removing liquid on a substrate having an uneven pattern formed on a surface of the substrate and drying the substrate. The substrate processing method includes: forming a laminate having a two-layer structure including a first material in a solid state forming a lower layer and a second material in a solid state forming an upper layer, in a concave portion of the pattern; removing the second material from the concave portion by performing at least one of a heating process, a light-emitting process, and a reaction process using gas with respect to the second material to sublimate, decompose, and gas-react the second material; and removing the first material from the concave portion by performing at least one of the heating process, the light-emitting process, and the reaction process using gas with respect to the first material to sublimate, decompose, and gas-react the first material.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: March 19, 2024
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Rintaro Higuchi, Tsunemoto Ogata, Mitsunori Nakamori
  • Publication number: 20240001410
    Abstract: A substrate processing method includes forming, by supplying a cleaning liquid, a liquid film of the cleaning liquid on the substrate; forming, by supplying a rinse liquid, a liquid film of the rinse liquid on the substrate, after the forming of the liquid film of the cleaning liquid; forming, by supplying a first organic solvent, a liquid film of the first organic solvent on the substrate, after the forming of the liquid film of the rinse liquid; forming, by supplying a second organic solvent, a liquid film of the second organic solvent on the substrate, after the forming of the liquid film of the first organic solvent; and drying the substrate after the forming of the liquid film of the second organic solvent. The second organic solvent has water solubility lower than that of the first organic solvent and a boiling point higher than that of the first organic solvent.
    Type: Application
    Filed: November 2, 2021
    Publication date: January 4, 2024
    Inventor: Tsunemoto Ogata
  • Publication number: 20210313171
    Abstract: A substrate processing method for removing liquid on a substrate having an uneven pattern formed on a surface of the substrate and drying the substrate. The substrate processing method includes: forming a laminate having a two-layer structure including a first material in a solid state forming a lower layer and a second material in a solid state forming an upper layer, in a concave portion of the pattern; removing the second material from the concave portion by performing at least one of a heating process, a light-emitting process, and a reaction process using gas with respect to the second material to sublimate, decompose, and gas-react the second material; and removing the first material from the concave portion by performing at least one of the heating process, the light-emitting process, and the reaction process using gas with respect to the first material to sublimate, decompose, and gas-react the first material.
    Type: Application
    Filed: August 9, 2019
    Publication date: October 7, 2021
    Inventors: Rintaro HIGUCHI, Tsunemoto OGATA, Mitsunori NAKAMORI