Abstract: A light-emitting element module includes a light-emitting element that emits light, a base that has a depression portion in which the light-emitting element is accommodated, and a lid that covers an opening of the depression portion and is joined to the base. The lid includes a protrusion portion that protrudes on an opposite side to the base and has a hole through which the light passes and a window that is installed in the protrusion portion to block the hole and transmits the light. A surface of the window on a side of the light-emitting element is inclined with respect to a surface perpendicular to an optical axis of the light.

Abstract: A light-emitting element module includes: a Peltier device; a light-emitting element that is disposed on the Peltier device; and a package that accommodates the Peltier device and the light-emitting element, the package including a base on which the Peltier device is disposed and a lid joined to the base and. When Ts is external temperature of the package, Tv is temperature of the light-emitting element, Tc1 is temperature of the base, and Tc2 is temperature of the lid, Ts<Tc2<Tc1 is satisfied in a case of Tv<Ts.

Abstract: A light-emitting element module includes: a Peltier device that includes a first substrate, and a second substrate causing a temperature difference from the first substrate, and a power terminal disposed on the first substrate; a light-emitting element that is disposed on a side of the second substrate of the Peltier device and of which temperature is adjusted by the Peltier device; a temperature sensor that is disposed on the side of the second substrate of the Peltier device; a package that includes a base and a lid; a first external electrode that is electrically connected to the power terminal; a second external electrode that is electrically connected to the temperature sensor; and a third external electrode that is electrically connected to the light-emitting element. The third external electrode is disposed between the first and second external electrodes.

Abstract: A light-emitting element module includes: a Peltier device; a light-emitting element that is disposed on the Peltier device; and a package that accommodates the Peltier device and the light-emitting element, the package including a base on which the Peltier device is disposed and a lid joined to the base and. When Ts is external temperature of the package, Tv is temperature of the light-emitting element, Tc1 is temperature of the base, and Tc2 is temperature of the lid, Ts<Tc2<Tc1 is satisfied in a case of Tv<Ts.

Abstract: A light-emitting element module includes: a Peltier device that includes a first substrate, and a second substrate causing a temperature difference from the first substrate, and a power terminal disposed on the first substrate; a light-emitting element that is disposed on a side of the second substrate of the Peltier device and of which temperature is adjusted by the Peltier device; a temperature sensor that is disposed on the side of the second substrate of the Peltier device; a package that includes a base and a lid; a first external electrode that is electrically connected to the power terminal; a second external electrode that is electrically connected to the temperature sensor; and a third external electrode that is electrically connected to the light-emitting element. The third external electrode is disposed between the first and second external electrodes.

Abstract: A light-emitting element module includes a light-emitting element that emits light, a base that has a depression portion in which the light-emitting element is accommodated, and a lid that covers an opening of the depression portion and is joined to the base. The lid includes a protrusion portion that protrudes on an opposite side to the base and has a hole through which the light passes and a window that is installed in the protrusion portion to block the hole and transmits the light. A surface of the window on a side of the light-emitting element is inclined with respect to a surface perpendicular to an optical axis of the light.

Abstract: A light-emitting element module includes a temperature adjustment element, a light-emitting element arranged on a temperature adjustment surface of the temperature adjustment element, a metal layer arranged on the temperature adjustment surface, a relay member arranged on the temperature adjustment surface through the metal layer, a wiring layer arranged on a surface of the relay member at an opposite side to the temperature adjustment surface, a wiring to electrically connect the light-emitting element and the wiring layer, and a wiring to electrically connect a connection electrode and the wiring layer. The wiring layer has an area smaller than an area of a region where the metal layer overlaps the relay member in a plan view.

Abstract: A sensor device includes a first sensor element which detects an angular velocity around z axis and a second sensor element which detects an angular velocity around x axis, the relationship fd1>fd2 and fm1<fm2 is satisfied, when the drive frequency of the first sensor element is set to fd1, the drive frequency of the second sensor element is set to fd2, the mistuned frequency of the first sensor element is set to fm1, and the mistuned frequency of the second sensor element is set to fm2.

Abstract: A light-emitting element module includes a temperature adjustment element, a light-emitting element arranged on a temperature adjustment surface of the temperature adjustment element, a metal layer arranged on the temperature adjustment surface, a relay member arranged on the temperature adjustment surface through the metal layer, a wiring layer arranged on a surface of the relay member at an opposite side to the temperature adjustment surface, a wiring to electrically connect the light-emitting element and the wiring layer, and a wiring to electrically connect a connection electrode and the wiring layer. The wiring layer has an area smaller than an area of a region where the metal layer overlaps the relay member in a plan view.

Abstract: A vibrating device has a package having an accommodating space in the interior thereof and a gyro element and an IC chip accommodated in the accommodating space. The package has a plate-like bottom plate having an IC chip mounting area and a vibrating element mounting area. The IC chip mounting area includes an IC chip mounting surface on which the IC chip is mounted. The vibrating element mounting area is arranged in parallel with the IC chip mounting area and includes a vibrating element mounting surface on which the gyro element is mounted. The thickness of the IC chip mounting area is smaller than that of the vibrating element mounting area. The IC chip mounting surface is located closer to a bottom side than the vibrating element mounting surface.

Abstract: A sensor device includes a first sensor element which detects an angular velocity around z axis and a second sensor element which detects an angular velocity around x axis, the relationship fd1>fd2 and fm1<fm2 is satisfied, when the drive frequency of the first sensor element is set to fd1, the drive frequency of the second sensor element is set to fd2, the mistuned frequency of the first sensor element is set to fm1, and the mistuned frequency of the second sensor element is set to fm2.

Abstract: A vibrating device has a package having an accommodating space in the interior thereof and a gyro element and an IC chip accommodated in the accommodating space. The package has a plate-like bottom plate having an IC chip mounting area and a vibrating element mounting area. The IC chip mounting area includes an IC chip mounting surface on which the IC chip is mounted. The vibrating element mounting area is arranged in parallel with the IC chip mounting area and includes a vibrating element mounting surface on which the gyro element is mounted. The thickness of the IC chip mounting area is smaller than that of the vibrating element mounting area. The IC chip mounting surface is located closer to a bottom side than the vibrating element mounting surface.

Abstract: An atomic oscillator includes: a gas cell encapsulating a rubidium atom; a gas cell holding member holding the gas cell; a rubidium lamp exciting the rubidium atom in the gas cell; a lamp holding member holding the rubidium lamp; a temperature detecting means disposed in a recessed part provided to at least one of the gas cell holding member and the lamp holding member; and grease closely contacting an exterior surface of the temperature detecting means disposed in the recessed part and burying the temperature detecting means therein.