Abstract: For cooling of an electronic equipment, a heat receiving jacket, to which piping extended outside the electronic equipment is connected, is mounted to a heat generating element in the electronic equipment, a radiator, a cooling-liquid tank, a pump, and a pipe, which joins them, are constructed as an external module, and the external module is mounted externally and fixed to a housing of the electronic equipment. Cooling liquid is circulated by the pump through the heat receiving jacket, the radiator, and the tank to achieve cooling.

Abstract: A liquid cooling jacket and a system for use in an electronic apparatus, preferable in the cooling capacity or performance, with less in man-hour and manufacturing costs in need of process thereof, and applicable into a narrow space, wherein a plural number of lamination plates, each being formed through the punching process, are piled up in the width direction thereof, for each piece thereof, and are bonded with each other. A cooling liquid flows in a flow passage defined between the laminating plates, and the laminating plates themselves function as a cooling fin.

Abstract: For cooling of an electronic equipment, replacement of the conventional technique such as air cooling or the like by a liquid cooling system, retainment of a cooling capacity irrespective of a direction, in which a housing of the electronic equipment including a liquid cooling system is installed, prevention of liquid spill inside the housing of the electronic equipment at the time of exchange of a liquid cooling system, and shortening of time for exchange are enabled. In order to realize the above, a heat receiving jacket, to which piping extended outside an electronic equipment is connected, is mounted to a heat generating element in the electronic equipment, a radiator, a cooling-liquid tank, a pump, and a pipe, which joins them, are constructed as an external module, and the external module is mounted externally and fixed to a housing of the electronic equipment. Cooling liquid is circulated by the pump through the heat receiving jacket, the radiator, and the tank to achieve cooling.

Abstract: A liquid cooling jacket and a system for use in an electronic apparatus, preferable in the cooling capacity or performance, with less in man-hour and manufacturing costs in need of process thereof, and applicable into a narrow space, wherein a plural number of lamination plates, each being formed through the punching process, are piled up in the width direction thereof, for each piece thereof, and are bonded with each other. A cooling liquid flows in a flow passage defined between the laminating plates, and the laminating plates themselves function as a cooling fin.