Abstract: An electronic apparatus includes a first chassis which loads a processing device, a second chassis which is coupled with the first chassis to be rotatably movable relative to each other and a vapor chamber which has a first flexile resin sheet, a second flexible resin sheet and a closed space which is formed between the first resin sheet and the second resin sheet and in which a working fluid is encapsulated, extends from the inside of the first chassis to the inside of the second chassis and transports heat that the processing device generates to the second chassis side.

Abstract: A chassis member capable of improving manufacturing efficiency is disclosed. The chassis member includes a laminate in which an interlayer is provided between a pair of fiber-reinforced resin plates made of reinforced fiber impregnated with thermoplastic resin. A frame body formed of thermoplastic resin is joined to an edge of the laminate. The edge of the laminate is provided with a thin plate portion thinner than the other portion. The frame body is joined to the thin plate portion.

Abstract: The present invention provides a resin laminate that suppresses the infiltration of a component contained in a lower resin layer into a surface resin layer in the resin laminate composed of a thermoplastic resin. The resin laminate includes a first thermoplastic resin layer positioned as the surface layer, and a second thermoplastic resin layer positioned beneath the first thermoplastic resin layer, wherein the glass transition temperature of the first thermoplastic resin layer is higher than the glass transition temperature of the second thermoplastic resin layer.

Abstract: A chassis member capable of improving manufacturing efficiency is disclosed. The chassis member includes a laminate in which an interlayer is provided between a pair of fiber-reinforced resin plates made of reinforced fiber impregnated with thermoplastic resin. A frame body formed of thermoplastic resin is joined to an edge of the laminate. The edge of the laminate is provided with a thin plate portion thinner than the other portion. The frame body is joined to the thin plate portion.

Abstract: A method for processing a fiber-reinforced resin material is disclosed. A fiber-reinforced resin material is disposed between an upper die having a projection and a lower die having a recess corresponding to the projection. The fiber-reinforced resin material includes reinforced fibers having alternately intersecting warp yarns and weft yarns and are impregnated with a thermoplastic resin. The fiber-reinforced resin material is then heated to soften the thermoplastic resin, and the upper die and the lower die are placed close to each other in order to insert the projection into a gap between the warp yarns and the weft yarns of the reinforced fibers such that the gap between the warp yarns and the weft yarns is expanded to form a through hole.

Abstract: A chassis member for a chassis of an electronic device is disclosed. The chassis member includes an aluminum alloy layer and an alumite layer serving as an outermost layer of the chassis member and disposed on a surface of the aluminum alloy layer. A grain size of an aluminum alloy in the aluminum alloy layer is between 40 ?m and 50 ?m.

Abstract: A chassis member for a chassis of an electronic device is disclosed. The chassis member includes an aluminum alloy layer and an alumite layer serving as an outermost layer of the chassis member and disposed on a surface of the aluminum alloy layer. A grain size of an aluminum alloy in the aluminum alloy layer is between 40 ?m and 50 ?m.

Abstract: A method for processing a fiber-reinforced resin material is disclosed. A fiber-reinforced resin material is disposed between an upper die having a projection and a lower die having a recess corresponding to the projection. The fiber-reinforced resin material includes reinforced fibers having alternately intersecting warp yarns and weft yarns and are impregnated with a thermoplastic resin. The fiber-reinforced resin material is then heated to soften the thermoplastic resin, and the upper die and the lower die are placed close to each other in order to insert the projection into a gap between the warp yarns and the weft yarns of the reinforced fibers such that the gap between the warp yarns and the weft yarns is expanded to form a through hole.

Abstract: Disclosed is a polylactic acid resin composition having excellent bleed resistance and molecular weight retention ratio. A polylactic acid resin molded body is also disclosed. The polylactic acid resin composition contains a polylactic acid resin (a), a metal hydrate (b) having an alkali metal-containing substance content of not more than 0.2% by mass, and a phosphazene derivative (c). The polylactic acid resin molded body is obtained by molding the polylactic acid resin composition. Specifically, a polylactic acid molded body can be produced by filling a melt of the polylactic acid resin composition into a mold at a temperature in the range from glass transition temperature of said polylactic acid resin (a) to 110° C. and molding the melt therein.

Abstract: The present invention provides a polylactic acid resin composition, containing a polylactic acid resin and a metal hydrate surface-treated with at least one silane coupling agent selected from an amino-silane coupling agent, a mercapto-silane coupling agent and an isocyanate-silane coupling agent, wherein the content of an alkali metal component in the metal hydrate is not more than 0.2% by mass and a polylactic acid resin molded article produced by molding the polylactic acid resin composition.

Abstract: Provided is a plant-derived resin composite material which has a sufficiently fast crystallization rate and excellent moldability and heat resistance by using a thermoplastic resin composition containing a plant-derived thermoplastic resin and an organic crystal nucleating agent which is composed of one or more low molecular weight compounds comprising at least two polar groups in the molecule, a spacing between any two of the polar groups being 34±4 angstroms.

Abstract: In a cabinet for electronic apparatus, when Mg—Li alloy is employed to reduce weight of the cabinet and depressions are molded on a surface of the cabinet through presswork by using the Mg—Li alloy, neither a rough surface nor a crack appears in any bent portion forming the depressions of the cabinet. In a cabinet for electronic apparatus including a bump shape including at least one surface formed by conducting presswork for magnesium-lithium alloy, the bump shape is a shape in which a new surface formed when a reference surface before the presswork of the magnesium-lithium alloy is pushed toward the inside of the cabinet by the presswork and is placed apart from the reference surface is surrounded by the reference surface, the surface has a plate thickness t (mm) in a range of 0.4?t?2.0, and at least one bent portion constituting the bump shape has a radius of curvature R (mm) in a range of t?R.

Abstract: In a cabinet for electronic apparatus, even when Mg—Li alloy is employed to reduce weight of the cabinet and the cabinet is molded through presswork by using the Mg—Li alloy, neither a rough surface nor a crack appears in any bent portion of the cabinet. In a cabinet for electronic apparatus including at least one surface formed by conducting presswork for Mg—Li alloy, the surface has a plate thickness t (mm) in a range of 0.4?t?2.0, at least one bent portion between at least two of the surfaces has a radius of curvature r (mm) on an inside of the bent portion in a range of t?r, and at least one side surface standing relative to a bottom surface selected from the surfaces has a height H (mm) in a range of 0?H?r+4.

Abstract: Provided is a polylactic acid resin composition obtained by adding a carboxylic acid amide and a carboxylic acid ester each of which has at least one polar group in a molecule to a polylactic acid resin reacted with a (meth)acrylate compound. Also provided is a polylactic acid resin molded article which is a molded article obtained by molding the polylactic acid resin composition, manufactured by setting a mold temperature to a glass transition temperature of a polylactic acid resin plus 20° C. or higher and a melting point thereof minus 20° C. or lower, at the time of injection molding the polylactic acid resin composition. Thus, a resin composition in which a moldability is improved at a temperature at which a polylactic acid resin is crystallized, and a molded article therefrom are provided.

Abstract: A flame-retardant thermoplastic resin composition comprising at least a plant-derived resin (A) and a flame retardant (B), wherein the weight proportions of the individual components in the flame-retardant thermoplastic resin composition are: 30?W1<55.5 44.5<X1?70 wherein W1 is the percentage by mass of the plant-derived resin (A) and X1 is the percentage by mass of the flame retardant (B), and 90% by mass or more of the flame retardant (B) is composed of a metal hydrate containing an alkali metal-based substance in an amount of 0.2% by mass or less.

Abstract: Disclosed is a polylactic acid resin composition having excellent bleed resistance and molecular weight retention ratio. A polylactic acid resin molded body is also disclosed. The polylactic acid resin composition contains a polylactic acid resin (a), a metal hydrate (b) having an alkali metal-containing substance content of not more than 0.2% by mass, and a phosphazene derivative (c). The polylactic acid resin molded body is obtained by molding the polylactic acid resin composition. Specifically, a polylactic acid molded body can be produced by filling a melt of the polylactic acid resin composition into a mold at a temperature in the range from glass transition temperature of said polylactic acid resin (a) to 110° C. and molding the melt therein.

Abstract: The present invention provides a polylactic acid resin composition, containing a polylactic acid resin and a metal hydrate surface-treated with at least one silane coupling agent selected from an amino-silane coupling agent, a mercapto-silane coupling agent and an isocyanate-silane coupling agent, wherein the content of an alkali metal component in the metal hydrate is not more than 0.2% by mass and a polylactic acid resin molded article produced by molding the polylactic acid resin composition.

Abstract: A flame-retardant thermoplastic resin composition comprising at least a plant-derived resin (A) and a flame retardant (B), wherein the weight proportions of the individual components in the flame-retardant thermoplastic resin composition are: 30?W1<55.5 44.5<X1?70 wherein W1 is the percentage by mass of the plant-derived resin (A) and X1 is the percentage by mass of the flame retardant (B), and 90% by mass or more of the flame retardant (B) is composed of a metal hydrate containing an alkali metal-based substance in an amount of 0.2% by mass or less.

Abstract: A flame-retardant thermoplastic resin composition comprising at least a plant-derived resin (A) and a flame retardant (B), wherein the weight proportions of the individual components in the flame-retardant thermoplastic resin composition are: 30?W1<55.5 44.5<X1?70 wherein W1 is the percentage by mass of the plant-derived resin (A) and X1 is the percentage by mass of the flame retardant (B), and 90% by mass or more of the flame retardant (B) is composed of a metal hydrate containing an alkali metal-based substance in an amount of 0.2% by mass or less.

Abstract: The thermally conductive resin material of the present invention has an excellent thermal conductive property without impairing the intrinsic practical properties such as the forming processability, lightness in weight and mechanical strength possessed by resins and has an anisotropic thermal conductive property capable of controlling the directionality and the transfer amount of the thermal conduction. The thermally conductive resin material of the present invention is a thermally conductive resin material including a base material of a thermoplastic resin (A) and a fibrous filler (C), wherein an organic compound (B) incompatible with the resin component is present as dispersed particles in the resin component, and two or more elements of the fibrous filler (C) are in contact with the surface of each of the dispersed particles or are located in each of the dispersed particles.