Abstract: Provided is a heat exchanger in which first flow paths for flowing a first fluid and second flow paths for flowing a second fluid are arranged adjacent via a partition wall through which heat exchange is performed. The partition wall includes parallel tubular partition walls inside of which is the first flow paths. At least a part of the tubular partition walls in a flow path direction are integrally coupled to form a partition wall coupling portion having a geometric pattern in transverse cross section. An element figure of the geometric pattern corresponding to a transverse cross-sectional shape of the tubular partition wall is connected to each other at a vertex, and the number of sides of the element figure gathering at the vertex is an even number. In the partition wall coupling portion, the second flow paths are defined between outer peripheral surfaces of the surrounding tubular partition walls.

Abstract: Provided is a heat exchanger in which first flow paths for flowing a first fluid and second flow paths for flowing a second fluid are arranged adjacent via a partition wall through which heat exchange is performed. The partition wall includes parallel tubular partition walls inside of which is the first flow paths. At least a part of the tubular partition walls in a flow path direction are integrally coupled to form a partition wall coupling portion having a geometric pattern in transverse cross section. An element figure of the geometric pattern corresponding to a transverse cross-sectional shape of the tubular partition wall is connected to each other at a vertex, and the number of sides of the element figure gathering at the vertex is an even number. In the partition wall coupling portion, the second flow paths are defined between outer peripheral surfaces of the surrounding tubular partition walls.

Abstract: A semiconductor device capable of reducing the thermal resistance in a flip chip packaging structure while achieving both the high radiation performance and manufacturing readiness without increasing the manufacturing cost is provided. In a semiconductor device having a semiconductor circuit for power amplification and a control circuit of the semiconductor circuit laminated on a multilayer circuit board, the semiconductor circuit for power amplification and the control circuit are aligned in parallel on the same semiconductor element, and the semiconductor element is flip-chip connected on the multilayer circuit board. Further, a second semiconductor element mounted in addition to the first semiconductor element and all components and submodules are flip-chip connected. Also, a plurality of bumps are united in order to improve the radiation performance and thermal vias of the multilayer circuit board are formed in second and lower layers of the wiring layers in the multilayer circuit board.

Abstract: A semiconductor device capable of reducing the thermal resistance in a flip chip packaging structure while achieving both the high radiation performance and manufacturing readiness without increasing the manufacturing cost is provided. In a semiconductor device having a semiconductor circuit for power amplification and a control circuit of the semiconductor circuit laminated on a multilayer circuit board, the semiconductor circuit for power amplification and the control circuit are aligned in parallel on the same semiconductor element, and the semiconductor element is flip-chip connected on the multilayer circuit board. Further, a second semiconductor element mounted in addition to the first semiconductor element and all components and submodules are flip-chip connected. Also, a plurality of bumps are united in order to improve the radiation performance and thermal vias of the multilayer circuit board are formed in second and lower layers of the wiring layers in the multilayer circuit board.

Abstract: First heat-transfer plates S1 and second heat-transfer plates S2 are radially arranged between a larger diameter cylindrical-shaped outer casing 6 and a smaller diameter cylindrical-shaped inner casing 7 to form combustion gas passages 4 and air passages 5 alternately in a circumferential direction, and a multiplicity of projections 22, 23 formed on both surfaces of the first heat-transfer plates S1 and second heat-transfer plates S2 are jointed to one another at tip ends thereof. Pitches P between adjacent projections 22, 23 are changed in a radial direction to make the number of heat transfer units substantially constant in a radial direction to uniformize temperature distributions on the first heat-transfer plates S1 and second heat-transfer plates S2 in the radial direction, thereby avoiding a decrease in heat exchanging efficiency and generation of unwanted thermal stress.

Abstract: First heat transfer plates S1 and second heat transfer plates S2 folded along crest folding lines L1 and valley folding lines L2 are bonded to an inner periphery of an outer casing 6 and an outer periphery of an inner casing 7, so that the first and second heat transfer plates S1 and S2 are disposed radiately, thereby forming combustion gas passages and air passages circumferentially alternately. One end of both the combustion gas passages and the air passages is cut into an angle shape, and one side and the other side of the angle shape are closed to form combustion gas passage inlets 11 and air passage outlets 16. In a similar manner, combustion gas passage outlets 12 and air passage inlets 15 are formed at the other end of the combustion gas passages and the air passages. Thus, it is possible to provide a heat exchanger which has a simple structure and is easy to manufacture, and in which the pressure loss due to bending of flow paths can be suppressed to the minimum.

Abstract: A gas turbine engine E includes a compressor wheel 9 and a turbine wheel 10 fixed to a rotary shaft 8, a can-type combustor 18 disposed on an extension of the axis L of the rotary shaft 8, and an circular plate-type heat exchanger 12 disposed to surround a radially outer portion of the can-type combustor 18. The compressor wheel 9, the turbine wheel 10, the can-type combustor 18 and the plate-type heat exchanger 12 are disposed coaxially with the axis L of the rotary shaft 8. Therefore, the flows of compressed air and combustion gas are symmetrized with respect to the axis L, and the distribution of temperature within a casing is also symmetrized with respect to the axis L. Thus, the flows of compressed air and combustion gas within the gas turbine engine E can be axially symmetrized, and the generation of a thermal distortion can be prevented.