Abstract: A semiconductor device is provided that has high electromagnetic wave shielding properties while exhibiting good heat dissipation. The semiconductor device includes a semiconductor package bonded onto a circuit board, an electromagnetic wave absorbing layer covering surfaces of the semiconductor package other than a surface bonded to the circuit board, and an electromagnetic wave reflecting layer covering the electromagnetic wave absorbing layer on a side remote from the semiconductor package, in which the electromagnetic wave absorbing layer is made of resin containing magnetic particles or carbon, and the electromagnetic wave reflecting layer is made of resin containing conductive particles.

Abstract: An electromagnetic wave absorption sheet is arranged to contact an upper surface and side surfaces of an electronic component mounted on a wiring board, a heat conduction plate is arranged to contact the electromagnetic wave absorption sheet, a heat transfer sheet is arranged to contact the heat conduction plate, and a heat dissipation member is arranged to contact the heat transfer sheet. Heat conductive particles contained in the heat transfer sheet contact a flat surface portion of the heat conduction plate. The electromagnetic wave absorption sheet, the heat conduction plate, and the heat transfer sheet are interposed between the heat dissipation member and the electronic component, as a heat conduction member for conducting heat generated in the electronic component and the like to the heat dissipation member.

Abstract: An object of the present invention is to provide a semiconductor device that has high electromagnetic wave shielding properties while exhibiting good heat dissipation. The semiconductor device according to the present invention includes a semiconductor package bonded onto a circuit board, an electromagnetic wave absorbing layer covering surfaces of the semiconductor package other than a surface bonded to the circuit board, and an electromagnetic wave reflecting layer covering the electromagnetic wave absorbing layer on a side remote from the semiconductor package, in which the electromagnetic wave absorbing layer is made of resin containing magnetic particles or carbon, and the electromagnetic wave reflecting layer is made of resin containing conductive particles.

Abstract: A printed board includes an insulating layer, and radiation vias penetrating printed board are formed in both a first region overlapping electronic component and a second region outside the first region. A plurality of conductor layers included in printed board are cross-connected to a plurality of radiation vias. Diffusion radiator includes a thermal diffusion plate, a radiation member, and a cooling body. Radiation member is in close contact with one of main surfaces of cooling body, and thermal diffusion plate is in close contact with one of main surfaces of radiation member on the opposite side to cooling body. One of main surfaces of thermal diffusion plate on the opposite side to radiation member is bonded to a conductor layer on the other main surface of printed board so as to close the plurality of radiation vias.

Abstract: An electromagnetic wave absorption sheet is arranged to contact an upper surface and side surfaces of an electronic component mounted on a wiring board, a heat conduction plate is arranged to contact the electromagnetic wave absorption sheet, a heat transfer sheet is arranged to contact the heat conduction plate, and a heat dissipation member is arranged to contact the heat transfer sheet. Heat conductive particles contained in the heat transfer sheet contact a flat surface portion of the heat conduction plate. The electromagnetic wave absorption sheet, the heat conduction plate, and the heat transfer sheet are interposed between the heat dissipation member and the electronic component, as a heat conduction member for conducting heat generated in the electronic component and the like to the heat dissipation member.

Abstract: A printed board includes an insulating layer, and radiation vias penetrating printed board are formed in both a first region overlapping electronic component and a second region outside the first region. A plurality of conductor layers included in printed board are cross-connected to a plurality of radiation vias. Diffusion radiator includes a thermal diffusion plate, a radiation member, and a cooling body. Radiation member is in close contact with one of main surfaces of cooling body, and thermal diffusion plate is in close contact with one of main surfaces of radiation member on the opposite side to cooling body. One of main surfaces of thermal diffusion plate on the opposite side to radiation member is bonded to a conductor layer on the other main surface of printed board so as to close the plurality of radiation vias.

Abstract: A solar cell module in the present invention includes: a wiring member electrically connecting solar cell elements to each other; and a structure in which a solder bonding portion is formed by bonding a collecting electrode, which is provided on a light receiving surface of the solar cell element, extends in a first direction parallel to the wiring member, and has a width smaller than that of the wiring member in a cross section vertical to the first direction, and the wiring member together by melting solder, a cross-sectional shape of the solder bonding portion vertical to the first direction has a shape that gradually narrows toward the collecting electrode from a lower surface of the wiring member, and a side surface of the solder bonding portion and a side surface of the wiring member are covered with a thermosetting resin.

Abstract: A plurality of thin linear thin wire electrodes are formed entirely over a first surface that is a light receiving surface of a solar cell element, a back surface collecting electrode is formed on a second surface that is a back surface of the solar cell element, and a wiring member which draws power is connected to each of the thin wire electrode and the back surface collecting electrode. The thin wire electrode and the wiring member are bonded with solder and side surfaces of the solder bonding portion in a longitudinal direction along the wiring member are coated with a thermosetting resin, and, in a region excluding the thin wire electrodes, the wiring member and the first surface are bonded with a thermosetting resin. The wiring member and the thin wire electrodes are bonded to have a sufficient mechanical bonding strength and high bonding reliability.

Abstract: A solar cell module in the present invention includes: a wiring member electrically connecting solar cell elements to each other; and a structure in which a solder bonding portion is formed by bonding a collecting electrode, which is provided on a light receiving surface of the solar cell element, extends in a first direction parallel to the wiring member, and has a width smaller than that of the wiring member in a cross section vertical to the first direction, and the wiring member together by melting solder, a cross-sectional shape of the solder bonding portion vertical to the first direction has a shape that gradually narrows toward the collecting electrode from a lower surface of the wiring member, and a side surface of the solder bonding portion and a side surface of the wiring member are covered with a thermosetting resin.

Abstract: In a solar battery module including a plurality of solar battery elements each including electrodes that are electrically connected by an electrically conductive wiring member, the electrode and the wiring member are welded by solder on the electrode, resin is arranged while covering at least a side surface of a solder-bonded portion between the solder and the electrode, and a wetted height of the resin on a side surface of the wiring member is lower than the top of wiring member, so that welding by the solder can be reinforced and the bonding reliability can be improved.

Abstract: A plurality of thin linear thin wire electrodes are formed entirely over a first surface that is a light receiving surface of a solar cell element, a back surface collecting electrode is formed on a second surface that is a back surface of the solar cell element, and a wiring member which draws power is connected to each of the thin wire electrode and the back surface collecting electrode. The thin wire electrode and the wiring member are bonded with solder and side surfaces of the solder bonding portion in a longitudinal direction along the wiring member are coated with a thermosetting resin, and, in a region excluding the thin wire electrodes, the wiring member and the first surface are bonded with a thermosetting resin. The wiring member and the thin wire electrodes are bonded to have a sufficient mechanical bonding strength and high bonding reliability.

Abstract: The semiconductor package includes a package wiring board having an element housing recessed portion on its top surface to house a semiconductor element; multiple side electrodes which are arranged on the outer side surface of the package wiring board and soldered to multiple motherboard electrodes arranged on a motherboard; a semiconductor element fixed onto the bottom surface of the element housing recessed portion; and an element electrode arranged on the bottom of the element housing recessed portion and electrically connected to the semiconductor element and the side electrodes. The package wiring board has a multilayered structure in which woven fabric and a resin adhesive layer are alternately laminated, and the resin adhesive layer is formed of a resin adhesive that contains inorganic filler particles.

Abstract: To constitute an optical module in which a comb-shaped submount is fixed on a heat sink and a device having an optical functioning unit is mounted on the comb-shaped submount, a stress buffering block that relaxes a thermal stress acting between the heat sink and the comb-shaped submount is placed between the heat sink and the comb-shaped submount. With this configuration, a thermal stress acting between the comb-shaped submount and the device mounted thereon is relaxed, and as a result, long-term reliability of bonding parts between the comb-shaped submount and the device is enhanced.

Abstract: A semiconductor device includes projecting electrodes formed on one surface of a wiring substrate so as to have a prescribed height, a semiconductor chip having a thickness smaller than the height of the projecting electrodes, and an electronic component having a thickness larger than that of the semiconductor chip and mounted on the other surface of the wiring substrate so that the wiring substrate is warped to be recessed at the one surface. Thus, the rigidity as well as the spacing between the semiconductor chip and the mounting board are assured. Moreover, the semiconductor device having a logic LSI mounted on both surfaces of a wiring substrate is mounted on a mounting board in a housing with projecting electrodes having a prescribed height interposed therebetween, wherein the wiring substrate is warped to be recessed on the side having the projecting electrodes.

Abstract: A semiconductor device includes projecting electrodes formed on one surface of a wiring substrate so as to have a prescribed height, a semiconductor chip having a thickness smaller than the height of the projecting electrodes, and an electronic component having a thickness larger than that of the semiconductor chip and mounted on the other surface of the wiring substrate so that the wiring substrate is warped to be recessed at the one surface. Thus, the rigidity as well as the spacing between the semiconductor chip and the mounting board are assured. Moreover, the semiconductor device having a logic LSI mounted on both surfaces of a wiring substrate is mounted on a mounting board in a housing with projecting electrodes having a prescribed height interposed therebetween, wherein the wiring substrate is warped to be recessed on the side having the projecting electrodes.

Abstract: A semiconductor device includes projecting electrodes formed on one surface of a wiring substrate so as to have a prescribed height, a semiconductor chip having a thickness smaller than the height of the projecting electrodes, and an electronic component having a thickness larger than that of the semiconductor chip and mounted on the other surface of the wiring substrate so that the wiring substrate is warped to be recessed at the one surface. Thus, the rigidity as well as the spacing between the semiconductor chip and the mounting board are assured. Moreover, the semiconductor device having a logic LSI mounted on both surfaces of a wiring substrate is mounted on a mounting board in a housing with projecting electrodes having a prescribed height interposed therebetween, wherein the wiring substrate is warped to be recessed on the side having the projecting electrodes.

Abstract: It is an object of the present invention to provide a low-cost semiconductor device including a semiconductor chip mounted on both surfaces of a wiring substrate without degrading electric characteristics, a method for manufacturing an electronic equipment, an electronic equipment, and a portable information terminal

Abstract: A high-speed, high-density, small-sized, low-cost semiconductor device wherein the feeder substrate 2 for supplying power to the semiconductor elements 3 as a bare chip has the containers 2a for containing the semiconductor elements 3, the semiconductor elements 3 are bonded to the wiring layer 1b of the signal transmission substrate 1 for transmitting signals to the semiconductor elements 3 and contained in the containers 2a, the containers 2a are covered with the signal transmission substrate 1, and the signal transmission substrate 1 is superposed upon and bonded to the feeder substrate 2.

Abstract: This invention relates to printed circuit boards and a method of fabricating same wherein the input/output terminals are integral with the wiring layer of the printed circuit board. This arrangement allows for a higher density of input/output connections than is possible with conventional printed circuit boards.

Abstract: A liquid crystal display apparatus which realizes a large-scale display by connecting a plurality of liquid crystal panels wherein on an electrode substrate having data bus lines and gate bus lines on one surface are formed extension lines each extending from an end of each of the data bus lines and gate bus lines to the opposite surface of the electrode substrate, and a plurality of the electrode substrates are mounted on a substrate on which electrodes are provided to electrically connect the extension lines of the data bus lines or gate bus lines on one electrode substrate with the corresponding ones on other electrode substrate.