Patents by Inventor Tsuneo Hanada

Tsuneo Hanada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090074990
    Abstract: When an optically anisotropic material is manufactured, an optically anisotropic liquid crystal layer with good adhesion properties and without irregular alignment is formed on a substrate. The optically anisotropic material having the optically anisotropic liquid crystal layer formed on the substrate can be manufactured by subjecting the surface of the substrate to rubbing treatment, subjecting the rubbing-treated surface to surface treatment with the hydrolysate of an alkoxysilane compound, applying a polymerizable nematic liquid crystal composition to the surface-treated surface, subjecting the applied polymerizable liquid crystal composition to alignment treatment, and subjecting the polymerizable liquid crystal composition to curing treatment while the alignment state thereof is maintained, whereby the optically anisotropic liquid crystal layer is formed.
    Type: Application
    Filed: May 26, 2005
    Publication date: March 19, 2009
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Zemin Shi, Tadashi Akamatsu, Michio Sato, Tsuneo Hanada
  • Patent number: 7427363
    Abstract: A simple technique for introducing a hybrid alignment or a homeotropic (vertical) alignment into liquid crystal films, which, by their nature, tend to have a horizontal alignment of liquid crystal molecules. The technique does not require special alignment films. A liquid crystal composition for forming a liquid crystal film contains a polymerizable liquid crystal compound and a hydrolysate of an alkoxysilane compound. The hydrolysate of the alkoxysilane compound contains a siloxane oligomer of which degree of polymerization is from 2 to 25. Furthermore, the alkoxysilane compound is a trialkoxysilane compound having a functional group. This liquid crystal film composition can be produced by hydrolyzing an alkoxysilane compound to obtain a hydrolysate and then uniformly mixing the hydrolysate with a polymerizable liquid crystal compound.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: September 23, 2008
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Zemin Shi, Tadashi Akamatsu, Michio Sato, Tsuneo Hanada
  • Publication number: 20070114491
    Abstract: A simple technique for introducing a hybrid alignment or a homeotropic (vertical) alignment into liquid crystal films, which, by their nature, tend to have a horizontal alignment of liquid crystal molecules. The technique does not require special alignment films. A liquid crystal composition for forming a liquid crystal film contains a polymerizable liquid crystal compound and a hydrolysate of an alkoxysilane compound. The hydrolysate of the alkoxysilane compound contains a siloxane oligomer of which degree of polymerization is from 2 to 25. Furthermore, the alkoxysilane compound is a trialkoxysilane compound having a functional group. This liquid crystal film composition can be produced by hydrolyzing an alkoxysilane compound to obtain a hydrolysate and then uniformly mixing the hydrolysate with a polymerizable liquid crystal compound.
    Type: Application
    Filed: August 31, 2004
    Publication date: May 24, 2007
    Applicant: SONY CHEMICALS CORP.
    Inventors: Zemin Shi, Tadashi Akamatsu, Michio Sato, Tsuneo Hanada
  • Patent number: 4604435
    Abstract: What is disclosed are thermosetting epoxy resin compositions containing block siloxane copolymers which are used to induce low internal stress in the cured compositions and to provide coefficients of thermal expansion more closely aligned with the coefficients of thermal expansion of the substrates being molded therewith.
    Type: Grant
    Filed: November 16, 1984
    Date of Patent: August 5, 1986
    Assignee: Toray Silicone Co., Ltd.
    Inventors: Taro Koshii, Yoshitsugu Morita, Hideo Shinmi, Tsuneo Hanada
  • Patent number: 4594134
    Abstract: Provided is a method for preparing a spherical cured product having a diameter of 5 mm or less of a polymer or a polymer composition containing at least 10 wt % of the linear organopolysiloxane blocks represented by the following general formula (1), characterized by curing in an atomized state a curable polymer or a curable polymer composition containing at least 10 wt % of the linear organopolysiloxane blocks represented by the following general formula (1):--R.sub.2 SiO].sub.n (1)wherein R's are the same or different monovalent hydrocarbon groups and n is an integer of 5 or more.
    Type: Grant
    Filed: November 9, 1984
    Date of Patent: June 10, 1986
    Assignee: Toray Silicone Company, Limited
    Inventors: Tsuneo Hanada, Yoshitsugu Morita
  • Patent number: 4517238
    Abstract: Integral silicone molded products comprising a unitary structure of a substrate with different phases is made by coating a substrate with a mixture of an alkenyl containing polyorganosiloxane, a polyorganohydrogensiloxane, and an addition-reaction catalyst where at least one component is applied to the substrate and then additional components are applied and diffuse to result in a coating with a polyorganosiloxane phase whose degree of crosslinking is low and a polyorganosiloxane phase whose degree of crosslinking is high and the phase having the low degree of crosslinking is next to the substrate. Such molded products are coated hybrid IC transistors, solar battery modules, and optical fibers.
    Type: Grant
    Filed: March 21, 1983
    Date of Patent: May 14, 1985
    Assignee: Toray Silicone Company, Ltd.
    Inventors: Katsutoshi Mine, Toshio Suzuki, Tsuneo Hanada
  • Patent number: 4293479
    Abstract: What is disclosed is an improved heat curable molding composition which has increased flowability in the mold. The improvement is gained by the use of a fine, spherical noncrystalline filler along with the normal molding compound fillers.
    Type: Grant
    Filed: December 6, 1979
    Date of Patent: October 6, 1981
    Assignee: Toray Silicone Company, Ltd.
    Inventors: Tsuneo Hanada, Taro Koshii, Hideo Shinmi
  • Patent number: 4267297
    Abstract: What is disclosed are room temperature curable silicone resins which have solvent, heat and weather resistance, mold release properties and water repellency in their cured state. Silicone resins are treated with alkoxylated siloxanes, alkoxysilanes and aminoalkoxysilanes to give these properties.
    Type: Grant
    Filed: October 19, 1979
    Date of Patent: May 12, 1981
    Assignee: Toray Silicone Company, Ltd.
    Inventors: Tsuneo Hanada, Ryuzo Mikami
  • Patent number: 4144222
    Abstract: An improved thermosetting silicone resin molding composition characterized by consisting essentially of 100 parts by weight of organopolysiloxane resin having organic radical: Si ratio of 1.0:1 to 1.7:1 and containing at least 0.2% by weight of silicon-bonded hydroxyl groups, organohydrogenpolysiloxane containing at least one silicon bonded hydrogen atom in each molecule thereof, said organohydrogenpolysiloxane being in such an amount that the number of the hydrogen atoms per hydroxyl group in said organopolysiloxane is between 0.001 and 0.30, 0.01 to 15 parts by weight of organotin oxide, and 50 to 700 parts by weight of an inorganic filler.
    Type: Grant
    Filed: July 28, 1977
    Date of Patent: March 13, 1979
    Assignee: Toray Silicone Company, Ltd.
    Inventors: Hideo Shinmi, Tsuneo Hanada
  • Patent number: 4069178
    Abstract: A method for obtaining water-soluble, silicone-modified alkyd resins is disclosed which allows reproducibility of the resin without the undesirable gelling reaction normally associated with such similar processes.
    Type: Grant
    Filed: February 25, 1976
    Date of Patent: January 17, 1978
    Assignee: Dow Corning Corporation
    Inventors: Ryuzo Mikami, Tsuneo Hanada
  • Patent number: RE32958
    Abstract: What is disclosed are thermosetting epoxy resin compositions containing block siloxane copolymers which are used to induce low internal stress in the cured compositions and to provide coefficients of thermal expansion more closely aligned with the coefficients of thermal expansion of the substrates being molded therewith.
    Type: Grant
    Filed: September 14, 1987
    Date of Patent: June 20, 1989
    Assignee: Toray Silicone Co., Ltd.
    Inventors: Taro Koshii, Yoshitsugu Morita, Hideo Shinmi, Tsuneo Hanada