Patents by Inventor Tsuneo Kamiyahata

Tsuneo Kamiyahata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6995205
    Abstract: A resin composition having high thermal conductivity and excellent moldability and a method of producing the same is provided. The composition includes 40 vol % or more of a matrix resin, 10 to 55 vol % of a thermally conductive filler dispersed in the matrix resin and the balance of a low-melting point alloy connecting the thermally conductive filler to each other and having a melting point not higher than 500° C. The proportion of the volume ratio of the low-melting point alloy to that of the thermally conductive filler is set in a range from 1/30 to 3/1.
    Type: Grant
    Filed: August 27, 2002
    Date of Patent: February 7, 2006
    Assignees: Nippon Kagaku Yakin Co., Ltd., Osaka Municipal Government
    Inventors: Kiyotaka Matsukawa, Kozo Ishihara, Tsuneo Kamiyahata, Yoshikazu Inada, Yasuyuki Agari, Masayuki Shimada
  • Publication number: 20040204526
    Abstract: A resin composition having high thermal conductivity and excellent moldability and a method of producing the same is provided. The composition includes 40 vol % or more of a matrix resin, 10 to 55 vol % of a thermally conductive filler dispersed in the matrix resin and the balance of a low-melting point alloy connecting the thermally conductive filler to each other and having a melting point not higher than 500° C. The proportion of the volume ratio of the low-melting point alloy to that of the thermally conductive filler is set in a range from 1/30 to 3/1.
    Type: Application
    Filed: March 25, 2004
    Publication date: October 14, 2004
    Inventors: Kiyotaka Matsukawa, Kozo Ishihara, Tsuneo Kamiyahata, Yoshikazu Inada, Yasuyuki Agari, Masayuki Shimada