Patents by Inventor Tsuneo Numanami
Tsuneo Numanami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170110355Abstract: The present invention provides a substrate cleaning apparatus for a substrate related to a photomask, including a holder for holding only an end face of the substrate, a rotation mechanism for rotating the holder, and a nozzle for supplying liquid at least to the front surface of the substrate rotating with the holder by the rotation mechanism; wherein at least one of the holder has a conductive surface and is earthed. The present invention also provides a method for cleaning a substrate related to a photomask. These inventions can prevent adhesion of contaminants to the substrate when performing a cleaning treatment.Type: ApplicationFiled: October 3, 2016Publication date: April 20, 2017Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Tsuneo NUMANAMI, Yukio INAZUKI, Toyohisa SAKURADA
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Patent number: 8956463Abstract: A method for cleaning a photomask-related substrate, when the photomask-related substrate is contaminated by a sulfate ion. The photomask-related substrate is cleaned with pure water to remove the sulfate ion, and a deaerating step of removing dissolved gas is performed in advance on the pure water used for cleaning. When the substrate to be cleaned is cleaned by filtering the cleaning fluid with a filter for removing foreign matter and supplying the filtered cleaning fluid to the cleaning apparatus through a supply pipe, prior to a supply of the filtered cleaning fluid to the cleaning apparatus, the filtered cleaning fluid is discharged to the outside of a system through a discharge pipe, and then the filtered cleaning fluid is supplied to the cleaning apparatus through the supply pipe.Type: GrantFiled: September 1, 2009Date of Patent: February 17, 2015Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Tsuneo Numanami
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Publication number: 20100083985Abstract: Provided is a method for cleaning a photomask-related substrate, the method in which, when a photomask-related substrate contaminated by a sulfate ion, the photomask-related substrate being selected from a substrate for a photomask, a photomask blank, a photomask, and a production intermediate thereof, is cleaned with pure water, a deaerating step of removing dissolved gas by deaeration is performed in advance on the pure water used for cleaning.Type: ApplicationFiled: September 1, 2009Publication date: April 8, 2010Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventor: Tsuneo Numanami
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Patent number: 7351504Abstract: In a quadrangular photomask blank substrate with a length on each side of at least 6 inches, which has a pair of strip-like regions that extend from 2 to 10 mm inside each of a pair of opposing sides along an outer periphery of a substrate top surface, with a 2 mm edge portion excluded at each end, each strip-like region is inclined downward toward the outer periphery of the substrate, and a difference between maximum and minimum values for height from a least squares plane for the strip-like region to the strip-like region is at most 0.5 ?m. The substrate exhibits a good surface flatness at the time of wafer exposure.Type: GrantFiled: July 23, 2004Date of Patent: April 1, 2008Assignees: Shin-Etsu Chemical Co., Ltd., Kabushiki Kaisha Toshiba, Nikon CorporationInventors: Masayuki Nakatsu, Tsuneo Numanami, Masayuki Mogi, Masamitsu Itoh, Tsuneyuki Hagiwara, Naoto Kondo
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Patent number: 7344808Abstract: A photomask blank substrate is made by polishing a starting substrate to a specific flatness in a principal surface region on a top surface of the substrate so as to form a polished intermediate product, then additionally polishing the intermediate product. Substrates made in this way exhibit a good surface flatness at the time of wafer exposure. When a photomask fabricated from a blank obtained from such a substrate is held on the mask stage of a wafer exposure system with a vacuum chuck, the substrate surface undergoes minimal warping, enabling exposure patterns of small geometry to be written onto wafers to good position and linewidth accuracies.Type: GrantFiled: July 23, 2004Date of Patent: March 18, 2008Assignees: Shin-Etsu Chemical Co., Ltd., Nikon CorporationInventors: Tsuneo Numanami, Masayuki Nakatsu, Masayuki Mogi, Tsuneyuki Hagiwara, Naoto Kondo
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Patent number: 7329475Abstract: Provided that a pair of strip-like regions extend from 2 mm to 10 mm inside each of a pair of opposing sides along an outer periphery of a top surface of a substrate on which a mask pattern is to be formed, with a 2 mm edge portion excluded at each end in a lengthwise direction thereof, the height from a least squares plane for the strip-like regions on the substrate top surface to the strip-like regions is measured at intervals of 0.05-0.35 mm in horizontal and vertical directions, and a substrate in which the difference between the maximum and minimum values for the height among all the measurement points is ?o? ?o?? ???? 0.5 ?m is selected.Type: GrantFiled: July 23, 2004Date of Patent: February 12, 2008Assignees: Shin-Estu Chemical Co., Ltd., Kabushiki Kaisha Toshiba, Nikon CorporationInventors: Masayuki Nakatsu, Tsuneo Numanami, Masayuki Mogi, Masamitsu Itoh, Tsuneyuki Hagiwara, Naoto Kondo
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Patent number: 7179567Abstract: In a phase shift mask blank comprising a transparent substrate and a phase shift film thereon, after the phase shift film is formed on the substrate, it is surface treated with ozone water having an ozone concentration of at least 1 ppm. The resulting phase shift film is of quality in that it experiences minimized changes of phase difference and transmittance upon immersion in chemical liquid during subsequent mask cleaning step or the like.Type: GrantFiled: June 27, 2003Date of Patent: February 20, 2007Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Yukio Inazuki, Masayuki Nakatsu, Tsuneo Numanami, Atsushi Tajika, Hideo Kaneko, Satoshi Okazaki
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Patent number: 7070888Abstract: A photomask blank substrate is selected for use in a process where at least a masking film or a phase shift film is deposited on a top surface of a photomask blank substrate to form a photomask blank, the deposited film is patterned to form a photomask, and the photomask is mounted in an exposure tool. The substrate is selected by simulating a change in shape in the top surface of the substrate, from prior to film deposition thereon to when the photomask is mounted in the exposure tool; determining the shape of the substrate top surface prior to the change that will impart to the top surface a flat shape when the photomask is mounted in the exposure tool; and selecting, as an acceptable substrate, a substrate having this top surface shape. The selected substrate has an optimized top surface shape that improves productivity in photomask fabrication.Type: GrantFiled: July 23, 2004Date of Patent: July 4, 2006Assignees: Shin-Etsu Chemical Co., Ltd., Nikon CorporationInventors: Masayuki Nakatsu, Tsuneo Numanami, Masayuki Mogi, Tsuneyuki Hagiwara, Naoto Kondo
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Publication number: 20050019676Abstract: Provided that a pair of strip-like regions extend from 2 mm to 10 mm inside each of a pair of opposing sides along an outer periphery of a top surface of a substrate on which a mask pattern is to be formed, with a 2 mm edge portion excluded at each end in a lengthwise direction thereof, the height from a least squares plane for the strip-like regions on the substrate top surface to the strip-like regions is measured at intervals of 0.05-0.35 mm in horizontal and vertical directions, and a substrate in which the difference between the maximum and minimum values for the height among all the measurement points is ?o? ?o?? ???? 0.5 ?m is selected.Type: ApplicationFiled: July 23, 2004Publication date: January 27, 2005Inventors: Masayuki Nakatsu, Tsuneo Numanami, Masayuki Mogi, Masamitsu Itoh, Tsuneyuki Hagiwara, Naoto Kondo
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Publication number: 20050019677Abstract: In a quadrangular photomask blank substrate with a length on each side of at least 6 inches, which has a pair of strip-like regions that extend from 2 to 10 mm inside each of a pair of opposing sides along an outer periphery of a substrate top surface, with a 2 mm edge portion excluded at each end, each strip-like region is inclined downward toward the outer periphery of the substrate, and a difference between maximum and minimum values for height from a least squares plane for the strip-like region to the strip-like region is at most 0.5 ?m. The substrate exhibits a good surface flatness at the time of wafer exposure.Type: ApplicationFiled: July 23, 2004Publication date: January 27, 2005Inventors: Masayuki Nakatsu, Tsuneo Numanami, Masayuki Mogi, Masamitsu Itoh, Tsuneyuki Hagiwara, Naoto Kondo
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Publication number: 20050020083Abstract: A photomask blank substrate is made by polishing a starting substrate to a specific flatness in a principal surface region on a top surface of the substrate so as to form a polished intermediate product, then additionally polishing the intermediate product. Substrates made in this way exhibit a good surface flatness at the time of wafer exposure. When a photomask fabricated from a blank obtained from such a substrate is held on the mask stage of a wafer exposure system with a vacuum chuck, the substrate surface undergoes minimal warping, enabling exposure patterns of small geometry to be written onto wafers to good position and linewidth accuracies.Type: ApplicationFiled: July 23, 2004Publication date: January 27, 2005Inventors: Tsuneo Numanami, Masayuki Nakatsu, Masayuki Mogi, Tsuneyuki Hagiwara, Naoto Kondo
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Publication number: 20050019678Abstract: A photomask blank substrate is selected for use in a process where at least a masking film or a phase shift film is deposited on a top surface of a photomask blank substrate to form a photomask blank, the deposited film is patterned to form a photomask, and the photomask is mounted in an exposure tool. The substrate is selected by simulating a change in shape in the top surface of the substrate, from prior to film deposition thereon to when the photomask is mounted in the exposure tool; determining the shape of the substrate top surface prior to the change that will impart to the top surface a flat shape when the photomask is mounted in the exposure tool; and selecting, as an acceptable substrate, a substrate having this top surface shape. The selected substrate has an optimized top surface shape that improves productivity in photomask fabrication.Type: ApplicationFiled: July 23, 2004Publication date: January 27, 2005Inventors: Masayuki Nakatsu, Tsuneo Numanami, Masayuki Mogi, Tsuneyuki Hagiwara, Naoto Kondo
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Publication number: 20030235767Abstract: In a phase shift mask blank comprising a transparent substrate and a phase shift film thereon, after the phase shift film is formed on the substrate, it is surface treated with ozone water having an ozone concentration of at least 1 ppm. The resulting phase shift film is of quality in that it experiences minimized changes of phase difference and transmittance upon immersion in chemical liquid during subsequent mask cleaning step or the like.Type: ApplicationFiled: June 27, 2003Publication date: December 25, 2003Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Yukio Inazuki, Masayuki Nakatsu, Tsuneo Numanami, Atsushi Tajika, Hideo Kaneko, Satoshi Okazaki
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Publication number: 20030025216Abstract: In a phase shift mask blank comprising a transparent substrate and a phase shift film thereon, after the phase shift film is formed on the substrate, it is surface treated with ozone water having an ozone concentration of at least 1 ppm. The resulting phase shift film is of quality in that it experiences minimized changes of phase difference and transmittance upon immersion in chemical liquid during subsequent mask cleaning step or the like.Type: ApplicationFiled: August 6, 2002Publication date: February 6, 2003Inventors: Yukio Inazuki, Masayuki Nakatsu, Tsuneo Numanami, Atsushi Tajika, Hideo Kaneko, Satoshi Okazaki