Abstract: A semiconductor device that prevents a build-up of electrostatic charge in a dummy pad is provided. The semiconductor device may contain an internal circuit formed on a semiconductor substrate and the dummy pad which is not electrically connected to the internal circuit. The semiconductor device may further include a seal ring that surrounds the internal circuit and the dummy pad, where the seal ring is electrically connected to the semiconductor substrate and includes a pattern in a first metal layer, a contact between the pattern in the first metal layer and the semiconductor substrate, patterns in upper metal layers stacked above the pattern in the first metal layer, and multiple electrical contacts between the patterns in the first metal layer and the upper metal layers, in which the dummy pad is electrically connected to the seal ring.

Abstract: A semiconductor device that prevents a build-up of electrostatic charge in a dummy pad is provided. The semiconductor device may contain an internal circuit formed on a semiconductor substrate and the dummy pad which is not electrically connected to the internal circuit. The semiconductor device may further include a seal ring that surrounds the internal circuit and the dummy pad, where the seal ring is electrically connected to the semiconductor substrate and includes a pattern in a first metal layer, a contact between the pattern in the first metal layer and the semiconductor substrate, patterns in upper metal layers stacked above the pattern in the first metal layer, and multiple electrical contacts between the patterns in the first metal layer and the upper metal layers, in which the dummy pad is electrically connected to the seal ring.

Abstract: An image reader and thermal recorder comprises a substrate, an image circuit section and a thermal display circuit section. The substrate is formed of either a monocrystalline silicon wafer or insulating material such as ceramics, glass or quartz having a polycrystalline silicon layer on the surface. The image circuit section comprises photoelectric conversion cells and transfer circuit elements for transferring signals charged in each of photoelectric cells, which are integrally formed in and on the substrate. The display circuit section comprises a shift register for registering display data sensed by photoelectric cells, latch circuit, resistive heating elements including polycrystalline silicon layer and display driving elements, which are also integrally formed in and on the substrate.

Abstract: Disclosed is a thermal print head in which heating resistance elements are arranged with high density. The thermal print head comprises a head substrate, formed of a single-crystal silicon wafer, and a print driver circuit element. The print driver circuit element, which is formed by doping the head substrate directly with an impurity, is composed of an MOS FET. A FET used to form the single-crystal silicon substrate has high electrical mobility, and serves to improve the operating speed of the thermal print head. Each heating resistance element, whose base material is polycrystalline silicon, is adjusted to a predetermined resistance value by being subjected to diffusion of an impurity. The resistance elements are formed on a protuberance which is formed on the head substrate. Thus, the portion of an insulating protective film which corresponds to the protuberance projects outward from the rest, thereby ensuring contact with a printing sheet.

Abstract: A weather resistant thermoplastic resin composition which comprises (A) a graft polymer comprising (A-1) chosen from a copolymer of ethylene and propylene, a terpolymer of ethylene, propylene and a non-conjugated diene, a copolymer of ethylene and vinyl acetate, an alkyl acrylate or methacrylate polymer and a chlorinated polyethylene and (A-2) at least two kinds of monomers chosen from aromatic vinyl compounds, vinyl cyanide compounds and unsaturated carboxylic acid alkyl esters grafted thereon and (B) a terpolymer comprising styrene aromatic compounds, vinyl cyanide compounds and unsaturated carboxylic acid alkyl esters. The weight proportion of the graft polymer (A) and the terpolymer (B) is preferably from 10:90 to 90:10. In particular the amounts of styrene the vinyl cyanide compounds and the unsaturated carboxylic acid alkyl esters in the terpolymer (B) are 3 to 65% by weight, 2 to 35% by weight and 3 to 95% by weight, respectively.

Abstract: A weather-resistant resin having excellent impact resistance, processability and appearance, which comprises a graft polymer comprising an ethylene/alpha-olefin elastomer and at least one monomeric component chosen from aromatic vinyl monomers, vinyl cyanides and alkyl unsaturated carboxylates grafted thereon, the graft polymer having a material soluble in tetrahydrofuran and n-hexane in a volume ratio of 1:4 in a content of not more than 40% by weight and having a material insoluble in tetrahydrofuran in a content of not more than 60% by weight.

Abstract: A metal skid for bundling is substantially shaped like a square pipe, and a series of longitudinally disposed embosses, each extending at least vertically or diagonally, are formed on each sidewall.