Abstract: The present invention provides a polyamide resin composition in which silicate layers originating from a layered silicate and having the below-described property {circle around (1)} are uniformly dispersed on a molecular level in a polyamide resin to accomplish high strength, high modulus, high heat resistance, high toughness, excellent dimensional stability, and high tensile elongation with a small deviation. {circle around (1)}: average particle size from a photograph observation of transmission electron microscopy is 0.1 &mgr;m or less and not including a maximum particle size of 30 &mgr;m or higher.

Abstract: A polyamide resin composition comprising a copolyamide and silicate layers originating from a swellable fluoromica, dispersed in said copolyamide on a molecular level, wherein an average thickness and an average aspect ratio (length/thickness) of the silicate layers are within specific ranges. Also disclosed is a process for preparing the polyamide resin composition.

Abstract: A polyamide resin composition comprising (A) a reinforced polyamide resin which comprises 100 parts by weight of a nylon 6 homopolymer or copolymer and 1 to 20 parts by weight of a layered silicate uniformly dispersed in the polymer on the molecular level and (B) a non-reinforced polyamide resin, a test specimen of said composition having a tensile weld strength of 45 MPa or higher and a flexural modulus of 4 GPa or higher.

Abstract: A reinforced polyamide resin composition which involves 100 parts by weight of a polyamide and from 0.01 to 100 parts by weight of fluoromica-based mineral with swelling characteristics.A process for producing the reinforced polyamide resin composition involving polymerizing a monomer in a state where from 0.01 to 100 parts by weight of fluoromica-based mineral with swelling characteristics is present per the monomer in an amount of forming 100 parts by weight of a polyamide.The reinforced polyamide resin composition is excellent in mechanical strength, toughness, heat resistance and dimensional stability.

Abstract: A surface-roughened film and methods for fabricating same. The film has good transparency/exceptional clarity and high lubricity so that it is useful for a photoengraving material, label, packaging film, magnetic recording film, or clear film. The film has a composition including thermoplastic polyester resin (a) and a thermoplastic resin (b), such as an amorphous nylon, having glass transition temperature preferably 10.degree. C. higher than that of the thermoplastic polyester resin (a) and a critical surface tension more than 0.1 dyne/cm different from that of the thermoplastic polyester resin (a). Resin (b) further has a melt viscosity, at a temperature of 280.degree. C. and shear rate of 10.sup.2 sec.sup.-1, in the range of 500 to 50,000 poise. One or more particulate inert inorganic compound may be added and the film may be laminated to layers of other polymers with the film of the foregoing composition on at least one surface thereof.

Abstract: A photosensitive material for use in electric photography, which comprises in sequence a conductive substrate; a carrier transport layer consisting of a selenium/arsenic alloy; a carrier generation layer consisting of a selenium/tellurium alloy; and an overcoat layer consisting of a selenium/arsenic alloy; wherein carrier injection preventive layers consisting of a selenium/arsenic/sulfur alloy are inserted between the conductive substrate and the carrier transport layer, and between the carrier generation layer and the overcoat layer, or between the carrier generation layer and the overcoat layer, or between both.

Abstract: The invention relates to a polyamide resin composition comprising(A) nylon 4.6,(B) an aliphatic polyamide having a CH.sub.2 /NHCO ratio of from 6 to 11 and(C) a non-crystalline polyamide having a glass transition temperature of at least 100.degree. C. The composition has a decreased water absorption while retaining high mechanical strength, heat stability and chemical resistance. Dimensional stability and mechanical properties after water absorption are unexpectedly good.