Patents by Inventor Tsuneo Tetsuka

Tsuneo Tetsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7105961
    Abstract: A lead-wire-fixing attachment for fixing a lead wire is provided in a lead-wire-fixed portion arranged in a stator core, and a lead wire is connected to a stator-winding mounting board by way of a through-hole provided at the upper end of the lead-wire-fixing attachment. The through-hole is formed by notches provided at a location where the first attachment and second attachment contact each other. An inlet passage through which a potting material is poured, outlet passages through which the potting material runs out, base portions which are inscribed in the inside wall of the lead-wire-fixed portion are formed in the upper portion of the lead-wire-fixing attachment. The lead wire is made to pass through the through-hole and the lead-wire-fixing attachment is inserted in the lead-wire-fixed portion, and then they are fixed by using a potting material.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: September 12, 2006
    Assignee: Minebea Co., Ltd.
    Inventors: Tsuneo Tetsuka, Naohiko Aoyama
  • Publication number: 20030071527
    Abstract: A lead-wire-fixing attachment for fixing a lead wire is provided in a lead-wire-fixed portion arranged in a stator core, and a lead wire is connected to a stator-winding mounting board by way of a through-hole provided at the upper end of the lead-wire-fixing attachment. The through-hole is formed by notches provided at a location where the first attachment and second attachment contact each other. An inlet passage through which a potting material is poured, outlet passages through which the potting material runs out, base portions which are inscribed in the inside wall of the lead-wire-fixed portion are formed in the upper portion of the lead-wire-fixing attachment. The lead wire is made to pass through the through-hole and the lead-wire-fixing attachment is inserted in the lead-wire-fixed portion, and then they are fixed by using a potting material.
    Type: Application
    Filed: August 21, 2002
    Publication date: April 17, 2003
    Applicant: Minebea Co., Ltd
    Inventors: Tsuneo Tetsuka, Naohiko Aoyama