Patents by Inventor Tsuneo Yabuuchi

Tsuneo Yabuuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing a double-sided wiring board
    Patent number: 6766576
    Abstract: The method for producing a printed wiring board comprising the steps of preparing a conductive substrate, forming an insulating layer on one surface of the said substrate, forming at least one via hole in the insulating layer, thermally curing the insulating layer, and reducing at least one oxidized layer formed on the other conductive surface of the substrate during the curing operation. Alternatively, the thermal cure may be accomplished in an atmosphere (e.g., reducing gas, inactive gas, or mixtures thereof) not conducive to oxide formation on metallized circuit surfaces.
    Type: Grant
    Filed: May 9, 2003
    Date of Patent: July 27, 2004
    Assignee: International Business Machines Corporation
    Inventors: Takayuki Haze, Tsuneo Yabuuchi
  • Method for producing a double-sided wiring board
    Publication number: 20030188429
    Abstract: The method for producing a printed wiring board comprising the steps of preparing a conductive substrate, forming an insulating layer on one surface of the said substrate, forming at least one via hole in the insulating layer, thermally curing the insulating layer, and reducing at least one oxidized layer formed on the other conductive surface of the substrate during the curing operation. Alternatively, the thermal cure may be accomplished in an atmosphere (e.g., reducing gas, inactive gas, or mixtures thereof) not conducive to oxide formation on metallized circuit surfaces.
    Type: Application
    Filed: May 8, 2003
    Publication date: October 9, 2003
    Applicant: International Business Machines Corporation
    Inventors: Takayuki Haze, Tsuneo Yabuuchi
  • Method for producing a doublesided wiring board
    Patent number: 6571467
    Abstract: The method for producing a printed wiring board comprising the steps of preparing a conductive substrate, forming an insulating layer on one surface of the said substrate, forming at least one via hole in the insulating layer, thermally curing the insulating layer, and reducing at least one oxidized layer formed on the other conductive surface of the substrate during the curing operation. Alternatively, the thermal cure may be accomplished in an atmosphere (e.g., reducing gas, inactive gas, or mixtures thereof) not conducive to oxide formation on metallized circuit surfaces.
    Type: Grant
    Filed: July 21, 1999
    Date of Patent: June 3, 2003
    Assignee: International Business Machines Corporation
    Inventors: Takayuki Haze, Tsuneo Yabuuchi
  • METHOD FOR PRODUCING A DOUBLESIDED WIRING BOARD
    Publication number: 20020004982
    Abstract: The method for producing a printed wiring board comprising the steps of preparing a conductive substrate, forming an insulating layer on one surface of the said substrate, forming at least one via hole in the insulating layer, thermally curing the insulating layer, and reducing at least one oxidized layer formed on the other conductive surface of the substrate during the curing operation. Alternatively, the thermal cure may be accomplished in an atmosphere (e.g., reducing gas, inactive gas, or mixtures thereof) not conducive to oxide formation on metallized circuit surfaces.
    Type: Application
    Filed: July 21, 1999
    Publication date: January 17, 2002
    Inventors: TAKAYUKI HAZE, TSUNEO YABUUCHI