Patents by Inventor Tsunetoshi Saito

Tsunetoshi Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140010500
    Abstract: An optical connector is structured so as to include a fiber connection structure therein. A multi-core fiber is included inside a ferrule, and affixed to the ferrule substrate. One end surface of the multi-core fiber is exposed to an end surface of the ferrule. The other end of the multi-core fiber passes through and is affixed to a capillary. A plurality of optical fiber pass through a capillary that faces the capillary, and are affixed thereto the capillary in the same manner. Seven optical fiber cores of the same diameter are joined in a close-packed arrangement in the fiber connection structure.
    Type: Application
    Filed: September 9, 2013
    Publication date: January 9, 2014
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Tsunetoshi SAITO, Kengo WATANABE
  • Publication number: 20140010501
    Abstract: A multicore fiber has a plurality of cores formed at predetermined distances and surrounded by a cladding. A bundle structure includes optical fibers joined in a close-packed arrangement. Specifically, one optical fiber is arranged at a center, and six optical fibers are arranged around the optical fiber arranged at the center. Accordingly, cores of the optical fibers are arranged at equal distances. The optical fibers are bonded together with an adhesive. Accordingly, claddings of adjacent optical fibers are in contact with each other either directly or via the adhesive. The adhesive also fills spaces between the optical fibers.
    Type: Application
    Filed: September 9, 2013
    Publication date: January 9, 2014
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tsunetoshi SAITO, Kengo WATANABE
  • Publication number: 20140010499
    Abstract: The optical connector ferrule has a second alignment board and a housing part having a first alignment board and a pair of side support parts. The first alignment board has a surface in which bare fiber parts of a optical fiber ribbon are positioned in a width direction and has holding grooves for arranging bare fiber parts. Side support parts support ends of the first alignment board and have an open part larger than a width of the ribbon in a upper and/or lower surface side of the first alignment board. The second alignment board has a positioning part for positioning in the width direction by engaging with a part of bare fiber parts on holding grooves and a fixing part for pressing and fixing bare fiber parts. The second alignment board is arranged to face the first alignment board and to sandwich bare fiber parts.
    Type: Application
    Filed: August 14, 2013
    Publication date: January 9, 2014
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Katsuki SUEMATSU, Tsunetoshi SAITO, Takayuki ANDO, Mitsuhiro IWAYA
  • Publication number: 20120237168
    Abstract: An optical connector includes a fiber holder with guide holes for guiding optical fibers, a space communicating with the guide holes and to accommodate the optical fibers, and a deformable member that forms at least a part of the fiber holder and causes the space to deform or displace to allow a part or all of the optical fibers to bend in the space.
    Type: Application
    Filed: January 27, 2012
    Publication date: September 20, 2012
    Applicants: FURUKAWA ELECTRIC CO., LTD., FUJITSU LIMITED
    Inventors: Tsuyoshi AOKI, Shigenori AOKI, Hidenobu MURANAKA, Mitsuhiro IWAYA, Tsunetoshi SAITO, Katsuki SUEMATSU
  • Patent number: 7010184
    Abstract: An optical module comprising a planar lightwave circuit chip comprising a substrate and a waveguide forming region located on said substrate, a plurality of lids installed along a edge surface at least at one side of the edges of said planar lightwave circuit chip, and an optical fiber array connected to said planar lightwave circuit chip.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: March 7, 2006
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Junichi Hasegawa, Tsunetoshi Saito
  • Patent number: 6830384
    Abstract: An optical fiber module of the invention is a small-sized optical fiber module with small electric power consumption in which the characteristics are hardly deteriorated in association with environmental changes. The optical fiber module has a package, an optical component housed inside the package, and optical component holding parts disposed between the optical component and the package for holding the optical component. The configuration of holding the optical component by the optical component holding parts has a configuration of reducing heat conduction for reducing the heat conduction between the optical component and the package. The configuration of reducing heat conduction is such that the optical component holding parts hold the optical component in line contact.
    Type: Grant
    Filed: January 29, 2003
    Date of Patent: December 14, 2004
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Junichi Hasegawa, Tsunetoshi Saito, Kanji Tanaka, Kazuhisa Kashihara
  • Patent number: 6826332
    Abstract: At least one of two slab waveguides constituting an arrayed waveguide grating is cut and separated together with a substrate on a cross separating face. A slide moving member is arranged over a waveguide forming area formed on the substrate including the separating slab waveguide and a waveguide forming area formed on the substrate including the separating slab waveguide. Temperature dependence of the center wavelength of the arrayed waveguide grating is reduced by slide-moving the separating slab waveguide by the slide moving member along the cross separating face dependently on temperature. The shift of an initial center wavelength is corrected by plastically deforming the slide moving member so that the initial center wavelength is conformed to a grid wavelength.
    Type: Grant
    Filed: April 23, 2002
    Date of Patent: November 30, 2004
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Tsunetoshi Saito, Kazuhisa Kashihara, Kanji Tanaka, Junichi Hasegawa, Yoshinobu Nekado, Yoshimi Ono
  • Publication number: 20040156577
    Abstract: An optical module comprising a planar lightwave circuit chip comprising a substrate and a waveguide forming region located on said substrate, a plurality of lids installed along a edge surface at least at one side of the edges of said planar lightwave circuit chip, and an optical fiber array connected to said planar lightwave circuit chip.
    Type: Application
    Filed: August 22, 2003
    Publication date: August 12, 2004
    Applicant: The Furukawa Electric Co., Ltd.
    Inventors: Junichi Hasegawa, Tsunetoshi Saito
  • Patent number: 6769817
    Abstract: An optical fiber module is formed by storing an optical component and a connection portion of this optical component and an optical fiber into a package. The optical fiber module has the package, the optical component unfixedly stored into the package, and the optical fiber in which one end side of the optical fiber is connected to the optical component and the other end side is pulled out of the package to the package exterior. An optical fiber anchor member is arranged in the package in an extraction preventing state in an optical fiber pulling-out area of the package. The optical fiber is fixed to the optical fiber anchor member. The optical fiber anchor member and the package are set to be relatively moved in the optical fiber longitudinal direction.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: August 3, 2004
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Tsunetoshi Saito, Junichi Hasegawa, Kanji Tanaka, Kazuhisa Kashihara
  • Patent number: 6757453
    Abstract: The present invention is an optical waveguide module having e.g., a high impact resisting property and a high vibration resisting property. An optical waveguide circuit chip is supported by at least a peripheral portion of an edge portion and is stored into a storing portion of a package. The optical waveguide chip is formed by arranging an optical waveguide forming area on a substrate. An elastic member for impact relaxation of the optical waveguide circuit chip is arranged in at least one portion of the vicinity of the edge portion of the optical waveguide circuit chip. For example, the elastic member is arranged in the vicinity of each of four corners of the optical waveguide circuit chip.
    Type: Grant
    Filed: March 18, 2002
    Date of Patent: June 29, 2004
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Yoshinobu Nekado, Tsunetoshi Saito, Kazuhisa Kashihara
  • Patent number: 6748156
    Abstract: A method for connecting optical waveguides to optical fibers, the optical waveguides being arranged side by side in an optical waveguide circuit device, the method including inserting optical fibers into arranging guide grooves formed side by side in a guide substrate of an optical fiber array device, warping the optical fiber array device by a contraction stress caused by hardening of an adhesive for attaching the guide substrate to a cap plate for attachment and fixing, and optically connecting the optical waveguides to the optical fibers, by facing a connection terminal surface of the optical waveguide circuit device to a connection terminal surface of the optical fiber array device in the curved shape.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: June 8, 2004
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Tsunetoshi Saito, Toshihiko Ota
  • Patent number: 6668117
    Abstract: An arrayed waveguide grating optical multiplexer/demultiplexer is provided to suppress a temperature depending characteristic of a center wavelength. The arrayed waveguide grating comprises at least one optical input waveguide, a first slab waveguide, an arrayed waveguide, a second slab waveguide, and a plurality of optical output waveguides. The first slab waveguide is separated on an cross separating plane which is intersected to a path of light passing through the first slab waveguide to constitute separated slab waveguides. A slide moving member is provided which may move at least one of these separated slab waveguides along the cross separating plane, depending upon the temperature. A front surface side of the waveguide forming region and a rear surface side of the substrate are sandwiched by a positional shift suppressing member such as a clip. The possition depressing the waveguide forming region by the clip is escaped from the optical axis of the separated slab waveguides.
    Type: Grant
    Filed: March 12, 2002
    Date of Patent: December 23, 2003
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Junichi Hasegawa, Atsushi Hi Raizumi, Tsunetoshi Saito, Yoshinobu Nekado
  • Publication number: 20030161594
    Abstract: An optical fiber module of the invention is a small-sized optical fiber module with small electric power consumption in which the characteristics are hardly deteriorated in association with environmental changes. The optical fiber module has a package, an optical component housed inside the package, and optical component holding parts disposed between the optical component and the package for holding the optical component. The configuration of holding the optical component by the optical component holding parts has a configuration of reducing heat conduction for reducing the heat conduction between the optical component and the package. The configuration of reducing heat conduction is such that the optical component holding parts hold the optical component in line contact.
    Type: Application
    Filed: January 29, 2003
    Publication date: August 28, 2003
    Applicant: The Furukawa Electric Co., Ltd.
    Inventors: Junichi Hasegawa, Tsunetoshi Saito, Kanji Tanaka, Kazuhisa Kashihara
  • Publication number: 20030142946
    Abstract: An optical fiber module of the invention is an optical fiber module easily fabricated and excellent in the characteristics of enduring high intensity light, for example. The connection end face of an optical fiber array as an optical component is faced to the connection end face of a planar lightwave circuit component. An optical fiber array is also disposed on the connection end face of the planar lightwave circuit component opposite to the optical fiber array. The corresponding connection end faces are connected to each other with an adhesive. A no adhesive filled part where the adhesive is not applied in the light transmitting area is disposed in at least one of bonding parts thereof.
    Type: Application
    Filed: November 13, 2002
    Publication date: July 31, 2003
    Applicant: The Furukawa Electric Co. Ltd.
    Inventors: Tsunetoshi Saito, Junichi Hasegawa, Kanji Tanaka, Kazuhisa Kashihara
  • Publication number: 20030138221
    Abstract: An optical fiber module includes an optical component housed inside a package. One end of an optical fiber is connected to the optical component. Another end of the optical fiber is drawn to outside of the package. The optical fiber is fixed to the optical fiber fixing part of the package between the one end and the another end of the optical fiber when temperature in the optical fiber fixing part is kept at a temperature lower than an upper limit temperature of the usable temperature range of the optical component by at least approximately 0° C. and at most approximately 30° C.
    Type: Application
    Filed: November 1, 2002
    Publication date: July 24, 2003
    Applicant: The Furukawa Electric Co., Ltd.
    Inventors: Junichi Hasegawa, Tsunetoshi Saito
  • Publication number: 20030108283
    Abstract: The present invention provides an optical demultiplexer module capable of narrowing the interval between wavelengths of divided light. The optical demultiplexer module is provided with an optical circulator (2) or a non-reciprocal optical branching device, the first and second optical waveguides (3) and (4) connected to the optical circulator or non-reciprocal optical branching device, and the second arrayed waveguide diffraction grating (6) connected to the second optical waveguide (4) and having a plurality of emitting ports (6a) through (6h). The first optical waveguide (3) has a plurality of filters (3a) through (3i) which reflects light of a specified wavelength to the second optical waveguide (4) via the optical circulator (2) or non-reciprocal optical branching device. In the second arrayed waveguide diffraction grating (6), the center wavelengths of light emitted from a plurality of emitting ports differ by an appointed frequency in terms of frequency.
    Type: Application
    Filed: May 14, 2002
    Publication date: June 12, 2003
    Inventors: Toshihiko Ota, Haruki Ogoshi, Tsunetoshi Saito, Toshiaki Tsuda
  • Publication number: 20030103738
    Abstract: An optical fiber module is formed by storing an optical component and a connection portion of this optical component and an optical fiber into a package. The optical fiber module has the package, the optical component unfixedly stored into the package, and the optical fiber in which one end side of the optical fiber is connected to the optical component and the other end side is pulled out of the package to the package exterior. An optical fiber anchor member is arranged in the package in an extraction preventing state in an optical fiber pulling-out area of the package. The optical fiber is fixed to the optical fiber anchor member. The optical fiber anchor member and the package are set to be relatively moved in the optical fiber longitudinal direction. Tensile stress applied from the exterior to the optical fiber and the influence of thermal expansion and contraction of the package are restrained by this relative movement.
    Type: Application
    Filed: October 1, 2002
    Publication date: June 5, 2003
    Applicant: The Furukawa Electric Co., Ltd.
    Inventors: Tsunetoshi Saito, Junichi Hasegawa, Kanji Tanaka, Kazuhisa Kashihara
  • Publication number: 20030095776
    Abstract: A method for connecting optical waveguides to optical fibers, the optical waveguides being arranged side by side in an optical waveguide circuit device, the method including inserting optical fibers into arranging guide grooves formed side by side in a guide substrate of an optical fiber array device, warping the optical fiber array device by a contraction stress caused by hardening of an adhesive for attaching the guide substrate to a cap plate for attachment and fixing, and optically connecting the optical waveguides to the optical fibers, by facing a connection terminal surface of the optical waveguide circuit device to a connection terminal surface of the optical fiber array device in the curved shape.
    Type: Application
    Filed: November 13, 2002
    Publication date: May 22, 2003
    Applicant: The Furukawa Electric Co, Ltd.
    Inventors: Tsunetoshi Saito, Toshihiko Ota
  • Publication number: 20030091289
    Abstract: A planar lightwave circuit module includes a plate provided on a substrate. An end array surface of an optical fiber array is connected to an end substrate surface of the substrate and an end plate surface of the plate such that at least one optical fiber of the optical fiber array is connected to at least one optical waveguide formed on an upper substrate surface of the substrate and such that a bottom substrate surface of the substrate and a bottom array surface of the optical fiber array are substantially on a first plane and/or an upper plate surface of the plate and an upper array surface of the optical fiber array are substantially on a second plane.
    Type: Application
    Filed: November 5, 2002
    Publication date: May 15, 2003
    Applicant: The Furukawa Electric Co., Ltd.
    Inventors: Tsunetoshi Saito, Junichi Hasegawa, Kanji Tanaka, Kazuhisa Kashihara
  • Patent number: 6529670
    Abstract: An optical fiber array device including a guide substrate formed with a plurality of optical fiber arranging guide grooves and a cap plate, the optical fiber array device being warped by a contraction stress associated with hardening an adhesive used to attach the guide substrate to the cap plate, the warp being controlled to align the optical fiber array device with a corresponding optical waveguide device.
    Type: Grant
    Filed: July 7, 2000
    Date of Patent: March 4, 2003
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Tsunetoshi Saito, Toshihiko Ota