Patents by Inventor Tsuneyuki Shimoda

Tsuneyuki Shimoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 8040682
    Abstract: A semiconductor device comprises: a plurality of semiconductor chip; a socket; and a mounting board equipped with the socket. Each of the semiconductor chips has a major surface, a back surface and a plurality of connection terminals on the major surface. The socket has internal connection terminals inside and external connection terminals outside, and the internal connection terminals are in contact with the connection terminals of the semiconductor chips.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: October 18, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Tsuneyuki Shimoda
  • Semiconductor device
    Publication number: 20070096308
    Abstract: A semiconductor device comprises: a plurality of semiconductor chip; a socket; and a mounting board equipped with the socket. Each of the semiconductor chips has a major surface, a back surface and a plurality of connection terminals on the major surface. The socket has internal connection terminals inside and external connection terminals outside, and the internal connection terminals are in contact with the connection terminals of the semiconductor chips.
    Type: Application
    Filed: October 13, 2006
    Publication date: May 3, 2007
    Applicant: Kabushiki Kaisha Toshiba
    Inventor: Tsuneyuki Shimoda