Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes providing a substrate for an interposer, and forming a conductive interconnect structure in and on the substrate for connecting a group of selected IC dies. The method includes forming warpage-reducing trenches in non-routing regions of the interposer, wherein the warpage-reducing trenches are sized and positioned based on a warpage characteristic to reduce the warpage of the chip package structure. The method also includes depositing a warpage-relief material in the warpage-reducing trenches according to the warpage characteristic to reduce the warpage of the chip package structure, and bonding the group of selected IC dies to the interposer to form a chip package structure.

Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.

Abstract: An armlike driving mechanism includes a power source connected to a screw rod and a nut, a driving assembly including a first gear, a second gear, and a drive belt, a rail assembly including a linear rail and a sliding element, and a connecting block fixed on the drive belt and linked to the nut and the sliding element. The power source drives the screw rod and the nut by back and forth rotation, thereby displacing the sliding element in an X axle direction and driving the first gear in an Y axle direction by the connecting block and the drive belt, so as to operate the armlike driving mechanism.

Abstract: The present invention relates to a suction device with telescopic evacuating pipes which includes a cantilever, a plurality of glide pieces, a pipe-collecting piece and a plurality of telescopic evacuating pipes. The cantilever is provided with a glide groove at both sides thereof. The glide pieces are movable along the glide groove of the cantilever and are positioned by fastening knobs. Each of the glide pieces has a vacuum sucker 132 at the bottom thereof. A first connector is arranged at one side of the glide pieces and used to connect through the internal piping with the vacuum sucker. The pipe-collecting piece is installed at the inner end of the cantilever and is used to join second connectors in connection with a vacuum generator through hosepipes. One end of the telescopic evacuating pipe is fastened at the outer end of the pipe-collecting piece while the other end is connected to the first connector.

Abstract: The present invention relates to a suction device with telescopic evacuating pipes which includes a cantilever, a plurality of glide pieces, a pipe-collecting piece and a plurality of telescopic evacuating pipes. The cantilever is provided with a glide groove at both sides thereof. The glide pieces are movable along the glide groove of the cantilever and are positioned by fastening knobs. Each of the glide pieces has a vacuum sucker 132 at the bottom thereof. A first connector is arranged at one side of the glide pieces and used to connect through the internal piping with the vacuum sucker. The pipe-collecting piece is installed at the inner end of the cantilever and is used to join second connectors in connection with a vacuum generator through hosepipes. One end of the telescopic evacuating pipe is fastened at the outer end of the pipe-collecting piece while the other end is connected to the first connector.

Abstract: A plate member carrier is constructed to include a suction device adapted to suck and transfer the workpiece, a first four-bar linkage adapted to keep the suction device in horizontal, a second four-bar linkage adapted to prohibit the suction device from transverse displacement, and a cam adapted to control vertical movement of the suction device subject to a simple harmonic motion curve.

Abstract: The present invention relates to a circuit board carrier including a carrier sliding between a conveyor and a holder disposed at the lower part of a main machine. The carrier includes a sliding rail disposed at the top of a main machine above the conveyor and the holder; a sliding base being on the sliding rail by means of a sliding recess thereof; a sliding rod disposed above the sliding base and being vertically spaced to the sliding rail; a sliding seat being slid on the sliding rod by means of a sliding piece and having a shaft post at the top thereof; a pivot sleeve pivoted on the shaft post of the sliding seat by means of a bearing thereof and having a connection groove; a turning arm, one end of which is connected to the connection groove of the pivot sleeve while the other end thereof is connected to a motor and a driving axle of a reduction machine; and a suction unit installed under the sliding base.