Abstract: The present disclosure provides a battery charging system and method. The battery charging method includes: determining a degree of healthy of a battery module according to an evaluation mechanism; setting a charging standard according to the degree of healthy; by handshaking with a charger, setting a charging voltage for the charger according to the charging standard to charge the battery module; and by the charger, perform a charging operation on the battery module until a fully charged condition is satisfied.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: The present disclosure provides a method of manufacturing a semiconductor structure. The method includes forming a first patterned layer over a substrate; forming a second patterned layer over the substrate and alternately arranged with the first patterned layer; performing an etching, thereby forming an arched surface of the first patterned layer and an arched surface of the second patterned layer; forming a sacrificial layer over the first patterned layer and the second patterned layer, wherein a plurality of air gaps are defined by the substrate, the first patterned layer, the second patterned layer and the sacrificial layer; removing the sacrificial layer above the plurality of air gaps, thereby forming a planar top surface of the first patterned layer and a planar top surface of the second patterned layer; and patterning the substrate using the first patterned layer and the second patterned layer as a mask.

Abstract: In order to reduce the occurrence of current alarms in a semiconductor etching or deposition process, a controller determines an offset in relative positions of a cover ring and a shield over a wafer within a vacuum chamber. The controller provides a position alarm and/or adjusts the position of the cover ring or shield when the offset is greater than a predetermined value or outside a range of acceptable values.

Abstract: In an embodiment, a circuit includes: an error amplifier; a temperature sensor, wherein the temperature sensor is coupled to the error amplifier; a discrete time controller coupled to the error amplifier, wherein the discrete time controller comprises digital circuitry; a multiple bits quantizer coupled to the discrete time controller, wherein the multiple bits quantizer produces a digital code output; and a heating array coupled to the multiple bits quantizer, wherein the heating array is configured to generate heat based on the digital code output.

Abstract: The present disclosure provides a manufacturing method of a semiconductor structure. The method includes: forming a conformal layer over a first patterned layer over a substrate; forming a second layer over the conformal layer and between portions of the first patterned layer; performing a first etching to form a second patterned layer and a patterned conformal layer; performing a second etching to remove a portion of the first patterned layer to form a first inclined member of the first patterned layer tapered away from the substrate and lining a vertical portion of the patterned conformal layer, and to remove a portion of the second patterned layer to form a second inclined member of the second patterned layer tapered away from the substrate and lining the vertical portion of the patterned conformal layer; and performing a third etching to remove the vertical portions of the patterned conformal layer.

Abstract: The present disclosure provides a manufacturing method of a semiconductor structure. The method includes: forming a conformal layer over a first patterned layer over a substrate; forming a second layer over the conformal layer and between portions of the first patterned layer; performing a first etching to form a second patterned layer and a patterned conformal layer; performing a second etching to remove a portion of the first patterned layer to form a first inclined member of the first patterned layer tapered away from the substrate and lining a vertical portion of the patterned conformal layer, and to remove a portion of the second patterned layer to form a second inclined member of the second patterned layer tapered away from the substrate and lining the vertical portion of the patterned conformal layer; and performing a third etching to remove the vertical portions of the patterned conformal layer.

Abstract: The present disclosure provides a method of manufacturing a semiconductor structure. The method includes forming a first patterned layer over a substrate; forming a second patterned layer over the substrate and alternately arranged with the first patterned layer; performing an etching, thereby forming an arched surface of the first patterned layer and an arched surface of the second patterned layer; forming a sacrificial layer over the first patterned layer and the second patterned layer, wherein a plurality of air gaps are defined by the substrate, the first patterned layer, the second patterned layer and the sacrificial layer; removing the sacrificial layer above the plurality of air gaps, thereby forming a planar top surface of the first patterned layer and a planar top surface of the second patterned layer; and patterning the substrate using the first patterned layer and the second patterned layer as a mask.

Abstract: The present disclosure provides a method of manufacturing a semiconductor structure. A first patterned layer and a second patterned layer are formed over a substrate. The second patterned layer and the first patterned layer are alternately arranged. An etching is performed, thereby forming an arched surface of the first patterned layer and an arched surface of the second patterned layer. A sacrificial layer is formed over the first patterned layer and the second patterned layer, wherein a plurality of air gaps are defined by the substrate, the first patterned layer, the second patterned layer and the sacrificial layer. The sacrificial layer above the plurality of air gaps is removed, and a planar top surface of the first patterned layer and a planar top surface of the second patterned are thereby formed. The substrate is then patterned using the first patterned layer and the second patterned layer as a mask.

Abstract: A method of manufacturing a semiconductor structure includes the following operations. A buffer layer is formed over a substrate. A first top hard mask is formed on the buffer layer, in which the first top hard mask has a first trench to expose a first portion of the buffer layer. A spacer layer is formed to cover a sidewall of the first trench and an upper surface of the first top hard mask and the first portion of the buffer layer to form a second trench over the first portion. The top portion and the bottom portion are etched to form a thinned top portion and a thinned bottom portion. A second top hard mask is formed in the second trench. The thinned top portion and the vertical portion of the spacer layer are removed.

Abstract: An automatic nucleic acid detection system and a method thereof are disclosed. The automatic nucleic acid detection method includes: performing, by an automatic control subsystem, on a nucleic acid extraction machine platform, a nucleic acid extraction on one or more specimens in a sample tray to generate one or more corresponding nucleic acids in the sample tray; distributing, by the automatic control subsystem, on a nucleic acid distribution machine platform, the nucleic acid in each hole of the sample tray and a first reagent into a plurality of holes of a detection tray, wherein the number of holes of the detection tray is greater than that of the sample tray; and performing, by the automatic control subsystem, on a nucleic acid detection machine platform, a nucleic acid detection on the detection tray.

Abstract: A gas sensing device comprises a silicon substrate, an insulating layer, a plasma treatment layer, a metal electrode and a sensing layer. The insulating layer is formed on the silicon substrate. The plasma treatment layer is formed on the insulating layer. The metal electrode is formed on the portion of the plasma treatment layer. The sensing layer is formed on a surface of the metal electrode and the plasma treatment layer. Through plasma treatment for the substrate and printing graphene film on the substrate and the electrode, the adsorption characteristics of gas selection ratio for graphene is improved, and the processing time of the plasma treatment is adjusted to optimize the sensing characteristics.

Abstract: Light-addressable potentiometric sensing units are provided. A light-addressable potentiometric sensing unit comprises a conductive substrate, a metal oxide semiconductor layer, and a sensing layer. The metal oxide semiconductor layer is made of indium gallium zinc oxide, indium gallium oxide, indium zinc oxide, indium oxide co-doped with tin and zinc, tin oxide, or zinc oxide. The wide-band gap characteristic of the metal oxide semiconductor layer enables the light-addressable potentiometric sensing unit to resist the interference from visible light. The light-addressable potentiometric sensing unit therefore exhibits a more stable performance.

Abstract: Light-addressable potentiometric sensing units are provided. A light-addressable potentiometric sensing unit comprises a conductive substrate, a metal oxide semiconductor layer, and a sensing layer. The metal oxide semiconductor layer is made of indium gallium zinc oxide, indium gallium oxide, indium zinc oxide, indium oxide co-doped with tin and zinc, tin oxide, or zinc oxide. The wide-band gap characteristic of the metal oxide semiconductor layer enables the light-addressable potentiometric sensing unit to resist the interference from visible light. The light-addressable potentiometric sensing unit therefore exhibits a more stable performance.

Abstract: A Radio Frequency Identification (RFID) assembly includes an RFID reader/writer having a first micro-USB (Universal-Serial-Bus) connector and a mobile phone having a second micro-USB connector configured to electrically connect to the first micro-USB connector. In one embodiment of the present disclosure, the RFID reader/writer includes a circuit board having a first processor and a first USB controller, and an antenna board stacked on the circuit board, wherein the first USB controller electrically connects the first processor and the first micro-USB connector, and the antenna board includes a reverse F-shaped antenna. In one embodiment of the present disclosure, the mobile phone includes a second processor, and a second USB controller electrically connecting the second processor and the second micro-USB connector.

Abstract: A Radio Frequency Identification (RFID) assembly includes an RFID reader/writer having a first micro-USB (Universal-Serial-Bus) connector and a mobile phone having a second micro-USB connector configured to electrically connect to the first micro-USB connector. In one embodiment of the present disclosure, the RFID reader/writer includes a circuit board having a first processor and a first USB controller, and an antenna board stacked on the circuit board, wherein the first USB controller electrically connects the first processor and the first micro-USB connector, and the antenna board includes a reverse F-shaped antenna. In one embodiment of the present disclosure, the mobile phone includes a second processor, and a second USB controller electrically connecting the second processor and the second micro-USB connector.

Abstract: An umbrella structure with lighting device comprising a hollow shaft, a plurality of radial arranged stretchers mounted to the hollow shaft, a layer of fabric covered onto the stretchers, a light-emission device mounted at the tip of the hollow shaft, a handle connected at the bottom end of the hollow shaft, and a power supply device mounted with the handle, characterized in that the light-emission device comprises a light transmissive tube cover screwed at the tip of the hollow shaft, a light-emission body mounted within the tube cover, a fluorescent plate positioned between the light-emission body and the tube cover, and a stopper mounted at the top cover of the tube cover, the light emission body is lighted to flicker and the intensity of the emitted light is increased as a result of reflection and refraction by fluorescent body positioned within the fluorescent plate, the fluorescent light is emitted through the transparent tube cover to provide an alarming effect in the night.

Abstract: A retractable umbrella jacket structure which can be assembled and disassembled comprising a water-guiding plug, water-collection collar and umbrella jacket, screw ring, the water-guiding plug allowing the tip of the umbrella to pass through and being secured, and the water-guiding plug passed through the water-collection collar, and the umbrella jacket being a plurality of tapered mounting rings, characterized in that the top end of the water-collection collar is mounted with a hollow screw seat, after the first mounting ring is mounted onto the water-collection collar, screwed ring is secured to the screw seat such that the umbrella jacket is engaged at the water-collection jacket, and if the screwed ring is removed, the umbrella jacket is disengaged from the water-collection jacket, and the hollow screw seat of the water-collection jacket is mounted with a spring and a water-discharging valve, the water discharging valve is a hollow cap extended with a teeth-like valve rod having an inverted hook at the to

Abstract: A telescopic umbrella case which possesses water-collecting function and light-reflecting effect for enhancing the safety of a user when walking at night. The umbrella case is composed of an innermost top sleeve member and several subsidiary sleeve members which are telescopically assembled and able to be extended into an elongated state for entirely covering an umbrella. A resilient water-draining valve is disposed at a top end of the first sleeve member. The water-draining valve includes a valve rod and a valve body. The valve rod is pressable against the ground to push the valve body away from a water-draining hole of the top sleeve member, permitting the rain water collected therein to flow through the water-draining hole down onto the ground.