Patents by Inventor Tsung-Cheng Ho

Tsung-Cheng Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11940658
    Abstract: An optical fiber module is provided and includes an optical fiber structure, a light-absorbing area and a photoelectric sensor in a housing. The optical fiber structure collectively arranges a plurality of first optical fibers to form at least one optical fiber bundle with a tapered end, and a second optical fiber is connected to the tapered end of the optical fiber bundle to converge the optical fiber bundle to the second optical fiber. The light-absorbing area corresponds to an end of the second optical fiber, such that the light-absorbing area absorbs scattering signals escaped and scattered when signals are transmitted from the plurality of first optical fibers to the second optical fiber. The photoelectric sensor is arranged corresponding to the plurality of first optical fibers to receive target signals escaped and refracted when the signals are transmitted from the second optical fiber to the plurality of first optical fibers.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: March 26, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsin-Chia Su, Ying-Hui Yang, Yu-Cheng Song, Tsung-Jun Ho
  • Patent number: 11875973
    Abstract: Methods for preparing a void-free protective coating are disclosed herein. The void-free protective coating is used on a dielectric window having a central hole, which is used in a plasma treatment tool. A first protective coating layer is applied to the window, leaving an uncoated annular retreat area around the central hole. The first protective coating layer is polished to produce a flat surface and fill in any voids on the window. A second protective coating layer is then applied upon the flat surface of the first protective coating layer to obtain the void-free coating. This increases process uptime and service lifetime of the dielectric window and the plasma treatment tool.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: January 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Tsung Chen, Tsung-Cheng Ho, Chien-Yu Wang, Yen-Shih Wang, Jiun-Rong Pai, Yeh-Chieh Wang
  • Publication number: 20230367339
    Abstract: Methods for preparing a void-free protective coating are disclosed herein. The void-free protective coating is used on a dielectric window having a central hole, which is used in a plasma treatment tool. A first protective coating layer is applied to the window, leaving an uncoated annular retreat area around the central hole. The first protective coating layer is polished to produce a flat surface and fill in any voids on the window. A second protective coating layer is then applied upon the flat surface of the first protective coating layer to obtain the void-free coating. This increases process uptime and service lifetime of the dielectric window and the plasma treatment tool.
    Type: Application
    Filed: July 26, 2023
    Publication date: November 16, 2023
    Inventors: Shih-Tsung Chen, Yeh-Chieh Wang, Yen-Shih Wang, Chien-Yu Wang, Jiun-Rng Pai, Tsung-Cheng Ho
  • Publication number: 20230025296
    Abstract: Methods for preparing a void-free protective coating are disclosed herein. The void-free protective coating is used on a dielectric window having a central hole, which is used in a plasma treatment tool. A first protective coating layer is applied to the window, leaving an uncoated annular retreat area around the central hole. The first protective coating layer is polished to produce a flat surface and fill in any voids on the window. A second protective coating layer is then applied upon the flat surface of the first protective coating layer to obtain the void-free coating. This increases process uptime and service lifetime of the dielectric window and the plasma treatment tool.
    Type: Application
    Filed: February 8, 2022
    Publication date: January 26, 2023
    Inventors: Shih-Tsung Chen, Tsung-Cheng Ho, Chien-Yu Wang, Yen-Shih Wang, Jiun-Rong Pai, Yeh-Chieh Wang