Patents by Inventor Tsung-Cheng Kuo

Tsung-Cheng Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961777
    Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo, Jung-Wei Cheng, Tsung-Ding Wang, Yu-Hsiang Hu, Sih-Hao Liao
  • Publication number: 20240105654
    Abstract: A method of making a semiconductor device includes patterning a conductive layer over a substrate to define a conductive pad having a first width. The method includes depositing a passivation layer, wherein the passivation layer directly contacts the conductive pad. The method includes depositing a protective layer over the passivation layer, wherein the protective layer directly contacts the conductive pad. The method includes depositing an under-bump metallization (UBM) layer directly contacting the conductive pad, wherein the UBM layer has a second width greater than the first width. The method includes depositing a mask layer over the UBM layer; and forming an opening in the mask layer wherein the opening has the second width. The method includes forming a conductive pillar in the opening on the UBM layer; and etching the UBM layer using the conductive pillar as a mask, wherein the etched UBM layer has the second width.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Inventors: Chita CHUANG, Yao-Chun CHUANG, Tsung-Shu LIN, Chen-Cheng KUO, Chen-Shien CHEN
  • Patent number: 8385575
    Abstract: A reflex enclosure, includes an enclosure body, a loudspeaker, a waveguide portion and a vibration unit; a rearward sound wave generated from the loudspeaker is guided 360 degree (in all directions) from the outside of the waveguide portion to the inside of the waveguide portion, and then push the vibration unit to generate vibration to generate a corresponding sound wave, thereby reducing a standing wave ratio of the rearward sound wave in a sound room to obtain a better timbre. Furthermore, the length of a rearward sound wave guiding distance can be extended, allowing the sound wave to have the effect of extending toward a low frequency compass. In addition, the rearward sound wave is allowed to compress to increase a vibration unit pushing force, thereby obtaining a better sound effect.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: February 26, 2013
    Inventor: Tsung-Cheng Kuo
  • Publication number: 20130004008
    Abstract: A reflex enclosure, includes an enclosure body, a loudspeaker, a waveguide portion and a vibration unit; a rearward sound wave generated from the loudspeaker is guided 360 degree (in all directions) from the outside of the waveguide portion to the inside of the waveguide portion, and then push the vibration unit to generate vibration to generate a corresponding sound wave, thereby reducing a standing wave ratio of the rearward sound wave in a sound room to obtain a better timbre. Furthermore, the length of a rearward sound wave guiding distance can be extended, allowing the sound wave to have the effect of extending toward a low frequency compass. In addition, the rearward sound wave is allowed to compress to increase a vibration unit pushing force, thereby obtaining a better sound effect.
    Type: Application
    Filed: June 28, 2011
    Publication date: January 3, 2013
    Inventor: TSUNG-CHENG KUO
  • Publication number: 20080169150
    Abstract: A reflection-type sound box comprises a box body and a loudspeaker. The box body comprises an upper shell, a lower shell for correspondingly coupling with the upper shell, and a sound chamber defined by the upper shell and the lower shell jointly. The sound chamber has a reflection duct extending inward from the upper shell and a sound cup extending inward from the lower shell. The sound cup is located to cover the outside of the reflection duct, and the sound cup and the reflection duct are spaced by a predetermined distance. The loudspeaker has an outward expanded opening and the loudspeaker is mounted in the box body for generating the sounds. The upper shell can be coupled with the lower shell easily by convex/concave engagement between the sound cup and the reflection duct. Accordingly, the reflection-type sound box has space-saving, small-noise, high-efficiency, and low-cost advantages.
    Type: Application
    Filed: January 12, 2007
    Publication date: July 17, 2008
    Inventor: Tsung-Cheng Kuo
  • Publication number: 20080168894
    Abstract: A multimedia keyboard structure comprises a keyboard main body, a control circuit, an audio input device, and several audio output devices. The keyboard main body comprises a shell, a bracket engaged with the shell correspondingly, and several independent sound chambers defined by the shell and the bracket jointly. The control circuit is held in the keyboard main body. The control circuit comprises several high-pass filters, several low-pass filters, and several power amplifiers. The audio input device is held in the keyboard main body, and electrically connected with the control circuit for receiving the sounds. The audio output devices are held in the sound chambers, and electrically connected with the control circuit. Because the control circuit drives the audio output devices and the sound chambers provides the resonance effect, the present invention can provide the advantages of improving space efficiency, integrating lines, and increasing tone quality and efficiency of speakers.
    Type: Application
    Filed: January 12, 2007
    Publication date: July 17, 2008
    Inventor: Tsung-Cheng Kuo