Abstract: A package structure includes a thermal dissipation structure including a substrate, a first encapsulant laterally covering the substrate, a die disposed on the substrate and including a sensing region, a second encapsulant laterally covering the die, and a redistribution structure disposed on the die and the second encapsulant. An outer sidewall of the second encapsulant is laterally offset from an outer sidewall of the first encapsulant. The die is electrically coupled to the substrate through the redistribution structure, and the redistribution structure includes a hollow region overlying the sensing region of the die.

Abstract: A semiconductor structure includes a first device and a second device. The first device includes: a first gate structure formed over an active region and a first air spacer disposed adjacent to the first gate structure. The second device includes: a second gate structure formed over an isolation structure and a second air spacer disposed adjacent to the second gate structure. The first air spacer and the second air spacer have different sizes.

Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: A resin composition and uses thereof are provided. The resin composition includes: (A) an epoxy resin; (B) a bismaleimide resin; and (C) a first flame retardant having a structure of formula (I): Wherein Ar is a C3 to C18 heteroaryl or a C6 to C18 aryl; R1 is H or a C1 to C18 alkyl; and R2 and R3 are independently H, a C1 to C18 alkyl, a C3 to C18 heteroaryl, or a C6 to C18 aryl.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A pivoting assembly with a positioning function includes a base and a casing assembled with the base. The base is provided with curved elastic arms and two fixing supports. Each fixing support has a pivotal hole. One surface of the casing is formed with a curved portion for allowing the curved elastic arm to abut against and two holes for allowing the fixing support to pass through. The other surface of the casing is formed with a protrusion pivotally connected to the pivotal hole. When the curved portion slides on the curved elastic arm, elastic abutment between the curved portion and the curved elastic arm makes the casing to be positioned by friction fit with respect to the base.

Abstract: A pivoting assembly with a positioning function includes a base and a casing assembled with the base. The base is provided with curved elastic arms and two fixing supports. Each fixing support has a pivotal hole. One surface of the casing is formed with a curved portion for allowing the curved elastic arm to abut against and two holes for allowing the fixing support to pass through. The other surface of the casing is formed with a protrusion pivotally connected to the pivotal hole. When the curved portion slides on the curved elastic arm, elastic abutment between the curved portion and the curved elastic arm makes the casing to be positioned by friction fit with respect to the base. By this structure, the present invention can be positioned without a positioning pin or bolt. Further, the present invention is simple in structure, easy to assemble and low in production cost.

Abstract: The invention provides an assembly structure of a back light module having two horizontal frames, two vertical frames and an optical plate. At both ends of each horizontal frame and vertical frame is equipped noncircular holes and pillars, and a plurality of chutes is equipped on the corresponding surfaces of the two horizontal frames to intervene each other for assembling the two horizontal frames and the two vertical frames to a complete frame. The two sides of the optical plate are formed the fixed supports that have a slant corresponding to the chute for installing the optical plate into the complete frame, and the fixed support is embedded into the chute of the horizontal frame. In accordance with the design of embedded structure, the invention can achieve effects of easy assembly, firm structure, low cost and easy disassembling.