Abstract: A semiconductor device includes an epitaxial substrate. The epitaxial substrate includes a substrate. A strain relaxed layer covers and contacts the substrate. A III-V compound stacked layer covers and contacts the strain relaxed layer. The III-V compound stacked layer is a multilayer epitaxial structure formed by aluminum nitride, aluminum gallium nitride or a combination of aluminum nitride and aluminum gallium nitride.

Abstract: A media docking device includes an input module, an output module and a processing module. The input module is electrically connected to a media source device for receiving media data. The output module is electrically connected to a media play device. The processing module determines if an instruction is received from the media source device or a remote device. If the instruction is not received, the processing module transfers the media data to the output module to transmit to the media play device. If the instruction is received, the processing module limits a transmission of the media data according to the instruction, such that the media data will not be completely played by the media play device.

Abstract: A media docking device includes an input circuit, an output circuit and a processing circuit. The input circuit is electrically connected to a media source device for receiving media data. The output circuit is electrically connected to a media play device. The processing circuit is electrically connected to the input circuit and the output circuit. The processing circuit determines if a verification procedure is passed. If the verification procedure is passed, the processing circuit transfers the media data to the media play device. If the verification procedure is not passed, the processing circuit limits a transmission of the media data, such that the media data will not be completely played by the media play device.

Abstract: The present disclosure is directed to a semiconductor device. The semiconductor device includes a substrate, an insulating layer disposed on the substrate, a first conductive feature disposed in the insulating layer, and a capacitor structure disposed on the insulating layer. The capacitor structure includes a first electrode, a first dielectric layer, a second electrode, a second dielectric layer, and a third electrode sequentially stacked. The semiconductor device also includes a first via connected to the first electrode and the third electrode, a second via connected to the second electrode, and a third via connected to the first conductive feature. A part of the first via is disposed in the insulating layer. A portion of the first conductive feature is directly under the capacitor structure.

Abstract: A method of manufacturing a semiconductor device includes: receiving a workpiece on which the semiconductor device is manufactured; causing a nozzle to dispense a fluid toward a surface of the workpiece external to the nozzle, wherein the nozzle includes a first channel and a second channel that allow the fluid to flow through; emitting light, by a light source, from within the nozzle toward the surface while the nozzle is dispensing the fluid; receiving light reflected from the surface by a light sensor, the light source and the light sensor being disposed within the nozzle and opposite to each other, and the emitted light and the reflected light adapted to be contained within the fluid; and examining a status of the reflected light. The emitted light and the reflected light propagate in a direction parallel to a longitudinal axis of each of the first channel and the second channel.

Abstract: A method of monitoring a fluid includes: applying the fluid from within a nozzle to a surface of a wafer outside of the nozzle; emitting light, by a light source, from the nozzle to the surface; receiving light reflected from the surface by a light sensor and causing the reflected light to propagate into the nozzle; and determining whether a variation of the fluid occurs according to the reflected light.

Abstract: The present invention discloses a three-dimensional cell spheroid with high proliferation activity, and the cell spheroid is obtained by ejecting a cell aggregate through a needle with a needle gauge of less than 30G. The present invention further provides the producing method and the use for the cell spheroid.

Abstract: A method of performing mass spectrometric analyses, comprises: (a) passing a stream of ions through a quadrupole mass analyzer; (b) intercepting a flux of ions emitted from an exit aperture of the quadrupole mass analyzer at a front face of a stack of multichannel plates and emitting a flux of electrons in response to the intercepted flux of ions at a rear face of the stack of multichannel plates; (c) intercepting the flux of electrons at a front surface of a scintillator comprising a phosphorescent material and emitting a flux of photons in response to the intercepted flux of ions at a rear surface of the scintillator; (d) receiving the flux of photons at a photo-imager; and (e) repositioning at least one of the scintillator and the stack of microchannel plates during the execution of one or more of the steps (a) through (d).

Abstract: A case body with a double-toggle lockset, which includes a first case and a second case which are pivoted on each other. The main feature is that a double-toggle lockset is provided on the lift side of the second case, which includes a casing holder, a core, two pull parts and two linked buckle components, wherein the distance between the toggles of the two pull parts is in the range which allows a normal adult to pull the toggles with one hand. When the locking component of core is in release mode, the user can pull the toggles of the two pull parts to drive the two linked buckle components, so that the buckle parts are released from the locating hooks of the first case, the first and second cases can be opened.

Abstract: The invention provides a circuit pin positioning structure, a fabrication method of soldered circuit elements and a method of forming circuit pins of a stacked package, applicable to a semiconductor package structure. A positioning rack and a plurality of conductor elements are used. A plurality of positioning holes are provided on a bottom surface of the positioning rack to form a conductor positioning area, and an operational portion is formed on an opposing surface away from the conductor positioning area, for being mounted with pick and place equipment. The conductor elements are positioned in the positioning holes. When the pick and place equipment loads and moves the positioning rack to preformed circuit contacts of the stacked package, the conductor elements are soldered to the preformed circuit contacts and then the positioning rack is removed.

Abstract: A method of monitoring a fluid includes: applying the fluid from within a nozzle to a surface of a wafer outside of the nozzle; emitting light, by a light source, from the nozzle to the surface; receiving light reflected from the surface by a light sensor and causing the reflected light to propagate into the nozzle; and determining whether a variation of the fluid occurs according to the reflected light.

Abstract: A method of performing mass spectrometric analyses, comprises: (a) passing a stream of ions through a quadrupole mass analyzer; (b) intercepting a flux of ions emitted from an exit aperture of the quadrupole mass analyzer at a front face of a stack of multichannel plates and emitting a flux of electrons in response to the intercepted flux of ions at a rear face of the stack of multichannel plates; (c) intercepting the flux of electrons at a front surface of a scintillator comprising a phosphorescent material and emitting a flux of photons in response to the intercepted flux of ions at a rear surface of the scintillator; (d) receiving the flux of photons at a photo-imager; and (e) repositioning at least one of the scintillator and the stack of microchannel plates during the execution of one or more of the steps (a) through (d).

Abstract: A nozzle for emitting a fluid comprises a channel, a light source and a light sensor. The channel is configured to flow the fluid. The light source is configured to emit light towards a surface on which the fluid is applied and the light sensor is configured to receive reflected light from the surface.

Abstract: An ion detection system comprises: a stack of microchannel plates comprising a front face and a rear face, the stack disposed so as to receive, at the front face, a flux of ions from an exit aperture of a quadrupole and to emit, at the rear face, a flux of electrons in response to the received flux of ions; a scintillator having a front and a rear surface and disposed so as to receive the flux of electrons at the front surface and to emit, at the rear surface, a flux of photons in response to the received flux of electrons; a photo-imager configured to receive the flux of photons; a power supply; and first, second and third electrodes coupled to the power supply and disposed at the front face, rear face and first surface, respectively, wherein the scintillator comprises a single crystal plate of a phosphorescent material.

Abstract: A luggage board structure as an improvement to the conventional luggage boards molded in the form of a solid shell and made of a single type of sheet material, which require molding of wheel bases, handle guide bases and other complicated members. The luggage board structure is mainly comprised of a plastic wheel base part, a plastic top and a middle curved surface, wherein the plastic wheel base part has a pair of integrated wheel bases, the plastic top includes an integrated mounting base of handle and the middle curved surface consists of an upper joining edge at the top connecting to the lower joining edge of the plastic top for fixation and a lower joining edge at the bottom connecting to the upper joining edge of the plastic wheel base part for fixation.

Abstract: A connector assembly includes a receptor connector and a cable end connector. The receptor connector has a receptor terminal set, a receptor connector body, a slot set and a guide slot set. The cable end connector has a cable end terminal set, a cable end connector body, a block set and a guide block set. The invention allows the cable end connector body to be connected with the receptor connector body by means of the guide slot set and the guide block set, and also allows the receptor terminal set to be plugged with the cable end terminal set by means of the slot set and the block set. Thereby, the receptor connector and the cable end connector of the invention can be easily connected.

Abstract: The invention provides a circuit pin positioning structure, a fabrication method of soldered circuit elements and a method of forming circuit pins of a stacked package, applicable to a semiconductor package structure. A positioning rack and a plurality of conductor elements are used. A plurality of positioning holes are provided on a bottom surface of the positioning rack to form a conductor positioning area, and an operational portion is formed on an opposing surface away from the conductor positioning area, for being mounted with pick and place equipment. The conductor elements are positioned in the positioning holes. When the pick and place equipment loads and moves the positioning rack to preformed circuit contacts of the stacked package, the conductor elements are soldered to the preformed circuit contacts and then the positioning rack is removed.

Abstract: An ion funnel device is disclosed. A first pair of electrodes is positioned in a first direction. A second pair of electrodes is positioned in a second direction. The device includes an RF voltage source and a DC voltage source. A RF voltage with a superimposed DC voltage gradient is applied to the first pair of electrodes, and a DC voltage gradient is applied to the second pair of electrodes.