Abstract: A semiconductor device and its manufacturing method are disclosed. The nitrogen flow is gradually changed to form a semiconductor device with a gate or a source/drain having a nitrified gradient layer structure. Different extents of nitrification inside the nitrified gradient layer structure provide protection and buffering to prevent the undercut after etching due to different materials in the multilayer structure or the interface effect.

Abstract: A thin film transistor source/drain structure and the manufacturing method thereof are disclosed. The thin film transistor source/drain structure uses a sandwich structure to reduce the resistivity of the source/drain and upgrade the reliability. The sandwich structure preferably comprises a structure of AlNdN alloy/AlNd alloy/AlNdN alloy. The AlNdN alloy is used as a buffer layer or a diffusion barrier to prevent the AlNd alloy and an amorphous silicon layer from diffusing into each other. The other AlNdN alloy is used as a glue layer and to protect the AlNd alloy from being over-etched. The other AlNdN alloy can also prevent the AlNd alloy and the following formed ITO from contact and interaction.

Abstract: A semiconductor device and its manufacturing method are disclosed. The nitrogen flow is gradually changed to form a semiconductor device with a gate or a source/drain having a nitrified gradient layer structure. Different extents of nitrification inside the nitrified gradient layer structure provide protection and buffering to prevent the undercut after etching due to different materials in the multilayer structure or the interface effect.

Abstract: A semiconductor device and its manufacturing method are disclosed. The nitrogen flow is gradually changed to form a semiconductor device with a gate or a source/drain having a nitrified gradient layer structure. Different extents of nitrification inside the nitrified gradient layer structure provide protection and buffering to prevent the undercut after etching due to different materials in the multilayer structure or the interface effect.

Abstract: A sputtering process of indium tin oxide (ITO) is provided. The sputtering process includes the following steps. First, a substrate is moved into a reaction chamber, wherein an ITO target is disposed inside the reaction chamber. Then, a plasma gas and a reaction gas are provided into the reaction chamber to form an ITO layer on the substrate. The reaction gas comprises at least hydrogen having a volume ratio of 1%˜4% based on the total gas volume in the reaction chamber. Furthermore, a method of forming an indium tin oxide layer is also provided.

Abstract: Material of pixel electrode in thin film transistor (TFT) liquid crystal display (LCD) device is used as source/drain electrodes to combine step of pixel electrode formation and step of source/drain electrodes formation, and a silicide layer is between the source/drain electrodes and a semiconductor layer of the TFT to block light. Lithographic processes are therefore reduced from five times to four times.

Abstract: A thin film transistor source/drain structure and the manufacturing method thereof are disclosed. The thin film transistor source/drain structure uses a sandwich structure to reduce the resistivity of the source/drain and upgrade the reliability. The sandwich structure preferably comprises a structure of AlNdN alloy/AlNd alloy/AlNdN alloy. The AlNdN alloy is used as a buffer layer or a diffusion barrier to prevent the AlNd alloy and an amorphous silicon layer from diffusing into each other. The other AlNdN alloy is used as a glue layer and to protect the AlNd alloy from being over-etched. The other AlNdN alloy can also prevent the AlNd alloy and the following formed ITO from contact and interaction.