Patents by Inventor Tsung Chi Lee
Tsung Chi Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240102860Abstract: An apparatus includes a six-axis correction stage, an auto-collimation measurement device, a light splitter, a telecentric image measurement device, and a controller. The six-axis correction stage carries a device under test; the auto-collimation measurement device is arranged above the six-axis correction stage along a measurement optical axis; the light splitter is arranged on the measurement optical axis and is interposed between the six-axis correction stage and the auto-collimation measurement device. A method controls the six-axis correction stage to correct rotation errors in at least two degrees of freedom of the device under test according to a measurement result of the auto-collimation measurement device, and controls the six-axis correction stage to correct translation and yaw errors in at least three degrees of freedom of the device under test according to a measurement result of the telecentric image measurement device by means of the controller.Type: ApplicationFiled: September 5, 2023Publication date: March 28, 2024Inventors: Cheng Chih HSIEH, Tien Chi WU, Ming-Long LEE, Yu-Hsuan LIN, Tsung-I LIN, Chien-Hao MA
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Publication number: 20240105631Abstract: Embodiments provide a method of performing a carrier switch for a device wafer, attaching a second wafer and removing a first wafer. A buffer layer is deposited over the device wafer, buffer layer reducing the topography of the surface of the device wafer. After the carrier switch a film-on-wire layer is removed from the buffer layer and then the buffer layer is at least in part removed.Type: ApplicationFiled: January 10, 2023Publication date: March 28, 2024Inventors: Jeng-An Wang, Sheng-Chi Lin, Hao-Cheng Hou, Tsung-Ding Wang, Chien-Hsun Lee
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Publication number: 20240071999Abstract: A first polymer layer is formed across a package region and a test region. A first metal pattern is formed in the package region and a first test pattern is simultaneously formed in the test region. The first metal pattern has an upper portion located on the first polymer layer and a lower portion penetrating through the first polymer layer, and the first test pattern is located on the first polymer layer and has a first opening exposing the first polymer layer. A second polymer layer is formed on the first metal pattern in the package region and a second test pattern is simultaneously formed on the first test pattern in the test region. The second polymer layer has a second opening exposing the upper portion of the first metal pattern, and the second test pattern has a third opening greater than the first opening of the first test pattern.Type: ApplicationFiled: August 24, 2022Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tseng Hsing Lin, Chien-Hsun Lee, Tsung-Ding Wang, Jung-Wei Cheng, Hao-Cheng Hou, Sheng-Chi Lin, Jeng-An Wang, Yao-Cheng Wu
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Patent number: 9028102Abstract: A luminaire includes a base, a light-emitting unit, and a lamp cover. The base includes a first tube part, a second tube part having an inner diameter smaller than that of the first tube part, and a joint part connected between the first and second tube parts. An inner flow path is defined by at least the first tube part, the joint part, and the second tube part in a coaxial manner. The lamp cover is fixed on the base for covering the light-emitting unit. As such, air heated by the light-emitting unit flows out of the inner flow path to thereby allow cold air to be sucked into the inner flow path.Type: GrantFiled: November 15, 2011Date of Patent: May 12, 2015Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.Inventors: Po-Wei Li, Tsung-Chi Lee, Shih-Chang Hsu, Chin-Yin Yu
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Patent number: 9030084Abstract: A light source device of a backlight module includes a back frame unit and a light-emitting diode (LED) package structure. The back frame unit includes a thermal conductive base plate, and a casing part having a first plate spaced apart from and parallel to the base plate. The LED package structure is disposed between the base and first plates, and includes a package body having a light-emitting surface, and two lateral surfaces respectively facing the base plate and the first plate. A lead frame unit includes a lead frame partially exposed from the lateral surfaces of the package body to form first and second heat-conducting paths with the base and first plates, respectively.Type: GrantFiled: July 26, 2011Date of Patent: May 12, 2015Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.Inventor: Tsung-Chi Lee
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Patent number: 9018648Abstract: The present invention relates to a package structure for light-emitting diodes (LEDs). The package structure includes a substrate, a heat-dissipating structure disposed on the substrate, and a plurality of LED chips uniformly disposed on the heat-dissipating structure. The heat-dissipating structure has a central portion and at least one peripheral portion surrounding thereof. The central portion is capable of dissipating more heat than the peripheral portion. Thus, the temperature difference between the LED chips disposed on the central portion and the LED chips disposed on the peripheral portion can be reduced.Type: GrantFiled: June 22, 2012Date of Patent: April 28, 2015Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology CorporationInventors: Kuo-Ming Chiu, Tsung-Chi Lee, Chia-Hao Wu, Meng-Sung Chou
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Patent number: 8801238Abstract: A light-emitting device includes a light-emitting element and a heat-conducting and electrically-insulating element. The light-emitting element includes at least one first conductive frame having at least one first electrically-conducting portion and at least one heat-dissipating portion, at least one second conductive frame adjacent to the first conductive frame and having at least one second electrically-conducting portion, a casing enclosing the first conductive frame and the second conductive frame, and at least one light-emitting chip disposed on the first conductive frame. The heat-conducting and electrically-insulating element includes a heat-conducting and electrically-insulating layer disposed on the heat-dissipating portion for insulating an electrical current from the heat-dissipating portion.Type: GrantFiled: June 12, 2012Date of Patent: August 12, 2014Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology CorporationInventors: Shih-Chang Hsu, Tsung-Chi Lee, Po-Wei Li
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Patent number: 8696168Abstract: An illumination device having enhanced thermal dissipating capacity is provided. The illumination device includes a heat sink, an LED module, a cover, an LED driver, and a lamp base. The LED module is disposed at one end of the heat sink. The cover covers the LED module. The LED driver is in connection with the LED module, and includes a circuit board and at least one electrical contact member disposed on the circuit board. The lamp base is connected to the other end of the heat sink, and comprises an insulating unit, a first electrode, a second electrode and at least one contact port. The contact port is arranged on the lateral interior of the insulating unit, so that the electrical contact member of the LED driver may establish electrical connection with the lamp base.Type: GrantFiled: April 16, 2012Date of Patent: April 15, 2014Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology CorporationInventors: Po-Wei Li, Tsung-Chi Lee, Shih-Chang Hsu, Chin Yin Yu
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Patent number: 8665597Abstract: A tube includes a tube body and a heat-dissipating member. A light-emitting module and a first electronic component connected electrically to the light-emitting module are disposed in the tube body. At least one opening is formed on the tube body in correspondence to the first electronic component. The heat-dissipating member is placed over the opening. The heat-dissipating member provides a first heat-dissipating path for the first electronic component.Type: GrantFiled: April 20, 2012Date of Patent: March 4, 2014Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology CorporationInventor: Tsung-Chi Lee
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Patent number: 8556465Abstract: An illumination lamp comprises a lamp body, a light-emitting module, a power supply module, and a circuit module. The lamp body defines an inner space. The partitioning unit is disposed in the lamp body for dividing the inner space into a first space for receiving the power supply module, and a second space for receiving the circuit module. Due to the presence of the partitioning unit, thermal convection between the first and second spaces is prevented to reduce adverse influence of a high temperature of the circuit module on the power supply module.Type: GrantFiled: February 1, 2012Date of Patent: October 15, 2013Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.Inventors: Tsung-Chi Lee, Po-Wei Li, Shih-Chang Hsu, Chin-Yin Yu
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Publication number: 20130234177Abstract: The present invention relates to a package structure for light-emitting diodes (LEDs). The package structure includes a substrate, a heat-dissipating structure disposed on the substrate, and a plurality of LED chips uniformly disposed on the heat-dissipating structure. The heat-dissipating structure has a central portion and at least one peripheral portion surrounding thereof. The central portion is capable of dissipating more heat than the peripheral portion. Thus, the temperature difference between the LED chips disposed on the central portion and the LED chips disposed on the peripheral portion can be reduced.Type: ApplicationFiled: June 22, 2012Publication date: September 12, 2013Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventors: KUO-MING CHIU, TSUNG-CHI LEE, CHIA-HAO WU, MENG-SUNG CHOU
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Patent number: 8491156Abstract: A lighting device includes a light source module and a housing mated to a heat sink and covered by a cover. The housing has a first shell portion encircled by an inner sidewall of the heat sink. Alternatively, the housing may further has a second shell portion arranged between the first shell portion and the inner sidewall of the heat sink. The respective ends of the first and second shell portions are covered by a first plate portion and a connecting portion. A cavity is defined by the first shell portion and the first plate portion for accommodating the light source module. A plurality of first thru-holes, second thru holes, third thru holes, fourth thru-holes, and fifth thru holes are formed on the circuit board, the connecting portion, the cover, the first shell portion, and the first plate portion, respectively.Type: GrantFiled: October 22, 2011Date of Patent: July 23, 2013Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology CorporationInventors: Tsung-Chi Lee, Shih-Chang Hsu
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Publication number: 20130163247Abstract: A lamp includes a lighting module and a lamp base. The lamp base includes a base unit. The base unit includes a first base element and a second base element. The first base element includes a plurality of first channels. The second base element includes a plurality of second channels that are in fluid communication with the second channels, respectively. The thermal conductivity of the second base element is lower than that of the first base element. The lighting module is disposed on the first base element. During operation of the lighting module, an airflow between the first channels and the second channels is accelerated for improving heat-dissipating efficiency due to a pressure difference caused by temperature difference between the first and second base elements.Type: ApplicationFiled: June 29, 2012Publication date: June 27, 2013Applicants: LITE-ON TECHNOLOGY CORP., SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventor: TSUNG-CHI LEE
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Publication number: 20130088870Abstract: A light-emitting device includes a light-emitting element and a heat-conducting and electrically-insulating element. The light-emitting element includes at least one first conductive frame having at least one first electrically-conducting portion and at least one heat-dissipating portion, at least one second conductive frame adjacent to the first conductive frame and having at least one second electrically-conducting portion, a casing enclosing the first conductive frame and the second conductive frame, and at least one light-emitting chip disposed on the first conductive frame. The heat-conducting and electrically-insulating element includes a heat-conducting and electrically-insulating layer disposed on the heat-dissipating portion for insulating an electrical current from the heat-dissipating portion.Type: ApplicationFiled: June 12, 2012Publication date: April 11, 2013Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventors: SHIH-CHANG HSU, TSUNG-CHI LEE, PO-WEI LI
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Publication number: 20120300409Abstract: A tube includes a tube body and a heat-dissipating member. A light-emitting module and a first electronic component connected electrically to the light-emitting module are disposed in the tube body. At least one opening is formed on the tube body in correspondence to the first electronic component. The heat-dissipating member is placed over the opening. The heat-dissipating member provides a first heat-dissipating path for the first electronic component.Type: ApplicationFiled: April 20, 2012Publication date: November 29, 2012Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventor: TSUNG-CHI LEE
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Publication number: 20120275170Abstract: An illumination device having enhanced thermal dissipating capacity is provided. The illumination device includes a heat sink, an LED module, a cover, an LED driver, and a lamp base. The LED module is disposed at one end of the heat sink. The cover covers the LED module. The LED driver is in connection with the LED module, and includes a circuit board and at least one electrical contact member disposed on the circuit board. The lamp base is connected to the other end of the heat sink, and comprises an insulating unit, a first electrode, a second electrode and at least one contact port. The contact port is arranged on the lateral interior of the insulating unit, so that the electrical contact member of the LED driver may establish electrical connection with the lamp base.Type: ApplicationFiled: April 16, 2012Publication date: November 1, 2012Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventors: PO-WEI LI, TSUNG-CHI LEE, SHIH-CHANG HSU, CHIN YIN YU
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Publication number: 20120230026Abstract: A luminaire includes a base, a light-emitting unit, and a lamp cover. The base includes a first tube part, a second tube part having an inner diameter smaller than that of the first tube part, and a joint part connected between the first and second tube parts. An inner flow path is defined by at least the first tube part, the joint part, and the second tube part in a coaxial manner. The lamp cover is fixed on the base for covering the light-emitting unit. As such, air heated by the light-emitting unit flows out of the inner flow path to thereby allow cold air to be sucked into the inner flow path.Type: ApplicationFiled: November 15, 2011Publication date: September 13, 2012Applicants: LITE-ON TECHNOLOGY CORP., SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventors: PO-WEI LI, TSUNG-CHI LEE, SHIH-CHANG HSU, CHIN-YIN YU
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Publication number: 20120224360Abstract: An illumination lamp comprises a lamp body, a light-emitting module, a power supply module, and a circuit module. The lamp body defines an inner space. The partitioning unit is disposed in the lamp body for dividing the inner space into a first space for receiving the power supply module, and a second space for receiving the circuit module. Due to the presence of the partitioning unit, thermal convection between the first and second spaces is prevented to reduce adverse influence of a high temperature of the circuit module on the power supply module.Type: ApplicationFiled: February 1, 2012Publication date: September 6, 2012Applicants: LITE-ON TECHNOLOGY CORP., SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventors: TSUNG-CHI LEE, PO-WEI LI, SHIH-CHANG HSU, CHIN-YIN YU
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Publication number: 20120182736Abstract: A lighting device includes a light source module and a housing mated to a heat sink and covered by a cover. The housing has a first shell portion encircled by an inner sidewall of the heat sink. Alternatively, the housing may further has a second shell portion arranged between the first shell portion and the inner sidewall of the heat sink. The respective ends of the first and second shell portions are covered by a first plate portion and a connecting portion. A cavity is defined by the first shell portion and the first plate portion for accommodating the light source module. A plurality of first thru-holes, second thru holes, third thru holes, fourth thru-holes, and fifth thru holes are formed on the circuit board, the connecting portion, the cover, the first shell portion, and the first plate portion, respectively.Type: ApplicationFiled: October 22, 2011Publication date: July 19, 2012Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventors: TSUNG-CHI LEE, SHIH-CHANG HSU
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Publication number: 20120139404Abstract: A light source device of a backlight module includes a back frame unit and a light-emitting diode (LED) package structure. The back frame unit includes a thermal conductive base plate, and a casing part having a first plate spaced apart from and parallel to the base plate. The LED package structure is disposed between the base and first plates, and includes a package body having a light-emitting surface, and two lateral surfaces respectively facing the base plate and the first plate. A lead frame unit includes a lead frame partially exposed from the lateral surfaces of the package body to form first and second heat-conducting paths with the base and first plates, respectively.Type: ApplicationFiled: July 26, 2011Publication date: June 7, 2012Applicants: LITE-ON TECHNOLOGY CORP., SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventor: TSUNG-CHI LEE