Patents by Inventor Tsung Chi Lee

Tsung Chi Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9030084
    Abstract: A light source device of a backlight module includes a back frame unit and a light-emitting diode (LED) package structure. The back frame unit includes a thermal conductive base plate, and a casing part having a first plate spaced apart from and parallel to the base plate. The LED package structure is disposed between the base and first plates, and includes a package body having a light-emitting surface, and two lateral surfaces respectively facing the base plate and the first plate. A lead frame unit includes a lead frame partially exposed from the lateral surfaces of the package body to form first and second heat-conducting paths with the base and first plates, respectively.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: May 12, 2015
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.
    Inventor: Tsung-Chi Lee
  • Patent number: 9028102
    Abstract: A luminaire includes a base, a light-emitting unit, and a lamp cover. The base includes a first tube part, a second tube part having an inner diameter smaller than that of the first tube part, and a joint part connected between the first and second tube parts. An inner flow path is defined by at least the first tube part, the joint part, and the second tube part in a coaxial manner. The lamp cover is fixed on the base for covering the light-emitting unit. As such, air heated by the light-emitting unit flows out of the inner flow path to thereby allow cold air to be sucked into the inner flow path.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: May 12, 2015
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.
    Inventors: Po-Wei Li, Tsung-Chi Lee, Shih-Chang Hsu, Chin-Yin Yu
  • Patent number: 9018648
    Abstract: The present invention relates to a package structure for light-emitting diodes (LEDs). The package structure includes a substrate, a heat-dissipating structure disposed on the substrate, and a plurality of LED chips uniformly disposed on the heat-dissipating structure. The heat-dissipating structure has a central portion and at least one peripheral portion surrounding thereof. The central portion is capable of dissipating more heat than the peripheral portion. Thus, the temperature difference between the LED chips disposed on the central portion and the LED chips disposed on the peripheral portion can be reduced.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: April 28, 2015
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corporation
    Inventors: Kuo-Ming Chiu, Tsung-Chi Lee, Chia-Hao Wu, Meng-Sung Chou
  • Patent number: 8801238
    Abstract: A light-emitting device includes a light-emitting element and a heat-conducting and electrically-insulating element. The light-emitting element includes at least one first conductive frame having at least one first electrically-conducting portion and at least one heat-dissipating portion, at least one second conductive frame adjacent to the first conductive frame and having at least one second electrically-conducting portion, a casing enclosing the first conductive frame and the second conductive frame, and at least one light-emitting chip disposed on the first conductive frame. The heat-conducting and electrically-insulating element includes a heat-conducting and electrically-insulating layer disposed on the heat-dissipating portion for insulating an electrical current from the heat-dissipating portion.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: August 12, 2014
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corporation
    Inventors: Shih-Chang Hsu, Tsung-Chi Lee, Po-Wei Li
  • Patent number: 8696168
    Abstract: An illumination device having enhanced thermal dissipating capacity is provided. The illumination device includes a heat sink, an LED module, a cover, an LED driver, and a lamp base. The LED module is disposed at one end of the heat sink. The cover covers the LED module. The LED driver is in connection with the LED module, and includes a circuit board and at least one electrical contact member disposed on the circuit board. The lamp base is connected to the other end of the heat sink, and comprises an insulating unit, a first electrode, a second electrode and at least one contact port. The contact port is arranged on the lateral interior of the insulating unit, so that the electrical contact member of the LED driver may establish electrical connection with the lamp base.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: April 15, 2014
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corporation
    Inventors: Po-Wei Li, Tsung-Chi Lee, Shih-Chang Hsu, Chin Yin Yu
  • Patent number: 8665597
    Abstract: A tube includes a tube body and a heat-dissipating member. A light-emitting module and a first electronic component connected electrically to the light-emitting module are disposed in the tube body. At least one opening is formed on the tube body in correspondence to the first electronic component. The heat-dissipating member is placed over the opening. The heat-dissipating member provides a first heat-dissipating path for the first electronic component.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: March 4, 2014
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corporation
    Inventor: Tsung-Chi Lee
  • Patent number: 8556465
    Abstract: An illumination lamp comprises a lamp body, a light-emitting module, a power supply module, and a circuit module. The lamp body defines an inner space. The partitioning unit is disposed in the lamp body for dividing the inner space into a first space for receiving the power supply module, and a second space for receiving the circuit module. Due to the presence of the partitioning unit, thermal convection between the first and second spaces is prevented to reduce adverse influence of a high temperature of the circuit module on the power supply module.
    Type: Grant
    Filed: February 1, 2012
    Date of Patent: October 15, 2013
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.
    Inventors: Tsung-Chi Lee, Po-Wei Li, Shih-Chang Hsu, Chin-Yin Yu
  • Publication number: 20130234177
    Abstract: The present invention relates to a package structure for light-emitting diodes (LEDs). The package structure includes a substrate, a heat-dissipating structure disposed on the substrate, and a plurality of LED chips uniformly disposed on the heat-dissipating structure. The heat-dissipating structure has a central portion and at least one peripheral portion surrounding thereof. The central portion is capable of dissipating more heat than the peripheral portion. Thus, the temperature difference between the LED chips disposed on the central portion and the LED chips disposed on the peripheral portion can be reduced.
    Type: Application
    Filed: June 22, 2012
    Publication date: September 12, 2013
    Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
    Inventors: KUO-MING CHIU, TSUNG-CHI LEE, CHIA-HAO WU, MENG-SUNG CHOU
  • Patent number: 8491156
    Abstract: A lighting device includes a light source module and a housing mated to a heat sink and covered by a cover. The housing has a first shell portion encircled by an inner sidewall of the heat sink. Alternatively, the housing may further has a second shell portion arranged between the first shell portion and the inner sidewall of the heat sink. The respective ends of the first and second shell portions are covered by a first plate portion and a connecting portion. A cavity is defined by the first shell portion and the first plate portion for accommodating the light source module. A plurality of first thru-holes, second thru holes, third thru holes, fourth thru-holes, and fifth thru holes are formed on the circuit board, the connecting portion, the cover, the first shell portion, and the first plate portion, respectively.
    Type: Grant
    Filed: October 22, 2011
    Date of Patent: July 23, 2013
    Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corporation
    Inventors: Tsung-Chi Lee, Shih-Chang Hsu
  • Publication number: 20130163247
    Abstract: A lamp includes a lighting module and a lamp base. The lamp base includes a base unit. The base unit includes a first base element and a second base element. The first base element includes a plurality of first channels. The second base element includes a plurality of second channels that are in fluid communication with the second channels, respectively. The thermal conductivity of the second base element is lower than that of the first base element. The lighting module is disposed on the first base element. During operation of the lighting module, an airflow between the first channels and the second channels is accelerated for improving heat-dissipating efficiency due to a pressure difference caused by temperature difference between the first and second base elements.
    Type: Application
    Filed: June 29, 2012
    Publication date: June 27, 2013
    Applicants: LITE-ON TECHNOLOGY CORP., SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
    Inventor: TSUNG-CHI LEE
  • Publication number: 20130088870
    Abstract: A light-emitting device includes a light-emitting element and a heat-conducting and electrically-insulating element. The light-emitting element includes at least one first conductive frame having at least one first electrically-conducting portion and at least one heat-dissipating portion, at least one second conductive frame adjacent to the first conductive frame and having at least one second electrically-conducting portion, a casing enclosing the first conductive frame and the second conductive frame, and at least one light-emitting chip disposed on the first conductive frame. The heat-conducting and electrically-insulating element includes a heat-conducting and electrically-insulating layer disposed on the heat-dissipating portion for insulating an electrical current from the heat-dissipating portion.
    Type: Application
    Filed: June 12, 2012
    Publication date: April 11, 2013
    Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
    Inventors: SHIH-CHANG HSU, TSUNG-CHI LEE, PO-WEI LI
  • Publication number: 20120300409
    Abstract: A tube includes a tube body and a heat-dissipating member. A light-emitting module and a first electronic component connected electrically to the light-emitting module are disposed in the tube body. At least one opening is formed on the tube body in correspondence to the first electronic component. The heat-dissipating member is placed over the opening. The heat-dissipating member provides a first heat-dissipating path for the first electronic component.
    Type: Application
    Filed: April 20, 2012
    Publication date: November 29, 2012
    Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
    Inventor: TSUNG-CHI LEE
  • Publication number: 20120275170
    Abstract: An illumination device having enhanced thermal dissipating capacity is provided. The illumination device includes a heat sink, an LED module, a cover, an LED driver, and a lamp base. The LED module is disposed at one end of the heat sink. The cover covers the LED module. The LED driver is in connection with the LED module, and includes a circuit board and at least one electrical contact member disposed on the circuit board. The lamp base is connected to the other end of the heat sink, and comprises an insulating unit, a first electrode, a second electrode and at least one contact port. The contact port is arranged on the lateral interior of the insulating unit, so that the electrical contact member of the LED driver may establish electrical connection with the lamp base.
    Type: Application
    Filed: April 16, 2012
    Publication date: November 1, 2012
    Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
    Inventors: PO-WEI LI, TSUNG-CHI LEE, SHIH-CHANG HSU, CHIN YIN YU
  • Publication number: 20120230026
    Abstract: A luminaire includes a base, a light-emitting unit, and a lamp cover. The base includes a first tube part, a second tube part having an inner diameter smaller than that of the first tube part, and a joint part connected between the first and second tube parts. An inner flow path is defined by at least the first tube part, the joint part, and the second tube part in a coaxial manner. The lamp cover is fixed on the base for covering the light-emitting unit. As such, air heated by the light-emitting unit flows out of the inner flow path to thereby allow cold air to be sucked into the inner flow path.
    Type: Application
    Filed: November 15, 2011
    Publication date: September 13, 2012
    Applicants: LITE-ON TECHNOLOGY CORP., SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
    Inventors: PO-WEI LI, TSUNG-CHI LEE, SHIH-CHANG HSU, CHIN-YIN YU
  • Publication number: 20120224360
    Abstract: An illumination lamp comprises a lamp body, a light-emitting module, a power supply module, and a circuit module. The lamp body defines an inner space. The partitioning unit is disposed in the lamp body for dividing the inner space into a first space for receiving the power supply module, and a second space for receiving the circuit module. Due to the presence of the partitioning unit, thermal convection between the first and second spaces is prevented to reduce adverse influence of a high temperature of the circuit module on the power supply module.
    Type: Application
    Filed: February 1, 2012
    Publication date: September 6, 2012
    Applicants: LITE-ON TECHNOLOGY CORP., SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
    Inventors: TSUNG-CHI LEE, PO-WEI LI, SHIH-CHANG HSU, CHIN-YIN YU
  • Publication number: 20120182736
    Abstract: A lighting device includes a light source module and a housing mated to a heat sink and covered by a cover. The housing has a first shell portion encircled by an inner sidewall of the heat sink. Alternatively, the housing may further has a second shell portion arranged between the first shell portion and the inner sidewall of the heat sink. The respective ends of the first and second shell portions are covered by a first plate portion and a connecting portion. A cavity is defined by the first shell portion and the first plate portion for accommodating the light source module. A plurality of first thru-holes, second thru holes, third thru holes, fourth thru-holes, and fifth thru holes are formed on the circuit board, the connecting portion, the cover, the first shell portion, and the first plate portion, respectively.
    Type: Application
    Filed: October 22, 2011
    Publication date: July 19, 2012
    Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
    Inventors: TSUNG-CHI LEE, SHIH-CHANG HSU
  • Publication number: 20120139404
    Abstract: A light source device of a backlight module includes a back frame unit and a light-emitting diode (LED) package structure. The back frame unit includes a thermal conductive base plate, and a casing part having a first plate spaced apart from and parallel to the base plate. The LED package structure is disposed between the base and first plates, and includes a package body having a light-emitting surface, and two lateral surfaces respectively facing the base plate and the first plate. A lead frame unit includes a lead frame partially exposed from the lateral surfaces of the package body to form first and second heat-conducting paths with the base and first plates, respectively.
    Type: Application
    Filed: July 26, 2011
    Publication date: June 7, 2012
    Applicants: LITE-ON TECHNOLOGY CORP., SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
    Inventor: TSUNG-CHI LEE
  • Patent number: 5945157
    Abstract: A method of coating a golf club head under vacuum conditions with an open hanger type shot blasting machine includes the steps of forming a blank of golf club head; grinding the blank to form large pores on the surface of the blank; polishing the blank to form a refined blank containing fine pores on the surface thereof; hanging multiple refined blanks on hangers in an opening hanger type shot blasting machine to rotate and move the blanks into a vacuum rear portion of the machine. Meanwhile, shot blasting material containing mixed shot grit and powdered metal coating material is centrifugally thrown with mechanical throwing arms, so that shot grit strikes and forms numerous deeply depressed pores on the refined blanks. The shot grit quickly leaves the surfaces of the refined blanks due to a reactive force produced during impact of the shot grit on the blanks.
    Type: Grant
    Filed: August 12, 1997
    Date of Patent: August 31, 1999
    Inventors: Tsung Chi Lee, Tsai Yi Huang