Abstract: A multi-terminal inductor and method for forming the multi-terminal inductor are provided. In some embodiments, an interconnect structure is arranged over a semiconductor substrate. A passivation layer is arranged over the interconnect structure. A first magnetic layer is arranged over the passivation layer, and a conductive wire laterally extends from a first input/output (I/O) bond structure at a first location to a second I/O bond structure at a second location. A third I/O bond structure branches off of the conductive wire at a third location between the first location and the second location. A connection between the third I/O bond structure and the first I/O bond structure has a first inductance. Alternatively, a connection between the first I/O bond structure and the second I/O bond structure has a second inductance different than the first inductance.

Abstract: A method and apparatus for dosage measurement and monitoring in an ion implantation system is disclosed. In one embodiment, a transferring system, includes: a vacuum chamber, wherein the vacuum chamber is coupled to a processing chamber; a shaft coupled to a ball screw, wherein the ball screw and the shaft are configured in the vacuum chamber; and a vacuum rotary feedthrough, wherein the vacuum rotary feedthrough comprises a magnetic fluid seal so as to provide a high vacuum sealing, and wherein the vacuum rotary feedthrough is configured through a first end of the vacuum chamber and coupled to the ball screw so as to provide a rotary motion on the ball screw.

Abstract: A thermal module and a projector using the same are provided. The thermal module comprises a heat sink and a base. The heat sink comprises a bottom, a plurality of fins, a cover, and a plurality of side walls. The fins are disposed on the bottom, and each of the fins comprises a reference plane and a plurality of protrusions, wherein adjacent two of the protrusions are convex toward opposite directions with respect to the reference plane, and rows of through holes are formed by adjacent two protrusions along a flowing direction. The cover is disposed on the fins. The side walls are disposed between the bottom and the cover and surrounding the fins, wherein a liquid is capable of flowing through the heat sink by entering the inlet and exiting by the outlet of the side walls or the cover. The bottom of the heat sink is disposed on the base.

Abstract: A muscle training equipment configured to train at least one target muscle of human body and including frame, at least one vibration detector, and at least one resistance adjustment assembly. The at least one vibration detector is configured to be disposed on the at least one target muscle so as to produce at least one muscle vibration signal based on the activity of the at least one target muscle. The at least one resistance adjustment assembly includes motor, handle and linkage assembly. The motor is disposed on the frame and has resistance-adjustable shaft. An end of the linkage assembly is fixed to the resistance-adjustable shaft, and another end of the linkage assembly is pivotally connected to the handle. The at least one resistance adjustment assembly is configured to adjust a resistance force applied on the resistance-adjustable shaft according to the at least one muscle vibration signal.

Abstract: A multi-terminal inductor and method for forming the multi-terminal inductor are provided. In some embodiments, an interconnect structure is arranged over a semiconductor substrate. A passivation layer is arranged over the interconnect structure. A first magnetic layer is arranged over the passivation layer, and a conductive wire laterally extends from a first input/output (I/O) bond structure at a first location to a second I/O bond structure at a second location. A third I/O bond structure branches off of the conductive wire at a third location between the first location and the second location. A connection between the third I/O bond structure and the first I/O bond structure has a first inductance. Alternatively, a connection between the first I/O bond structure and the second I/O bond structure has a second inductance different than the first inductance.

Abstract: In an embodiment, a device includes: a die stack over and electrically connected to an interposer, the die stack including a topmost integrated circuit die including: a substrate having a front side and a back side opposite the front side, the front side of the substrate including an active surface; a dummy through substrate via (TSV) extending from the back side of the substrate at least partially into the substrate, the dummy TSV electrically isolated from the active surface; a thermal interface material over the topmost integrated circuit die; and a dummy connector in the thermal interface material, the thermal interface material surrounding the dummy connector, the dummy connector electrically isolated from the active surface of the topmost integrated circuit die.

Abstract: A driving system for moving several optical elements is provided, including a first module and a second module arranged in a first direction. The first module has a first terminal on a first side thereof to electrically connect to an external circuit. The second module has a second terminal on a second side thereof to electrically connect to the external circuit. The first and second sides are adjacent to each other and parallel to the first direction.

Abstract: An optical module is provided, including a movable portion, a fixed portion and a driving assembly. The movable portion is used to hold an optical element having an optical axis. The movable portion is movably connected to the fixed portion. The driving assembly disposed in the fixed portion to drive the movable portion to move along the optical axis relative to the fixed portion. The driving assembly includes a first magnetic element and a second magnetic element. The first magnetic element and the second magnetic element are aligned along the optical axis. The size of the first magnetic element and the size of the second magnetic element along the optical axis are different.

Abstract: An optical member driving mechanism for driving an optical member having an optical axis is provided, including a fixed portion, a movable portion, a first elastic member, and a driving assembly. The movable portion is configured to hold the optical member, and is movably connected the fixed portion via the first elastic member. The driving assembly drives the movable portion to move along the optical axis within a range of motion. The range of motion includes a first limit moving range and a second limit moving range. The first limit moving range is the maximum distance that the movable portion can move toward the light-entering side, and the second limit moving range is the maximum distance that the movable portion can move toward the light-emitting side. When the movable portion is in a predetermined position, the first limit moving range is greater than the second limit moving range.

Abstract: An optical module includes a first side and a second side, and includes a movable portion, a fixed portion, a driving portion, a position-sensing portion, and a circuit board. The movable portion includes a holder for holding an optical element with an optical axis. The fixed portion includes a base and a circuit component, wherein the circuit component has an external electrical connection portion, and the movable portion is movably connected to the fixed portion. The driving portion is configured to drive the movable portion to move relative to the fixed portion. The position-sensing portion includes a position-sensing element, and the position-sensing element is configured to sense the position of the movable portion relative to the fixed portion.

Abstract: A liquid cooled heat dissipation module includes a housing and at least one flow channel. The housing includes a chamber, and the at least one flow channel is located in the chamber. The housing includes an upper plate, a lower plate, and a plurality of annular wall portions. Two ends of each of the annular wall portions are respectively connected to the upper plate and the lower plate. The annular wall portions respectively form a plurality of through-holes between the upper plate and the lower plate, and the through-holes penetrate through the upper plate and the lower plate. The at least one flow channel is located between two adjacent annular wall portions. In addition, a projection device is also provided.

Abstract: A method of visual range mapping includes receiving a plurality of eye detection results from at least one eye tracking device and a display range from a display device, generating a visual range according to the plurality of eye detection results; comparing the visual range with the display range to generate a calibration value, and mapping the visual range into the display range according to the calibration value.

Abstract: A semiconductor device includes a vapor chamber lid for high power applications such as chip-on-wafer-on-substrate (CoWoS) applications using high performance processors (e.g., graphics processing unit (GPU)) and methods of manufacturing the same. The vapor chamber lid provides a thermal solution which enhances the thermal performance of a package with multiple chips. The vapor chamber lid improves hot spot dissipation in high performance chips, for example, at the three-dimensional (3D-IC) packaging level.

Abstract: A visual utility analytic method for an eye tracking system includes dividing each of a plurality of film segments into at least one display area, wherein each of the plurality of film segments corresponds to at least one display target, and the at least one display target respectively corresponds to one of the at least one display area; and comparing the display area corresponding to the at least one display target in the plurality of film segments with a watched area corresponding to each of a plurality of eye tracking detection results to determine a plurality of visual utilities of the at least one display target in the plurality of film segments.

Abstract: A liquid cooled heat dissipation device including a housing, at least two cooling fin modules, an input pipe, and an output pipe is provided. The housing has an accommodation space. The at least two cooling fin modules are disposed in the accommodation space. The input pipe is disposed on the top plate, the front plate, the rear plate, or one of the side plates of the housing and communicates with the accommodation space. The output pipe is disposed on the top plate, the front plate, the rear plate, or the other one of the side plates of the housing and communicates with the accommodation space. The at least two cooling fin modules have different arrangement densities and different fin thicknesses.

Abstract: The invention provides a liquid-cooling device, including a shell, wherein the shell includes a top plate, a bottom plate, a front plate, a rear plate and two opposite side plates, and form an accommodating space. At least one water inlet pipe is disposed on the top plate of the shell and communicates with the accommodating space. At least one water outlet pipe is disposed on the front plate of the shell and communicates with the accommodating space. A plurality of heat-dissipating fins is disposed in the accommodating space. A partition plate is disposed in the accommodating space. The partition plate forms at least two flow passages in the accommodating space.

Abstract: A multi-terminal inductor and method for forming the multi-terminal inductor are provided. In some embodiments, an interconnect structure is arranged over a semiconductor substrate. A passivation layer is arranged over the interconnect structure. A first magnetic layer is arranged over the passivation layer, and a conductive wire laterally extends from a first input/output (I/O) bond structure at a first location to a second I/O bond structure at a second location. A third I/O bond structure branches off of the conductive wire at a third location between the first location and the second location. A connection between the third I/O bond structure and the first I/O bond structure has a first inductance. Alternatively, a connection between the first I/O bond structure and the second I/O bond structure has a second inductance different than the first inductance.

Abstract: In an embodiment, a device includes: a die stack over and electrically connected to an interposer, the die stack including a topmost integrated circuit die including: a substrate having a front side and a back side opposite the front side, the front side of the substrate including an active surface; a dummy through substrate via (TSV) extending from the back side of the substrate at least partially into the substrate, the dummy TSV electrically isolated from the active surface; a thermal interface material over the topmost integrated circuit die; and a dummy connector in the thermal interface material, the thermal interface material surrounding the dummy connector, the dummy connector electrically isolated from the active surface of the topmost integrated circuit die.

Abstract: The present invention provides an integrated circuit suitable for various packaging modes. This integrated circuit includes: a core circuit, a plurality of pads, and a selection circuit. The selection circuit is coupled between the core circuit and the pads for determining the connection state between the core circuit and the pads based on a control signal. When the control signal provides a first value, the core circuit and the pads will be in a first connection state, and the integrated circuit will be applied with a single-die package. However, when the control signal provides a second value, the core circuit and the pads will be in the second connection state, and the integrated circuit will be applied with a multi-die package.

Abstract: The invention relates to a waveform generator and the related method thereof for generating a second image data according to a first image data, wherein the first image data and the second image data correspond to different signal formats. The waveform generator includes: a first memory unit, a second memory unit, and an integrating unit. The first memory unit stores a plurality of scan line patterns. The second memory unit stores at least one first scan line data of the first image data, where each first scan line data corresponds to a scan line. The integrating unit is coupled to the first and the second memory units and generates each second scan line data of the second image data according to the plurality of scan line patterns or each first scan line data of the first image data.