Abstract: A semiconductor device includes an epitaxial substrate. The epitaxial substrate includes a substrate. A strain relaxed layer covers and contacts the substrate. A III-V compound stacked layer covers and contacts the strain relaxed layer. The III-V compound stacked layer is a multilayer epitaxial structure formed by aluminum nitride, aluminum gallium nitride or a combination of aluminum nitride and aluminum gallium nitride.

Abstract: A first polymer layer is formed across a package region and a test region. A first metal pattern is formed in the package region and a first test pattern is simultaneously formed in the test region. The first metal pattern has an upper portion located on the first polymer layer and a lower portion penetrating through the first polymer layer, and the first test pattern is located on the first polymer layer and has a first opening exposing the first polymer layer. A second polymer layer is formed on the first metal pattern in the package region and a second test pattern is simultaneously formed on the first test pattern in the test region. The second polymer layer has a second opening exposing the upper portion of the first metal pattern, and the second test pattern has a third opening greater than the first opening of the first test pattern.

Abstract: A battery packet includes a first electrode, a second electrode, as well as a dielectric layer and an electrolysis material that are disposed between the first and second electrode. The electrolysis material can be NaCl or CF6Li.

Abstract: An air exchange device includes: an air-guiding tube having a first end and a second end opposite to each other, with the first end having a first inlet and a first outlet, and with the second end having a second inlet and a second outlet; a partition arranged inside the air-guiding tube to divide the inside of the air-guiding tube into a first air-guiding space communicating with the first and second inlets and a second air-guiding space communicating with the first and second outlets; a first filter arranged in a position adjacent to the first inlet; a second filter arranged in a position adjacent to the second inlet; and at least one fan adapted to draw and expel air and combined with the air-guiding tube. Bores of meshes of the first filter are larger than bores of meshes of the second filter.

Abstract: A battery packet includes a first electrode, a second electrode, as well as a dielectric layer and an electrolysis material that are disposed between the first and second electrode. The electrolysis material can be NaCl or CF6Li.

Abstract: An air exchange device includes: an air-guiding tube having a first end and a second end opposite to each other, the first end having a first inlet and a first outlet, and the second end having a second inlet and a second outlet; a partition arranged inside the air-guiding tube to divide the inside of the air-guiding tube into a first air-guiding space communicating with the first and second inlets and a second air-guiding space communicating with the first and second outlets; a first filter arranged in a position adjacent to the first inlet; a second filter arranged in a position adjacent to the second inlet; and at least one fan adapted to draw and expel air and combined with the air-guiding tube; wherein bores of meshes of the first filter are larger than bores of meshes of the second filter.

Abstract: An air exchange device includes: an air-guiding tube having a first end and a second end opposite to the first end, the first end having a first inlet and a first outlet, and the second end having a second inlet and a second outlet; a partition settled inside the air-guiding tube and dividing a room inside the air-guiding tube into a first air-guiding space and a second air-guiding space, the first air-guiding space communicating with the first inlet and second outlet, and the second air-guiding space communicating with the first outlet and the second inlet; a fan arranged with the air-guiding tube and adapted to induce an airflow; and a control module connecting with at least one of the first and second ends of the air-guiding tube and electrically connecting with the fan.

Abstract: The present invention relates to an LED illumination apparatus. The apparatus includes a body having a lower portion adapted for coupling to a power socket and an upper portion provided with a power source module accommodating chamber. A heat-dissipating module includes a funnel-shaped hollow case disposed at a top end of the upper portion and filled with a coolant fluid, wherein the hollow case has a small diameter open end adjacent to the body and a large diameter open end remote from the body. A light source module includes amounting substrate disposed at the small diameter open end, an LED mounted on the mounting substrate, and a power source module disposed within the power source module accommodating chamber in a manner electrically connected to and supplying working power to the LED.

Abstract: A method for fabricating light emitting diode packages includes: providing a light emitting diode wafer which has a plurality of light emitting diode chips, each of the light emitting diode chips including a semiconductor unit that has p-type and n-type electrode regions, and two electrodes; forming a light-transmissive insulating layer on the light emitting diode chips; forming a reflective metal layer on a portion of the light-transmissive insulating layer; forming a layer of insulating material on the light-transmissive insulating layer and the reflective metal layer, and performing exposing and developing treatments to form the layer of insulating material into a plurality of protective insulating structures; forming a conductor-receiving insulating layer on the light-transmissive insulating layer and the protective insulating structures; and performing a cutting process to obtain a plurality of light emitting diode packages each having at least one of the light emitting diode chips.

Abstract: The present invention relates to a light-emitting diode die package. The LED die package includes a semiconductor base, at least two electrodes disposed on an electrode mounting surface of the semiconductor base, an insulation layer formed on the electrode-mounting surface and provided with two through holes for exposing the electrodes, a conductor-forming layer formed on the insulation layer and provided with two conductor-mounting holes in communication with the through holes, and conductor units formed within the through holes and the conductor-mounting holes in a manner electrically connected to the corresponding electrodes. The LED die package further includes a covering layer formed on a surface of the LED die opposite to the electrode-mounting surface and extending to an outer surface of the LED die. The covering layer is made of transparent material doped with phosphor powder.

Abstract: A light emitting diode device includes: at least one light emitting diode chip, which includes a semiconductor unit, two electrodes that are disposed on an electrode-mounting surface of the semiconductor unit, a light-transmissive insulating layer that is disposed on the electrode-mounting surface and that has two via holes, a reflective metal layer disposed on a portion of the light-transmissive insulating layer, a protective insulating layer that is disposed on the reflective metal layer, a conductor-receiving insulating layer that has two conductor-receiving holes respectively in communication with the via holes, and two conductor units that are formed respectively in the conductor-receiving holes; and a light-transmissive envelope layer that covers a surface of the light emitting diode chip opposite to the electrode-mounting surface, that extends to cover outer lateral surfaces of the light emitting diode chip, and that is doped with a fluorescence powder.

Abstract: A method for packaging a semiconductor chip includes: providing a semiconductor wafer that has an upper surface and includes a plurality of chip regions, each of the chip regions having a semiconductor unit that includes at least one electrical-connecting pad; forming over the upper surface a photoresist layer, followed by forming a plurality of pad-exposing holes in the photoresist layer; filling a first conductive material in the pad-exposing holes, followed by reflowing; removing the photoresist layer, and forming over the upper surface a protective layer; grinding the protective layer; coating an insulated protective layer on the ground protective layer, and forming a plurality of via holes in the insulated protective layer; filling a second conductive material in the via holes, followed by reflowing; and removing the insulated protective layer.

Abstract: A method for fabricating light emitting diode packages includes: providing a light emitting diode wafer which has a plurality of light emitting diode chips, each of the light emitting diode chips including a semiconductor unit that has p-type and n-type electrode regions, and two electrodes; forming a light-transmissive insulating layer on the light emitting diode chips; forming a reflective metal layer on a portion of the light-transmissive insulating layer; forming a layer of insulating material on the light-transmissive insulating layer and the reflective metal layer, and performing exposing and developing treatments to form the layer of insulating material into a plurality of protective insulating structures; forming a conductor-receiving insulating layer on the light-transmissive insulating layer and the protective insulating structures; and performing a cutting process to obtain a plurality of light emitting diode packages each having at least one of the light emitting diode chips.

Abstract: A light emitting diode device includes: at least one light emitting diode chip, which includes a semiconductor unit, two electrodes that are disposed on an electrode-mounting surface of the semiconductor unit, a light-transmissive insulating layer that is disposed on the electrode-mounting surface and that has two via holes, a reflective metal layer disposed on a portion of the light-transmissive insulating layer, a protective insulating layer that is disposed on the reflective metal layer, a conductor-receiving insulating layer that has two conductor-receiving holes respectively in communication with the via holes, and two conductor units that are formed respectively in the conductor-receiving holes; and a light-transmissive envelope layer that covers a surface of the light emitting diode chip opposite to the electrode-mounting surface, that extends to cover outer lateral surfaces of the light emitting diode chip, and that is doped with a fluorescence powder.

Abstract: The present invention relates to an LED illumination apparatus. The apparatus includes a body having a lower portion adapted for coupling to a power socket and an upper portion provided with a power source module accommodating chamber. A heat-dissipating module includes a funnel-shaped hollow case disposed at a top end of the upper portion and filled with a coolant fluid, wherein the hollow case has a small diameter open end adjacent to the body and a large diameter open end remote from the body. A light source module includes amounting substrate disposed at the small diameter open end, an LED mounted on the mounting substrate, and a power source module disposed within the power source module accommodating chamber in a manner electrically connected to and supplying working power to the LED.

Abstract: The present invention relates to a heat dissipating device adapted for use in combination with a module provided with a mounting board. The heat dissipating device has a metallic heat-dissipating member including a body and a number of spaced-apart heat dissipating fins extending upwardly from the upper surface of the body. The body is formed at its central portion with a through hole adapted for receiving a protrusion block protruding from a back surface of the mounting board of the module opposite to a mounting surface on which electrical devices are mounted. The heat dissipating device further includes a pump unit, a fluid conduit and a fan unit disposed on the heat dissipating fins.

Abstract: The present invention relates to a light-emitting diode die package. The LED die package includes a semiconductor base, at least two electrodes disposed on an electrode mounting surface of the semiconductor base, an insulation layer formed on the electrode-mounting surface and provided with two through holes for exposing the electrodes, a conductor-forming layer formed on the insulation layer and provided with two conductor-mounting holes in communication with the through holes, and conductor units formed within the through holes and the conductor-mounting holes in a manner electrically connected to the corresponding electrodes. The LED die package further includes a covering layer formed on a surface of the LED die opposite to the electrode-mounting surface and extending to an outer surface of the LED die. The covering layer is made of transparent material doped with phosphor powder.