Patents by Inventor Tsung-Chi Wu

Tsung-Chi Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230037117
    Abstract: A method of manufacturing a semiconductor structure is provided. The method includes the following operations: providing a semiconductor substrate; performing a first cutting operation along a first set of cutting lines of the semiconductor substrate; and performing a second cutting operation along a second set of cutting lines of the semiconductor substrate later than performing the first cutting operation, wherein the second set of cutting lines are arranged interlacedly with the first set of cutting lines along a first direction.
    Type: Application
    Filed: July 30, 2021
    Publication date: February 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Bo Hua CHEN, Yan Ting SHEN, Tsung Chi WU, Tai-Hung KUO
  • Publication number: 20070066128
    Abstract: An improved SATA interface is provided by integrating a power line into a standard ATA interface. One end of the power line is connected to the power pin of the PC and the other end is connected to the power pin of the device, so that the device can draw power from the PC. This saves the power supply design in the external devices, simplifies the device wiring and reduces the manufacture cost.
    Type: Application
    Filed: September 21, 2005
    Publication date: March 22, 2007
    Inventors: Tsung-Chi Wu, Peng-Fei Lin