Abstract: A method for manufacturing a printed circuit board with stacked wires and a printed circuit board made by the method are disclosed. In the printed circuit board, each wire layers being formed by pretreatment, coating or laminating photoimageable resist, exposing, developing, etching wires on a substrate; coating an insulating layer on the circuit board; removing the insulating layer upon the wires so as to expose the wires; and then performing PTH process and plating copper for forming another wires. Thereby, line thickness of the printed circuit board is increased and the wires are stacked continuously.

Abstract: The present invention provides an inner layer structure of a circuit board. The inner layer structure of the present invention uses column-shaped or conned-shaped bumps to replace the conventional PTH process, and uses the bumps as media to electrically connect two adjacent patterned conducting layers. Hence, inner layer structure of the present invention can effectively simplify the layout design and the fabrication complexity, and increase the layout density of the circuit board.

Abstract: A method for manufacturing a printed circuit board with stacked wires and a printed circuit board made by the method are disclosed. In the printed circuit board, each wire layers being formed by pretreatment, coating or laminating photoimageable resist, exposing, developing, etching wires on a substrate; coating an insulating layer on the circuit board; removing the insulating layer upon the wires so as to expose the wires; and then performing PTH process and plating copper for forming another wires. Thereby, line thickness of the printed circuit board is increased and the wires are stacked continuously.