Patents by Inventor Tsung-Ching Chen

Tsung-Ching Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240129291
    Abstract: The invention discloses a method to set up a cross-domain DDS-secure network and then use it to transmit various kinds of data. To set up the cross-domain DDS-secure network, we first register IoT and monitor devices on the administration website. Second, we group devices based on our needs and then ask the website to generate configurations and certificates for each device. Finally, we download those files and deploy them to each device. In an extremely case, we can accomplish all operations only through a mobile device. During the system operating, all devices establish the DDS-secure connections to each other, and data will transmit on the network securely.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 18, 2024
    Inventors: Tsung-Che Tsai, Wei-Sheng Chen, Hsi-Ching Lin
  • Publication number: 20240105644
    Abstract: A semiconductor die package includes a high dielectric constant (high-k) dielectric layer over a device region of a first semiconductor die that is bonded with a second semiconductor die in a wafer on wafer (WoW) configuration. A through silicon via (TSV) structure may be formed through the device region. The high-k dielectric layer has an intrinsic negative charge polarity that provides a coupling voltage to modify the electric potential in the device region. In particular, the electron carriers in high-k dielectric layer attracts hole charge carriers in device region, which suppresses trap-assist tunnels that result from surface defects formed during etching of the recess for the TSV structure. Accordingly, the high-k dielectric layer described herein reduces the likelihood of (and/or the magnitude of) current leakage in semiconductor devices that are included in the device region of the first semiconductor die.
    Type: Application
    Filed: January 6, 2023
    Publication date: March 28, 2024
    Inventors: Tsung-Hao YEH, Chien Hung LIU, Hsien Jung CHEN, Hsin Heng WANG, Kuo-Ching HUANG
  • Patent number: 11079611
    Abstract: An optical module for protecting human eyes includes a first support element, first conductive paths, a lens, at least one second conductive path, and a light-emitting element. The first support element has a bottom plate and a sidewall on the bottom plate. The first conductive paths are in the first support element or outside the first support element. Each of the first conductive paths has a first end adjacent to a top surface of the sidewall and a second end adjacent to the bottom plate. The lens is located on the top surface of the sidewall. The second conductive path is electrically connected to the first ends of the first conductive paths. The light-emitting element is located on the bottom plate of the first support element. When a resistance difference is detected through the first and second conductive paths, the light-emitting element is switched off.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: August 3, 2021
    Assignee: Edison Opto Corporation
    Inventor: Tsung-Ching Chen
  • Publication number: 20190278104
    Abstract: An optical module for protecting human eyes includes a first support element, first conductive paths, a lens, at least one second conductive path, and a light-emitting element. The first support element has a bottom plate and a sidewall on the bottom plate. The first conductive paths are in the first support element or outside the first support element. Each of the first conductive paths has a first end adjacent to a top surface of the sidewall and a second end adjacent to the bottom plate. The lens is located on the top surface of the sidewall. The second conductive path is electrically connected to the first ends of the first conductive paths. The light-emitting element is located on the bottom plate of the first support element. When a resistance difference is detected through the first and second conductive paths, the light-emitting element is switched off.
    Type: Application
    Filed: March 6, 2019
    Publication date: September 12, 2019
    Inventor: Tsung-Ching CHEN
  • Publication number: 20120000763
    Abstract: A seawater desalination device includes a seawater reservoir having a bottom wall and adapted for holding seawater, an evaporator adapted for evaporating the seawater held in the seawater reservoir into water vapor, osmosis membrane modules installed in the seawater reservoir and spaced above the bottom wall of the seawater reservoir, each osmosis membrane having membranes for the passing of the water vapor evaporated by the evaporator and a water vapor accumulation chamber surrounded by the membranes and a suction pipe connected to the water vapor accumulation chamber, and a pump unit having a pipe connected to the suction pipe of each osmosis membrane module and adapted for drawing water vapor out of the water vapor accumulation chamber of each osmosis membrane module.
    Type: Application
    Filed: August 13, 2010
    Publication date: January 5, 2012
    Inventors: Chun-Feng Lee, Yu-Yu Lin, Tsung-Ching Chen